Intel Core 9 273PE vs Qualcomm Snapdragon X2E-78-100 Comparison

Intel
INTEL

Intel Core 9 273PE

CORE STATE Bartlett Lake
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 2.3 Base / 5.7 GHz Turbo
CACHE 36 MB (shared)
MAX TDP 65W
ARCHITECTURE Bartlett Lake
nm
PROCESS 10 nm
LAUNCH DATE 2026
VS
Unknown
CPU

Snapdragon X2E-78-100

CORE STATE Glymur
CORE SPECS 12 Cores / 12 Threads
CLOCK SPEED 4 Base
CACHE —
MAX TDP —
ARCHITECTURE Glymur
nm
PROCESS 3 nm
LAUNCH DATE 2026

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
3,153
N/A
cinebench_cinebench_r15_singlecore
445
N/A
cinebench_cinebench_r20_multicore
13,140
N/A
cinebench_cinebench_r20_singlecore
1,855
N/A
cinebench_cinebench_r23_multicore
31,288
N/A
cinebench_cinebench_r23_singlecore
4,417
N/A
passmark_data_compression
405,885
N/A
passmark_data_encryption
22,719
N/A
passmark_extended_instructions
24,630
N/A
passmark_find_prime_numbers
203
N/A
passmark_floating_point_math
107,884
N/A
passmark_integer_math
139,410
N/A
passmark_multithread
36,810
N/A
passmark_physics
3,120
N/A
passmark_random_string_sorting
45,098
N/A
passmark_single_thread
3,650
N/A
passmark_singlethread
3,650
N/A

Analysis: Intel Core 9 273PE vs Qualcomm Snapdragon X2E-78-100

FAQ

Q: How does the Intel Core 9 273PE compare to the Qualcomm Snapdragon X2E-78-100 in core count?

A: Both processors feature 12 cores, but the Intel Core 9 273PE supports 24 threads through Hyper-Threading, while the Qualcomm Snapdragon X2E-78-100 supports 12 threads, one per core.

Q: What is the process node difference between the two processors?

A: The Qualcomm Snapdragon X2E-78-100 is built on a 3 nm process by TSMC, while the Intel Core 9 273PE uses a 10 nm process by Intel. The Qualcomm die size is 220 mm², while the Intel die size is not recorded.

Q: Which processor has a higher base clock speed?

A: The Qualcomm Snapdragon X2E-78-100 has a base clock of 4.00 GHz, which is higher than the Intel Core 9 273PE's base clock of 2.30 GHz. The Intel processor has a boost clock of 5.70 GHz, while the Qualcomm processor has no recorded boost clock.

Q: What memory types do the two processors support?

A: The Intel Core 9 273PE supports DDR4 and DDR5 memory with dual-channel configuration, while the Qualcomm Snapdragon X2E-78-100 supports LPDDR5X memory with dual-channel configuration.

Q: How do the cache hierarchies differ?

A: The Intel Core 9 273PE has 80 KB of L1 per core, 2 MB of L2 per core, and 36 MB of shared L3 cache. The Qualcomm Snapdragon X2E-78-100 has 288 KB of L1 per core and 16 MB of shared L2 cache, with no L3 cache recorded.

Q: What is the market segment for each processor?

A: The Intel Core 9 273PE is a Desktop processor with a 65 TDP, while the Qualcomm Snapdragon X2E-78-100 is a Mobile processor with no TDP recorded.

Architecture Differences

The Intel Core 9 273PE, codenamed Bartlett Lake, belongs to the Core 9 generation and uses a 10 nm process fabricated by Intel. It is a desktop part with 12 cores and 24 threads, indicating simultaneous multithreading support. The Qualcomm Snapdragon X2E-78-100, codenamed Glymur, belongs to the Snapdragon X2 (Elite) generation and uses a 3 nm process fabricated by TSMC. It is a mobile part with 12 cores and 12 threads, meaning no multithreading per core.

The Intel processor has a base clock of 2.30 GHz and a boost clock of 5.70 GHz, while the Qualcomm processor has a base clock of 4.00 GHz and no recorded boost clock. The Intel processor has a TDP of 65, while the Qualcomm processor has no TDP recorded. The Intel part uses Intel Socket 1700, while the Qualcomm part uses Qualcomm BGA 2343.

Cache architecture differs substantially. The Intel Core 9 273PE uses 80 KB of L1 per core, 2 MB of L2 per core, and 36 MB of shared L3. The Qualcomm Snapdragon X2E-78-100 uses 288 KB of L1 per core and 16 MB of shared L2, with no L3 cache recorded. The Intel die size is not recorded, while the Qualcomm die size is 220 mm².

