INTEL

Intel Core i3-2377M

Intel processor specifications and benchmark scores

2
Cores
4
Threads
GHz Boost
17W
TDP
Integrated GPU

At a Glance

Intel
Cores / Threads 2C / 4T
Base Clock 1500 GHz
L3 Cache 3 MB (shared)
TDP 17W
Architecture Sandy Bridge
Socket Intel BGA 1023
nm
Process 32 nm
Released Sep 2012

Intel Core i3-2377M Specifications

Core i3-2377M Core Configuration

Processing cores and threading

The Intel Core i3-2377M features 2 physical cores and 4 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
2
Threads
4
SMP CPUs
1

i3-2377M Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Core i3-2377M benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Core i3-2377M by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
1500 GHz
Boost Clock
N/A
Multiplier
15x

Intel's Core i3-2377M Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the i3-2377M processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Core i3-2377M's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
64 KB (per core)
L2 Cache
256 KB (per core)
L3 Cache
3 MB (shared)

Sandy Bridge Architecture & Process

Manufacturing and design details

The Intel Core i3-2377M is built on Intel's 32 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in i3-2377M incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Sandy Bridge
Codename
Sandy Bridge
Process Node
32 nm
Foundry
Intel
Transistors
624 million
Die Size
149 mm²
Generation
Core i3 (Sandy Bridge)

Sandy Bridge Instruction Set Features

Supported CPU instructions and extensions

The Core i3-2377M by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4.1
SSE4.2
AVX
AES-NI
Intel 64
VT-x
VT-d

i3-2377M Power & Thermal

TDP and power specifications

The Intel Core i3-2377M has a TDP (Thermal Design Power) of 17W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
17W

Intel BGA 1023 Platform & Socket

Compatibility information

The Core i3-2377M uses the Intel BGA 1023 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel BGA 1023
Package
rPGA
DDR5

Intel BGA 1023 Memory Support

RAM compatibility and speeds

Memory support specifications for the i3-2377M define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Core i3-2377M determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR3
Memory Bus
Dual-channel

Intel's Core i3-2377M Integrated Graphics

Built-in GPU specifications

The Intel Core i3-2377M includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the i3-2377M provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
Intel HD 3000
Graphics Model
Intel HD 3000

Core i3-2377M Product Information

Release and pricing details

The Intel Core i3-2377M is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Core i3-2377M by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Sep 2012
Market
Mobile

Core i3-2377M Benchmark Scores

geekbench_multicoreSource

Geekbench multi-core tests Intel Core i3-2377M across real-world workloads including image processing, machine learning, and data compression. All available threads are utilized to measure parallel performance.

geekbench_multicore #799 of 814
481
2%
Max: 27,036

geekbench_singlecoreSource

Geekbench single-core measures how fast one thread of Intel Core i3-2377M can process tasks like web browsing and document editing. This score correlates with how snappy the system feels during normal use.

geekbench_singlecore #800 of 814
238
8%
Max: 3,081
Compare with other CPUs

About Intel Core i3-2377M

The Intel Core i3-2377M is a mobile processor from the Sandy Bridge architecture, built on a 32 nm process with 624 million transistors on a 149 mm² die. It provides two cores and four threads at a base clock of 1500 MHz, with a TDP of just 17 W. Benchmark results place it in the 3rd percentile of all CPUs, indicating entry-level performance. Its Geekbench scores are 238 for single-core and 481 for multi-core, with an average benchmark score of 360.

Benchmark Performance

The i3-2377M’s Geekbench single-core score of 238 and multi-core score of 481 are both very low by modern standards, but they align closely with several older desktop and mobile dual-core parts. The average benchmark score of 360 places it in the 3rd percentile, meaning it outperforms only a small fraction of the CPU population. Among its nearest rivals, the AMD Athlon II X2 260 averages 359, which is 0.3% lower than the i3-2377M. The AMD A6-4400M and Intel Celeron 2950M both average 362, putting them 0.4% higher. The AMD Phenom II X2 545 scores 357, 0.9% lower than the i3. These deltas are tiny—within a single percentage point—so in practical terms, the i3-2377M is performance-equivalent to all four rivals. The 3rd percentile ranking underscores that this is a very low-end chip, but within its immediate peer group, it is not an outlier. The data shows that the i3-2377M sits at the bottom of the performance spectrum, yet it is not meaningfully slower than other budget dual-cores of its generation.

