CPU Comparison

A

AMD

AMD

AMD Ryzen 9 3900

CORE STATE Matisse

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3.1 Base / 4.3 GHz Turbo

CACHE 64 MB

MAX TDP 65W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2019

VS

i

Intel

INTEL

Core i7-10510U

CORE STATE Comet Lake-U

CORE SPECS 4 Cores / 8 Threads

CLOCK SPEED 1800 Base / 4.9 GHz Turbo

CACHE 8 MB (shared)

MAX TDP 25W

ARCHITECTURE Comet Lake

nm

PROCESS 14 nm

LAUNCH DATE 2019

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,619

552

cinebench_cinebench_r15_singlecore

369

77

cinebench_cinebench_r20_multicore

10,914

2,301

cinebench_cinebench_r20_singlecore

1,540

324

cinebench_cinebench_r23_multicore

25,988

5,480

cinebench_cinebench_r23_singlecore

3,669

773

passmark_data_compression

413,887

82,606

passmark_data_encryption

26,657

2,151

passmark_extended_instructions

26,073

5,224

passmark_find_prime_numbers

203

22

passmark_floating_point_math

56,730

14,080

passmark_integer_math

97,698

23,441

passmark_multithread

30,586

6,450

passmark_physics

1,617

472

passmark_random_string_sorting

44,902

11,068

passmark_single_thread

2,604

2,237

passmark_singlethread

2,604

2,237

geekbench_multicore

N/A

2,648

geekbench_singlecore

N/A

1,032

DETAILED SPECIFICATIONS

SPECIFICATION

9 3900

i7-10510U

Core Specs

Cores

12

4 -66.7%

Threads

24

8 -66.7%

Base Clock (GHz)

3.1

1,800 +57964.5%

Boost Clock (GHz)

4.3

4.9 +14.0%

Frequency (GHz)

3.1

1,800 +57964.5%

Turbo Clock (GHz)

4.3

4.9 +14.0%

Multiplier

31

18 -41.9%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

64 KB (per core)

L2 Cache

512 KB (per core)

256 KB (per core)

L3 Cache

64 MB

8 MB (shared)

Power

TDP (W)

65

25 -61.5%

PPT

88 W

—

Architecture

Architecture

Zen 2

Comet Lake

Codename

Matisse

Comet Lake-U

Generation

Ryzen 9 (Zen 2 (Matisse))

Core i7 (Comet Lake-U)

Process Size

7 nm

14 nm

Transistors

7,600 million

—

Die Size

2x 74 mm²

—

Foundry

TSMC

Intel

Memory

Memory Support

DDR4

DDR3, DDR4

Memory Bus

Dual-channel

—

Memory Bandwidth

51.2 GB/s

—

ECC Memory

No

No

Platform

Socket

AMD Socket AM4

Intel BGA 1440

Chipsets

A300, X300, A320, B350, X370, B450, X470, A520, B550, X570

—

PCIe

Gen 4, 24 Lanes(CPU only)

—

AMD Multi-Die

IO Process Size

12 nm

—

Graphics

Integrated Graphics

—

UHD Graphics

Other

Market

Desktop

Mobile

Production Status

Active

End-of-life

Launch Price

$499

—

Part Number

100-000000070

—

Package

µOPGA-1331

FC-BGA1440

Tj Max

95°C

—

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