Memory support diverges: the Intel processor supports DDR4 and DDR5 with dual-channel configuration and 89.6 GB/s bandwidth, while the Qualcomm processor supports LPDDR5X with dual-channel configuration and 152.4 GB/s bandwidth. The Intel processor supports ECC memory, while the Qualcomm processor does not. PCIe connectivity also differs: the Intel part provides Gen 5 with 16 lanes (CPU only), while the Qualcomm part provides Gen 5 with 12 lanes (CPU only). Integrated graphics are UHD Graphics 730 on the Intel side and Adreno X2-85 on the Qualcomm side.

Head-to-Head Benchmarks

The database contains no head-to-head benchmark entries for the Intel Core 9 273PE versus the Qualcomm Snapdragon X2E-78-100. The Intel Core 9 273PE has a full benchmark suite recorded, while the Qualcomm Snapdragon X2E-78-100 has no benchmark scores in the database. The Intel processor achieves a percentile rank of 90 among all CPUs, while the Qualcomm processor holds a percentile rank of 50. The Intel processor has an average benchmark score of 49845, while the Qualcomm processor has an average benchmark score of 0, reflecting the absence of recorded measurements.

The Intel Core 9 273PE shows strong results in the recorded data. In Cinebench R23, it scores 31288 in multi-core and 4417 in single-core. In Cinebench R20, it scores 13140 in multi-core and 1855 in single-core. In Cinebench R15, it scores 3153 in multi-core and 445 in single-core. PassMark tests show 36810 in multithread, 3650 in single-thread, 139410 in integer math, 107884 in floating point math, 405885 in data compression, 22719 in data encryption, 24630 in extended instructions, 203 in find prime numbers, 3120 in physics, and 45098 in random string sorting.

The nearest rivals to the Intel Core 9 273PE in the database include the AMD Ryzen AI Max+ 388 with an average score of 49796 and a delta of 0.1%, indicating near parity. The Intel Core i5-14600KF scores 49394 with a delta of 0.9%, meaning the Core 9 273PE is 0.9% behind. The Intel Core i9-13980HX scores 50398 with a delta of -1.1%, meaning the Core 9 273PE is 1.1% ahead. The AMD Ryzen AI 9 HX PRO 370 scores 50448 with a delta of -1.2%, meaning the Core 9 273PE is 1.2% ahead. These deltas indicate the Intel processor sits within a narrow performance band among its closest competitors.

Specification Differences

The Intel Core 9 273PE and Qualcomm Snapdragon X2E-78-100 differ in several key specification fields. The Intel processor has 24 threads, while the Qualcomm processor has 12 threads. The Intel base clock is 2.30 GHz, while the Qualcomm base clock is 4.00 GHz. The Intel boost clock is 5.70 GHz, while the Qualcomm boost clock is not recorded. The Intel TDP is 65, while the Qualcomm TDP is not recorded. The Intel socket is Intel Socket 1700, while the Qualcomm socket is Qualcomm BGA 2343.

The process node differs: Intel uses 10 nm, Qualcomm uses 3 nm. The foundry differs: Intel uses Intel, Qualcomm uses TSMC. The die size is not recorded for Intel, while Qualcomm has a die size of 220 mm². The codenames differ: Bartlett Lake for Intel, Glymur for Qualcomm. The generations differ: Core 9 (Bartlett Lake) for Intel, Snapdragon X2 (Elite) for Qualcomm.

Cache specifications differ: Intel has 80 KB L1 per core, 2 MB L2 per core, and 36 MB shared L3, while Qualcomm has 288 KB L1 per core and 16 MB shared L2, with no L3 recorded. Memory support differs: Intel supports DDR4 and DDR5, Qualcomm supports LPDDR5X. Memory bandwidth differs: Intel has 89.6 GB/s, Qualcomm has 152.4 GB/s. ECC support differs: Intel supports ECC, Qualcomm does not. PCIe lanes differ: Intel has Gen 5 with 16 lanes, Qualcomm has Gen 5 with 12 lanes. Integrated graphics differ: Intel uses UHD Graphics 730, Qualcomm uses Adreno X2-85.

Market segment differs: Intel is Desktop, Qualcomm is Mobile. The release dates differ: Intel released on 2026-03-08, Qualcomm on 2026-04-05. The Intel processor has a launch MSRP of $549, while the Qualcomm processor has no launch MSRP recorded. The part numbers differ: SA4QD for Intel, X2E78100 for Qualcomm. Both processors have multiplier unlocked set to false.

Where Each One Wins

The Intel Core 9 273PE wins in thread count with 24 threads versus 12 threads, a direct advantage for workloads that scale with simultaneous multithreading. Its boost clock of 5.70 GHz provides a high ceiling for single-thread bursts, and its 36 MB of shared L3 cache offers a larger pool for frequently accessed data. The Intel processor supports both DDR4 and DDR5 memory, giving flexibility in system configuration, and its ECC support suits data-integrity-sensitive applications. The recorded benchmark suite shows strong performance across Cinebench and PassMark tests, with a percentile rank of 90 among all CPUs.

