Intel Core 9 273PE vs Qualcomm Snapdragon X1P-46-100 Comparison

Head-to-Head Benchmarks

The Intel Core 9 273PE and Qualcomm Snapdragon X1P-46-100 present a stark contrast in benchmark data availability. The Intel processor has 17 recorded benchmark scores across Cinebench and PassMark suites, while the Qualcomm chip has no recorded benchmark scores in the database. This absence of data for the Snapdragon X1P-46-100 means direct head-to-head comparisons cannot be calculated, and the head-to-head benchmark field remains empty.

The Intel Core 9 273PE delivers a Cinebench R23 multicore score of 31,288 and a single-core score of 4,417. In Cinebench R20, the multicore result is 13,140, with single-core at 1,855. The older Cinebench R15 test shows a multicore score of 3,153 and single-core of 445. These results indicate strong scaling from single-threaded to multi-threaded workloads, with the R23 multicore score roughly seven times the single-core figure.

PassMark results for the Intel chip show a multithread score of 36,810 and a single-thread score of 3,650. Data compression reaches 405,885, while encryption scores 22,719. Floating point math records 107,884, integer math hits 139,410, and extended instructions score 24,630. Prime number finding scores 203, physics simulation reaches 3,120, and random string sorting completes at 45,098.

The Intel processor holds an average benchmark score of 49,845 across all recorded tests. Its percentile ranking against all CPUs in the database is 90, placing it in the top decile of recorded processors. The nearest rival, AMD Ryzen AI Max+ 388, scores 49,796, which is only 0.1 percent behind the Intel chip. Intel Core i5-14600KF trails by 0.9 percent with a score of 49,394. Two rivals sit slightly ahead: Intel Core i9-13980HX scores 50,398, 1.1 percent higher, and AMD Ryzen AI 9 HX PRO 370 scores 50,448, 1.2 percent higher. These margins are narrow, indicating the Core 9 273PE performs within a tight cluster of high-end processors.

The Qualcomm Snapdragon X1P-46-100 has an average benchmark score of zero and a percentile ranking of 50. With no benchmark entries in the database, the recorded data provides no quantitative performance comparisons for this chip. The wins counter shows zero for both processors, as no head-to-head benchmark results exist to determine victories.

Architecture Differences

The Intel Core 9 273PE uses a 10 nm process node fabricated by Intel itself, while the Qualcomm Snapdragon X1P-46-100 is built on a 4 nm node from TSMC. The smaller process node gives the Qualcomm chip a manufacturing advantage in transistor density and power efficiency, though the Intel chip compensates with a higher boost clock.

The Intel processor features 12 cores and 24 threads, indicating hyperthreading support. The Qualcomm chip has 8 cores and 8 threads, meaning each core handles a single thread. Intel's core count advantage is 50 percent, and its thread count advantage is 200 percent. The Intel base clock is 2.30 GHz with a boost clock of 5.70 GHz, while the Qualcomm chip runs at a base of 3.40 GHz and boosts to 4.00 GHz. The Qualcomm chip has a higher base clock but a significantly lower boost ceiling.

Cache hierarchies differ substantially. The Intel chip provides 80 KB of L1 cache per core, 2 MB of L2 per core, and 36 MB of shared L3 cache. The Qualcomm chip offers 288 KB of L1 per core, 12 MB of L2 per module, and 6 MB of shared L3 cache. Qualcomm's L1 cache is 3.6 times larger per core, and its L2 allocation per module is substantial, but Intel's shared L3 is six times larger.

Memory support diverges completely. Intel supports both DDR4 and DDR5 with dual-channel memory and a bandwidth of 89.6 GB/s. Qualcomm supports only LPDDR5X with dual-channel memory and a higher bandwidth of 135.2 GB/s. The Qualcomm chip's memory bandwidth is 50.9 percent higher, which benefits integrated graphics and memory-intensive workloads. Intel supports ECC memory, while Qualcomm does not.

PCIe connectivity also differs. Intel uses Gen 5 with 16 CPU lanes, while Qualcomm uses Gen 4 with 12 lanes. Intel's PCIe Gen 5 doubles the per-lane bandwidth of Gen 4, and its 16 lanes provide more expansion capacity. Integrated graphics differ as well: Intel pairs with UHD Graphics 730, while Qualcomm integrates Adreno X1-45.

The Intel chip targets the desktop market segment and uses Intel Socket 1700. The Qualcomm chip targets mobile and uses Qualcomm BGA 2073. The Intel processor consumes 65 watts of TDP, while the Qualcomm chip consumes 30 watts, making the latter more power-efficient on paper. The Intel chip is based on the Bartlett Lake codename within the Core 9 generation, while Qualcomm uses the Oryon codename within the Snapdragon X Plus generation. The Intel chip released on March 8, 2026, while the Qualcomm chip released on September 2, 2024, giving Qualcomm an 18-month head start in the market.

FAQ

Q: Which processor has more cores and threads?

A: The Intel Core 9 273PE has 12 cores and 24 threads. The Qualcomm Snapdragon X1P-46-100 has 8 cores and 8 threads. Intel leads by 4 cores and 16 threads.