Single-Thread vs Multi-Thread Behavior

The single-core score of 238 is roughly half the multi-core score of 481, indicating near-linear scaling from one to four threads. This is expected from a dual-core processor with Hyper-Threading, which allows four threads to run concurrently. However, the absolute values are low. A base clock of 1500 MHz with no boost capability means single-threaded tasks such as web rendering, spreadsheet calculations, and light scripting will feel sluggish. The multi-core score, while higher, still reflects a low per-thread throughput. For workloads that can use all four threads—like video transcoding, batch image processing, or compiling—the i3-2377M will show a modest improvement over its single-thread performance, but the overall output remains limited. The split suggests the CPU is better suited to parallel, short-duration tasks than to sustained single-thread loads. In everyday use, the lack of a boost clock means the processor runs at a constant 1500 MHz, which is a severe constraint for any modern application that relies on single-thread speed. The data indicates that the i3-2377M’s multi-thread advantage is real but small, and it does not compensate for the low clock speed.

Power and Thermals

With a TDP of 17 W, the i3-2377M is an ultra-low-power part. This allows for fanless or very small cooling solutions, typical of thin-and-light laptops. The 32 nm process and the modest transistor count of 624 million contribute to low heat output. There is no boost clock, so the CPU runs at a constant 1500 MHz under load, keeping power draw predictable. For a system builder or buyer, this means the chip can be cooled by a passive heatsink or a tiny fan, which is a significant advantage for portability and battery life. The low TDP also implies that the processor will not require active cooling in most chassis, though the integrated Intel HD 3000 graphics may still generate some heat. In practice, a laptop with this CPU will have a very modest thermal solution, and the 17 W figure is a key specification for anyone evaluating the cooling requirements of a potential build.

FAQ

Q: What socket does the i3-2377M use?

A: It uses the Intel BGA 1023 socket, which is a soldered mobile socket.

Q: Does the processor support ECC memory?

A: No, ECC memory is not supported.

Q: What integrated graphics does it include?

A: It includes Intel HD 3000 graphics.

Q: How many threads can it process concurrently?

A: It has two cores and four threads, so it can handle four threads simultaneously.

Q: What is the size of the L3 cache?

A: The L3 cache is 3 MB shared across both cores.

Q: When was this processor released?

A: It was released on August 31, 2012.

Who Should Consider It

The i3-2377M is appropriate for basic mobile computing: web browsing, email, document editing, and light media playback. The single-core score of 238 and multi-core score of 481 indicate that it can handle these tasks without issue, but it will struggle with more demanding applications like video editing, 3D rendering, or modern games. Its performance is comparable to that of the AMD Athlon II X2 260 and Phenom II X2 545, so it is not a step up from those older desktop parts. For users who prioritize battery life and low heat over performance, this chip fits. It is not suited for gaming; the integrated HD 3000 graphics are from 2012 and lack the power for any serious 3D work. In a productivity context, the four-thread capability helps with multitasking, but the low clock speed limits responsiveness. The 3rd percentile ranking means that any task requiring significant CPU power will be a poor experience. This processor is best reserved for ultra-portable laptops where the primary goals are long battery life, silent operation, and basic productivity.

Platform and Compatibility

The i3-2377M is designed for the mobile segment, using the BGA 1023 socket, which means it is soldered to the motherboard and cannot be upgraded. It supports dual-channel DDR3 memory, with no ECC option. The Sandy Bridge architecture uses a 32 nm process, and the integrated Intel HD 3000 graphics are part of the package. There is no PCIe information in the data, so we cannot comment on expansion. The platform is a closed one, typical for ultraportable laptops of its era. The 17 W TDP and 1500 MHz base clock are the defining characteristics for compatibility: any system built around this chip must have a cooling solution capable of dissipating 17 W, which is trivial for even the smallest heatsinks. The memory bus is dual-channel, so two DDR3 modules can be used for better bandwidth, though the CPU’s low performance makes this a minor consideration. The cache hierarchy includes 64 KB of L1 per core, 256 KB of L2 per core, and 3 MB of shared L3. This configuration is standard for Sandy Bridge mobile parts and provides adequate data locality for the modest workload this chip can handle.

The AMD Equivalent of Core i3-2377M

Looking for a similar processor from AMD? The AMD Ryzen 3 PRO 1200 offers comparable performance and features in the AMD lineup.

AMD Ryzen 3 PRO 1200

AMD • 4 Cores

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