CPU Comparison

AMD
AMD

AMD Ryzen 9 3900

CORE STATE Matisse
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3.1 Base / 4.3 GHz Turbo
CACHE 64 MB
MAX TDP 65W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2019
VS
Intel
INTEL

Core i7-9750HF

CORE STATE Coffee Lake-HR
CORE SPECS 6 Cores / 12 Threads
CLOCK SPEED 2.6 Base / 4.5 GHz Turbo
CACHE 12 MB (shared)
MAX TDP 45W
ARCHITECTURE Coffee Lake
nm
PROCESS 14 nm
LAUNCH DATE 2019

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
2,619
898
cinebench_cinebench_r15_singlecore
369
126
cinebench_cinebench_r20_multicore
10,914
3,744
cinebench_cinebench_r20_singlecore
1,540
528
cinebench_cinebench_r23_multicore
25,988
8,916
cinebench_cinebench_r23_singlecore
3,669
1,258
passmark_data_compression
413,887
N/A
passmark_data_encryption
26,657
N/A
passmark_extended_instructions
26,073
N/A
passmark_find_prime_numbers
203
N/A
passmark_floating_point_math
56,730
N/A
passmark_integer_math
97,698
N/A
passmark_multithread
30,586
N/A
passmark_physics
1,617
N/A
passmark_random_string_sorting
44,902
N/A
passmark_single_thread
2,604
N/A
passmark_singlethread
2,604
N/A
geekbench_multicore
N/A
4,844
geekbench_singlecore
N/A
1,365

DETAILED SPECIFICATIONS

SPECIFICATION
9 3900
i7-9750HF
Core Specs
Cores
12
6 -50.0%
Threads
24
12 -50.0%
Base Clock (GHz)
3.1
2.6 -16.1%
Boost Clock (GHz)
4.3
4.5 +4.7%
Frequency (GHz)
3.1
2.6 -16.1%
Turbo Clock (GHz)
4.3
4.5 +4.7%
Multiplier
31
26 -16.1%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
256 KB (per core)
L3 Cache
64 MB
12 MB (shared)
Power
TDP (W)
65
45 -30.8%
PPT
88 W
Architecture
Architecture
Zen 2
Coffee Lake
Codename
Matisse
Coffee Lake-HR
Generation
Ryzen 9 (Zen 2 (Matisse))
Core i7 (Coffee Lake-HR)
Process Size
7 nm
14 nm
Transistors
7,600 million
Die Size
2x 74 mm²
149 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
42.7 GB/s
ECC Memory
No
No
Platform
Socket
AMD Socket AM4
Intel BGA 1440
Chipsets
A300, X300, A320, B350, X370, B450, X470, A520, B550, X570
PCIe
Gen 4, 24 Lanes(CPU only)
Gen 3
AMD Multi-Die
IO Process Size
12 nm
Other
Market
Desktop
Mobile
Production Status
Active
End-of-life
Launch Price
$499
Part Number
100-000000070
SRG1T
Package
µOPGA-1331
FC-BGA1440
Tj Max
95°C
100°C
View Ryzen 9 3900 Details View Core i7-9750HF Details