AMD Ryzen 3 210 vs AMD Ryzen AI 9 HX PRO 475 Comparison

AMD
AMD

AMD Ryzen 3 210

CORE STATE Hawk Point
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 3 Base / 4.7 GHz Turbo
CACHE 8 MB (shared)
MAX TDP 28W
ARCHITECTURE Zen 4
nm
PROCESS 4 nm
LAUNCH DATE 2025
VS
AMD
AMD

Ryzen AI 9 HX PRO 475

CORE STATE Gorgon Point
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 2 Base / 5.2 GHz Turbo
CACHE 16 MB
MAX TDP 28W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2026

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
1,128
N/A
cinebench_cinebench_r15_singlecore
159
N/A
cinebench_cinebench_r20_multicore
4,703
N/A
cinebench_cinebench_r20_singlecore
664
N/A
cinebench_cinebench_r23_multicore
11,198
N/A
cinebench_cinebench_r23_singlecore
1,581
N/A
passmark_data_compression
152,017
461,650
passmark_data_encryption
8,607
23,132
passmark_extended_instructions
11,464
31,969
passmark_find_prime_numbers
49
130
passmark_floating_point_math
23,649
79,887
passmark_integer_math
37,933
126,829
passmark_multithread
13,585
36,487
passmark_physics
821
1,877
passmark_random_string_sorting
19,454
48,894
passmark_single_thread
3,724
4,301
passmark_singlethread
3,724
4,301

Analysis: AMD Ryzen 3 210 vs AMD Ryzen AI 9 HX PRO 475

Head-to-Head Benchmarks

The recorded benchmark data shows a decisive performance gap between the AMD Ryzen 3 210 and the AMD Ryzen AI 9 HX PRO 475. Across all 11 head-to-head measurements, the Ryzen AI 9 HX PRO 475 takes the win. The largest margin appears in floating point math, where the Ryzen AI 9 HX PRO 475 scores 79,887 against the Ryzen 3 210's 23,649, a 70.4% advantage. Integer math shows a similar pattern: 126,829 versus 37,933, a 70.1% lead. These two results indicate that the higher-core-count part handles arithmetic-heavy workloads with far greater throughput.

Data compression is another major separation point. The Ryzen AI 9 HX PRO 475 records 461,650 in PassMark data compression, while the Ryzen 3 210 manages 152,017. That is a 67.1% deficit for the smaller chip. Data encryption follows closely: 23,132 versus 8,607, a 62.8% gap. Extended instructions also favor the larger part by 64.1%, with scores of 31,969 and 11,464 respectively. The multi-threaded PassMark score reinforces the trend: 36,487 for the Ryzen AI 9 HX PRO 475 versus 13,585 for the Ryzen 3 210, another 62.8% difference.

The smallest relative gap is in single-thread performance. The Ryzen AI 9 HX PRO 475 posts 4,301 in PassMark single-thread compared to 3,724 for the Ryzen 3 210. That 13.4% lead is modest but consistent. Physics simulation shows a 56.3% advantage for the larger chip (1,877 vs 821), and random string sorting shows a 60.2% lead (48,894 vs 19,454). Prime number finding is also lopsided: 130 versus 49, a 62.3% gap. In no test does the Ryzen 3 210 close the gap to single digits, and in no test does it win outright.

Architecture Differences

The two processors come from different Zen generations and physical designs. The AMD Ryzen 3 210 uses Zen 4 architecture with the Hawk Point codename, built on TSMC's 4 nm process. The AMD Ryzen AI 9 HX PRO 475 uses Zen 5 architecture with the Gorgon Point codename, also on TSMC's 4 nm process. Both are mobile parts with active production status, but the die sizes differ: the Ryzen 3 210 measures 137 mm², while the Ryzen AI 9 HX PRO 475 is 233 mm². The transistor count for the Ryzen 3 210 is listed at 20,900 million, while the Ryzen AI 9 HX PRO 475 does not have a recorded transistor figure.

