CPU Comparison

AMD
AMD

AMD Ryzen 9 3900

CORE STATE Matisse
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3.1 Base / 4.3 GHz Turbo
CACHE 64 MB
MAX TDP 65W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2019
VS
Intel
INTEL

Xeon Gold 5318H

CORE STATE Cooper Lake-SP
CORE SPECS 18 Cores / 36 Threads
CLOCK SPEED 2.5 Base / 3.8 GHz Turbo
CACHE 24.75 MB (shared)
MAX TDP 150W
ARCHITECTURE Cooper Lake
nm
PROCESS 14 nm
LAUNCH DATE 2021

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
2,619
2,510
cinebench_cinebench_r15_singlecore
369
354
cinebench_cinebench_r20_multicore
10,914
10,460
cinebench_cinebench_r20_singlecore
1,540
1,476
cinebench_cinebench_r23_multicore
25,988
24,905
cinebench_cinebench_r23_singlecore
3,669
3,516
passmark_data_compression
413,887
470,916
passmark_data_encryption
26,657
10,743
passmark_extended_instructions
26,073
33,730
passmark_find_prime_numbers
203
141
passmark_floating_point_math
56,730
66,610
passmark_integer_math
97,698
107,603
passmark_multithread
30,586
29,301
passmark_physics
1,617
2,309
passmark_random_string_sorting
44,902
58,841
passmark_single_thread
2,604
2,225
passmark_singlethread
2,604
2,225

DETAILED SPECIFICATIONS

SPECIFICATION
9 3900
Gold 5318H
Core Specs
Cores
12
18 +50.0%
Threads
24
36 +50.0%
Base Clock (GHz)
3.1
2.5 -19.4%
Boost Clock (GHz)
4.3
3.8 -11.6%
Frequency (GHz)
3.1
2.5 -19.4%
Turbo Clock (GHz)
4.3
3.8 -11.6%
Multiplier
31
25 -19.4%
SMP CPUs
1
4 +300.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
64 MB
24.75 MB (shared)
Power
TDP (W)
65
150 +130.8%
PPT
88 W
โ€”
Architecture
Architecture
Zen 2
Cooper Lake
Codename
Matisse
Cooper Lake-SP
Generation
Ryzen 9 (Zen 2 (Matisse))
Xeon Gold (Cooper Lake-SP)
Process Size
7 nm
14 nm
Transistors
7,600 million
โ€”
Die Size
2x 74 mmยฒ
โ€”
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR4
Memory Bus
Dual-channel
Six-channel
Memory Bandwidth
51.2 GB/s
128.0 GB/s
ECC Memory
No
Yes
Platform
Socket
AMD Socket AM4
Intel Socket 4189
Chipsets
A300, X300, A320, B350, X370, B450, X470, A520, B550, X570
โ€”
PCIe
Gen 4, 24 Lanes(CPU only)
Gen 3, 48 Lanes(CPU only)
AMD Multi-Die
IO Process Size
12 nm
โ€”
Other
Market
Desktop
Server/Workstation
Production Status
Active
Active
Launch Price
$499
โ€”
Part Number
100-000000070
SRJY3CD8070604481600
Package
ยตOPGA-1331
FC-LGA4189
Tj Max
95ยฐC
โ€”
View Ryzen 9 3900 Details View Xeon Gold 5318H Details