Q: What is the boost clock difference between the two chips?

A: The Intel Core 9 273PE boosts to 5.70 GHz, while the Qualcomm Snapdragon X1P-46-100 boosts to 4.00 GHz. Intel's boost clock is 1.70 GHz higher.

Q: How does memory bandwidth compare?

A: The Qualcomm Snapdragon X1P-46-100 supports LPDDR5X memory with 135.2 GB/s bandwidth. The Intel Core 9 273PE supports DDR4 and DDR5 with 89.6 GB/s bandwidth. Qualcomm's bandwidth is 45.6 GB/s higher.

Q: Which chip supports ECC memory?

A: The Intel Core 9 273PE supports ECC memory. The Qualcomm Snapdragon X1P-46-100 does not support ECC memory.

Q: What process nodes do the two processors use?

A: The Intel Core 9 273PE uses a 10 nm process from Intel's own foundry. The Qualcomm Snapdragon X1P-46-100 uses a 4 nm process from TSMC.

Q: How do the TDP ratings differ?

A: The Intel Core 9 273PE has a TDP of 65 watts. The Qualcomm Snapdragon X1P-46-100 has a TDP of 30 watts. Qualcomm's chip consumes 35 watts less.

Specification Differences

| Specification | Intel Core 9 273PE | Qualcomm Snapdragon X1P-46-100 |

|----------------|--------------------|--------------------------------|

| Cores | 12 | 8 |

| Threads | 24 | 8 |

| Base Clock | 2.30 GHz | 3.40 GHz |

| Boost Clock | 5.70 GHz | 4.00 GHz |

| TDP | 65 W | 30 W |

| Socket | Intel Socket 1700 | Qualcomm BGA 2073 |

| Codename | Bartlett Lake | Oryon |

| Generation | Core 9 (Bartlett Lake) | Snapdragon X (Plus) |

| Process Node | 10 nm | 4 nm |

| Foundry | Intel | TSMC |

| L1 Cache | 80 KB (per core) | 288 KB (per core) |

| L2 Cache | 2 MB (per core) | 12 MB (per module) |

| L3 Cache | 36 MB (shared) | 6 MB (shared) |

| Memory Support | DDR4, DDR5 | LPDDR5X |

| Memory Bandwidth | 89.6 GB/s | 135.2 GB/s |

| ECC Memory | Yes | No |

| PCIe | Gen 5, 16 Lanes (CPU only) | Gen 4, 12 Lanes (CPU only) |

| Integrated Graphics | UHD Graphics 730 | Adreno X1-45 |

| Market Segment | Desktop | Mobile |

| Release Date | 2026-03-08 | 2024-09-02 |

| Launch MSRP | $549 | Not provided |

Where Each One Wins

The Intel Core 9 273PE wins in scenarios that demand high multi-threaded throughput. Its 24 threads and 5.70 GHz boost clock produce a Cinebench R23 multicore score of 31,288, which suits video rendering, 3D simulation, and software compilation. The 36 MB of shared L3 cache provides ample capacity for large working sets, and the 65-watt TDP allows sustained performance in desktop systems with adequate cooling. The chip's ECC memory support makes it suitable for workstation-class reliability requirements. The PCIe Gen 5 interface with 16 lanes enables high-bandwidth expansion for graphics cards and NVMe storage. The desktop market segment positioning and Intel Socket 1700 compatibility indicate a system builder's part for full-size machines.

The Qualcomm Snapdragon X1P-46-100 wins in power-constrained and mobile scenarios. Its 30-watt TDP is less than half of Intel's, which favors thin-and-light laptops and fanless designs. The 4 nm TSMC process node provides a transistor-level efficiency advantage. The 135.2 GB/s memory bandwidth, 50.9 percent higher than Intel's, benefits integrated graphics performance and memory-bandwidth-sensitive applications. The 288 KB L1 cache per core, 3.6 times larger than Intel's, can improve single-threaded latency for frequently accessed data. The mobile market segment and BGA 2073 socket indicate a permanently mounted, space-efficient platform.

The Intel chip's Cinebench R15 single-core score of 445 and R20 single-core score of 1,855 show strong per-thread performance, which matters for legacy applications and lightly threaded workloads. Its PassMark single-thread score of 3,650 aligns with this strength. The Qualcomm chip's higher base clock of 3.40 GHz could provide consistent performance in sustained workloads, but its lower 4.00 GHz boost ceiling limits peak single-thread performance. The Qualcomm chip's 8 threads constrain heavily parallel workloads, while Intel's 24 threads excel in parallel execution.

The Intel Core 9 273PE's average benchmark score of 49,845 places it at the 90th percentile of all CPUs in the database, with nearest rivals within a 1.2 percent margin. The Qualcomm Snapdragon X1P-46-100 has no recorded benchmark scores, so its performance position remains undetermined. The Intel chip's production status is active, and its release date of 2026-03-08 indicates a recent entry into the market. The Qualcomm chip's release date of 2024-09-02 shows a more established product cycle. The database records no head-to-head benchmark wins for either processor, leaving direct performance comparisons unresolved until benchmark data for the Qualcomm chip becomes available.