Core counts separate them sharply. The Ryzen 3 210 has 4 cores and 8 threads. The Ryzen AI 9 HX PRO 475 has 12 cores and 24 threads. Base clocks differ as well: 3.00 GHz for the Ryzen 3 210 versus 2.00 GHz for the Ryzen AI 9 HX PRO 475. Boost clocks flip the picture: 4.70 GHz for the smaller chip versus 5.20 GHz for the larger one. Both parts share a 28 W TDP and dual-channel memory support with 89.6 GB/s bandwidth. Both support DDR5, but the Ryzen AI 9 HX PRO 475 adds LPDDR5X support. ECC memory is available only on the Ryzen AI 9 HX PRO 475.

Cache configurations differ substantially. The Ryzen 3 210 has 64 KB L1 per core, 1 MB L2 per core, and 8 MB shared L3. The Ryzen AI 9 HX PRO 475 has 80 KB L1 per core, 1 MB L2 per core, and 16 MB L3. PCIe lanes also differ: Gen 4 with 14 lanes on the Ryzen 3 210 versus Gen 4 with 16 lanes on the Ryzen AI 9 HX PRO 475. Integrated graphics differ as well: the Ryzen 3 210 uses Radeon 740M, while the Ryzen AI 9 HX PRO 475 uses Radeon 890M. Sockets are different: AMD Socket FP7 for the Ryzen 3 210 and AMD Socket FP8 for the Ryzen AI 9 HX PRO 475. Neither part has an unlocked multiplier.

The Verdict

The data points to a clear separation in workload capability. The AMD Ryzen AI 9 HX PRO 475 is the stronger processor across every recorded benchmark. Its 94th percentile ranking among all CPUs, compared to the Ryzen 3 210's 71st percentile, places it in a different performance class. The average benchmark score of 74,496 for the Ryzen AI 9 HX PRO 475 versus 17,321 for the Ryzen 3 210 confirms that the larger chip delivers roughly four times the overall throughput in the database's aggregate measurements. The nearest rivals for each part reinforce this: the Ryzen AI 9 HX PRO 475 sits within 1.3% of parts like the AMD Ryzen 9 9950X and Intel Core Ultra 9 285, while the Ryzen 3 210 sits within 0.5% of parts like the Intel Core i5-12450H and AMD Ryzen 5 4500.

For buyers selecting between these two, the choice hinges on whether the workload demands multi-threaded throughput or single-thread efficiency. The Ryzen 3 210 offers lower core count and lower boost clock, which limits its ceiling in parallel tasks. The Ryzen AI 9 HX PRO 475 offers triple the cores, double the L3 cache, and a higher boost clock, which explains its dominance in every PassMark subtest. The single-thread gap of 13.4% is the only area where the smaller chip comes close, but it still loses. Neither part has a recorded launch MSRP, so price is not a differentiating factor in this comparison.

Specification Differences

| Specification | AMD Ryzen 3 210 | AMD Ryzen AI 9 HX PRO 475 |

| --- | --- | --- |

| Cores | 4 | 12 |

| Threads | 8 | 24 |

| Base clock | 3.00 GHz | 2.00 GHz |

| Boost clock | 4.70 GHz | 5.20 GHz |

| Socket | AMD Socket FP7 | AMD Socket FP8 |

| Architecture | Zen 4 | Zen 5 |

| Codename | Hawk Point | Gorgon Point |

| Die size | 137 mm² | 233 mm² |

| L1 cache | 64 KB (per core) | 80 KB (per core) |

| L3 cache | 8 MB (shared) | 16 MB |

| Memory support | DDR5 | DDR5, LPDDR5X |

| ECC memory | No | Yes |

| PCIe lanes | Gen 4, 14 lanes | Gen 4, 16 lanes |

| Integrated graphics | Radeon 740M | Radeon 890M |

| Part number | 100-000001612 | 100-000001683 |

| Release date | 2025-01-05 | 2026-01-04 |

Shared specifications include 4 nm process node, TSMC foundry, 28 W TDP, dual-channel memory bus, 89.6 GB/s memory bandwidth, 1 MB L2 per core, and 0 wins for the Ryzen 3 210 in head-to-head tests.

