CPU Comparison

AMD
AMD

AMD Ryzen 9 3900

CORE STATE Matisse
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3.1 Base / 4.3 GHz Turbo
CACHE 64 MB
MAX TDP 65W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2019
VS
Intel
INTEL

Core i9-7960X

CORE STATE Skylake-X
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2.8 Base / 4.4 GHz Turbo
CACHE 22 MB (shared)
MAX TDP 165W
ARCHITECTURE Skylake
nm
PROCESS 14 nm
LAUNCH DATE 2017

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
2,619
2,408
cinebench_cinebench_r15_singlecore
369
339
cinebench_cinebench_r20_multicore
10,914
10,037
cinebench_cinebench_r20_singlecore
1,540
1,416
cinebench_cinebench_r23_multicore
25,988
23,898
cinebench_cinebench_r23_singlecore
3,669
3,373
passmark_data_compression
413,887
N/A
passmark_data_encryption
26,657
N/A
passmark_extended_instructions
26,073
N/A
passmark_find_prime_numbers
203
N/A
passmark_floating_point_math
56,730
N/A
passmark_integer_math
97,698
N/A
passmark_multithread
30,586
N/A
passmark_physics
1,617
N/A
passmark_random_string_sorting
44,902
N/A
passmark_single_thread
2,604
N/A
passmark_singlethread
2,604
N/A
geekbench_multicore
N/A
10,307
geekbench_singlecore
N/A
1,324

DETAILED SPECIFICATIONS

SPECIFICATION
9 3900
i9-7960X
Core Specs
Cores
12
16 +33.3%
Threads
24
32 +33.3%
Base Clock (GHz)
3.1
2.8 -9.7%
Boost Clock (GHz)
4.3
4.4 +2.3%
Frequency (GHz)
3.1
2.8 -9.7%
Turbo Clock (GHz)
4.3
4.4 +2.3%
Multiplier
31
28 -9.7%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
64 MB
22 MB (shared)
Power
TDP (W)
65
165 +153.8%
PPT
88 W
Architecture
Architecture
Zen 2
Skylake
Codename
Matisse
Skylake-X
Generation
Ryzen 9 (Zen 2 (Matisse))
Core i9 (X-Series 7th Gen)
Process Size
7 nm
14 nm
Transistors
7,600 million
Die Size
2x 74 mm²
484 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR4
Memory Bus
Dual-channel
Quad-channel
Memory Bandwidth
51.2 GB/s
85.3 GB/s
ECC Memory
No
No
Platform
Socket
AMD Socket AM4
Intel Socket 2066
Chipsets
A300, X300, A320, B350, X370, B450, X470, A520, B550, X570
PCIe
Gen 4, 24 Lanes(CPU only)
Gen 3, 44 Lanes(CPU only)
AMD Multi-Die
IO Process Size
12 nm
Other
Market
Desktop
Desktop
Production Status
Active
End-of-life
Launch Price
$499
$1699
Part Number
100-000000070
SR3RR
Package
µOPGA-1331
FC-LGA2066
Tj Max
95°C
98°C
Bundled Cooler
None
View Ryzen 9 3900 Details View Core i9-7960X Details