The Qualcomm Snapdragon X2E-78-100 wins in process technology with a 3 nm node versus 10 nm, which indicates a more advanced manufacturing process. Its base clock of 4.00 GHz is higher than the Intel base clock of 2.30 GHz, and its memory bandwidth of 152.4 GB/s exceeds the Intel 89.6 GB/s. The L1 cache of 288 KB per core is larger than the Intel 80 KB per core, and the die size of 220 mm² is recorded, while the Intel die size is not. The Qualcomm processor targets the mobile segment, where power efficiency from the 3 nm process and LPDDR5X memory support align with portable system requirements. Its integrated Adreno X2-85 graphics serve mobile visual workloads.

The absence of recorded benchmarks for the Qualcomm processor limits direct performance comparisons in the database. The Intel processor has extensive recorded scores, while the Qualcomm processor has none. The Intel processor holds a higher percentile rank of 90 versus 50 for Qualcomm, and the Intel average benchmark score of 49845 contrasts with the Qualcomm score of 0, reflecting the data gap.

The Verdict

The data indicates the Intel Core 9 273PE is the only one of the two with recorded benchmark evidence. Its scores in Cinebench R23, Cinebench R20, Cinebench R15, and PassMark tests establish a measurable performance profile, and its percentile rank of 90 places it high among all CPUs. Its nearest rivals, including the AMD Ryzen AI Max+ 388, Intel Core i5-14600KF, Intel Core i9-13980HX, and AMD Ryzen AI 9 HX PRO 370, all sit within a 1.2% delta of its average score, showing that the Intel processor competes closely with those parts.

The Qualcomm Snapdragon X2E-78-100 has no recorded benchmarks, an average score of 0, and a percentile rank of 50. Its specifications show a 3 nm process, a 4.00 GHz base clock, 152.4 GB/s memory bandwidth, and 288 KB of L1 per core, but without benchmark data, the database cannot confirm real-world performance. Its mobile market segment and LPDDR5X memory support indicate a design for portable systems, while the Intel processor targets desktop systems with a 65 TDP and Intel Socket 1700.

For a desktop workload where performance measurements are documented, the Intel Core 9 273PE is the choice supported by data. Its 24 threads, 5.70 GHz boost clock, and 36 MB L3 cache provide a clear specification advantage over the Qualcomm part. For a mobile workload where process efficiency and memory bandwidth matter, the Qualcomm Snapdragon X2E-78-100 offers a 3 nm process and higher memory bandwidth, but the lack of recorded benchmarks means its performance relative to the Intel processor cannot be assessed from the database. The release dates are close, with Intel on 2026-03-08 and Qualcomm on 2026-04-05, and both are active production parts. The Intel processor has a launch MSRP of $549, while the Qualcomm processor has no launch MSRP recorded.

DETAILED SPECIFICATIONS

SPECIFICATION
9 273PE
Snapdragon X2E-78-100
Core Specs
Cores
12
12 0.0%
Threads
24
12 -50.0%
Base Clock (GHz)
2.3
4 +73.9%
Boost Clock (GHz)
5.7
—
Frequency (GHz)
2.3
4 +73.9%
Turbo Clock (GHz)
5.7
—
Multiplier
23
40 +73.9%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
288 KB (per core)
L2 Cache
2 MB (per core)
16 MB (shared)
L3 Cache
36 MB (shared)
—
Power
TDP (W)
65
—
PL1
65 W
—
PL2
219 W
—
Architecture
Codename
Bartlett Lake
Glymur
Generation
Core 9 (Bartlett Lake)
Snapdragon X2 (Elite)
Process Size
10 nm
3 nm
Die Size
—
220 mm²
Foundry
Intel
TSMC
Memory
Memory Support
DDR4, DDR5
LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
152.4 GB/s
ECC Memory
Yes
No
DDR4 Speed
3200 MT/s
—
Platform
Socket
Intel Socket 1700
Qualcomm BGA 2343
Chipsets
W680, R680E, Q670e, Q670, H610E, H610
—
PCIe
Gen 5, 16 Lanes(CPU only)
Gen 5, 12 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
—
6 + 6
E-Core Frequency
—
3.4 GHz
P-Core Turbo
5.4 GHz
—
AI/NPU
NPU
—
Yes / 80 TOPS
Graphics
Integrated Graphics
UHD Graphics 730
Adreno X2-85
Other
Market
Desktop
Mobile
Production Status
Active
Active
Launch Price
$549
—
Part Number
SA4QD
X2E78100
Package
FC-LGA16A
FC-BGA
Tj Max
100°C
—
View Core 9 273PE Details View Snapdragon X2E-78-100 Details