FAQ

Q: Which processor has more cores?

A: The AMD Ryzen AI 9 HX PRO 475 has 12 cores and 24 threads, while the AMD Ryzen 3 210 has 4 cores and 8 threads.

Q: Which processor has a higher boost clock?

A: The AMD Ryzen AI 9 HX PRO 475 boosts to 5.20 GHz, compared to 4.70 GHz on the AMD Ryzen 3 210.

Q: Do both processors support the same memory types?

A: No. Both support DDR5, but the AMD Ryzen AI 9 HX PRO 475 also supports LPDDR5X.

Q: Which processor supports ECC memory?

A: Only the AMD Ryzen AI 9 HX PRO 475 supports ECC memory. The AMD Ryzen 3 210 does not.

Q: What is the largest benchmark gap between the two?

A: The largest gap is in floating point math, where the AMD Ryzen AI 9 HX PRO 475 leads by 70.4%.

Q: What is the smallest benchmark gap between the two?

A: The smallest gap is in single-thread performance, where the AMD Ryzen AI 9 HX PRO 475 leads by 13.4%.

Where Each One Wins

The AMD Ryzen AI 9 HX PRO 475 wins in every recorded benchmark category. Its strongest advantages are in multi-threaded and math-heavy workloads: floating point math (70.4% lead), integer math (70.1% lead), data compression (67.1% lead), extended instructions (64.1% lead), and multi-threaded PassMark (62.8% lead). It also leads decisively in data encryption (62.8%), prime number finding (62.3%), random string sorting (60.2%), and physics simulation (56.3%). For users running parallel compilation, video encoding, scientific simulation, or database workloads, the Ryzen AI 9 HX PRO 475 is the only rational pick from the data.

The AMD Ryzen 3 210 does not win any benchmark. Its closest margin is in single-thread performance, where it trails by 13.4%. That smaller gap suggests that for lightly threaded tasks, such as basic office productivity or web browsing, the Ryzen 3 210 is comparatively less disadvantaged. However, it still loses outright. The Ryzen 3 210's 71st percentile ranking and 17,321 average score indicate it belongs in a lower performance tier, suitable for systems where the 12-core part is unnecessary. Its lower die size (137 mm² vs 233 mm²) and lower L3 cache (8 MB vs 16 MB) align with a more modest workload profile. Neither chip offers an unlocked multiplier, so overclocking is not an option for either.

DETAILED SPECIFICATIONS

SPECIFICATION
3 210
AI 9 HX PRO 475
Core Specs
Cores
4
12 +200.0%
Threads
8
24 +200.0%
Base Clock (GHz)
3
2 -33.3%
Boost Clock (GHz)
4.7
5.2 +10.6%
Frequency (GHz)
3
2 -33.3%
Turbo Clock (GHz)
4.7
5.2 +10.6%
Multiplier
30
20 -33.3%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1 MB (per core)
L3 Cache
8 MB (shared)
16 MB
Power
TDP (W)
28
28 0.0%
Configurable TDP
15-30 W
15-54 W
Architecture
Architecture
Zen 4
Zen 5
Codename
Hawk Point
Gorgon Point
Generation
Ryzen 3 (Zen 4 (Hawk Point))
Ryzen AI PRO 400 (Zen 5 / Zen 5c)
Process Size
4 nm
4 nm
Transistors
20,900 million
—
Die Size
137 mm²
233 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR5, LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
89.6 GB/s
ECC Memory
No
Yes
Platform
Socket
AMD Socket FP7
AMD Socket FP8
PCIe
Gen 4, 14 Lanes(CPU only)
Gen 4, 16 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
1 + 3
4 + 8
E-Core Frequency
2.8 GHz up to 3.3 GHz
2000 MHz up to 3.3 GHz
AI/NPU
NPU
—
Yes / 60 TOPS
Graphics
Integrated Graphics
Radeon 740M
Radeon 890M
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
100-000001612
100-000001683
Package
FP8
FP8
Tj Max
100°C
100°C
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