Intel Core 7 160HL vs Qualcomm Snapdragon X2E-78-100 Comparison

Intel
INTEL

Intel Core 7 160HL

CORE STATE Raptor Lake-PS
CORE SPECS 14 Cores / 20 Threads
CLOCK SPEED 2.5 Base / 5.2 GHz Turbo
CACHE 24 MB (shared)
MAX TDP 45W
ARCHITECTURE Raptor Lake
nm
PROCESS 10 nm
LAUNCH DATE 2024
VS
Unknown
CPU

Snapdragon X2E-78-100

CORE STATE Glymur
CORE SPECS 12 Cores / 12 Threads
CLOCK SPEED 4 Base
CACHE —
MAX TDP —
ARCHITECTURE Glymur
nm
PROCESS 3 nm
LAUNCH DATE 2026

Analysis: Intel Core 7 160HL vs Qualcomm Snapdragon X2E-78-100

The Verdict

The database records two processors with distinct design philosophies and target platforms. The Intel Core 7 160HL is a 14-core, 20-thread desktop part built on Intel's 10 nm Raptor Lake architecture, while the Qualcomm Snapdragon X2E-78-100 is a 12-core, 12-thread mobile processor fabricated on TSMC's 3 nm process with the Glymur codename. Both parts sit at the 50th percentile among all CPUs in the database, yet their architectural profiles suggest different optimizations. The Intel part offers a higher thread count (20 versus 12) and a boost clock of 5.20 GHz, which positions it for workloads that scale with parallel execution and single-thread burst activity. The Qualcomm part counters with a higher base clock of 4.00 GHz, a significantly larger per-core L1 cache (288 KB versus 80 KB), and a shared 16 MB L2 cache, alongside a memory bandwidth of 152.4 GB/s. For desktop users running heavy multithreaded applications, the Intel part's thread advantage is the primary differentiator in the recorded data. For mobile users prioritizing sustained throughput per core and memory bandwidth, the Qualcomm part presents the stronger profile. Neither part has recorded benchmark scores in the database, so the verdict rests on architectural specifications and platform characteristics rather than measured performance results.

Where Each One Wins

The Intel Core 7 160HL wins in thread-heavy scenarios. Its 14 cores and 20 threads provide a 66.7% thread count advantage over the Qualcomm part's 12 threads. This means applications that spawn many concurrent tasks, such as compilation pipelines, rendering batches, or database workloads, have more scheduling headroom. The Intel part also reaches a boost clock of 5.20 GHz, which gives it a peak frequency ceiling that the Qualcomm part does not list. The Intel processor uses DDR4 and DDR5 memory, giving platform designers flexibility in memory selection, and it integrates Iris Xe Graphics with 96 execution units. The Intel part targets the desktop segment with an Intel Socket 1700, a mature platform with broad ecosystem support.

The Qualcomm Snapdragon X2E-78-100 wins in per-core efficiency and memory throughput. Its base clock of 4.00 GHz is 60% higher than the Intel part's 2.50 GHz base clock, indicating that every core sustains a higher operating frequency without relying on boost states. The L1 cache is 288 KB per core, which is 3.6 times larger than the Intel part's 80 KB per core, reducing latency for frequently accessed data. The L2 cache is 16 MB shared, while the Intel part uses 2 MB per core (totaling 28 MB across 14 cores, but with per-core partitioning). The Qualcomm part's memory bandwidth of 152.4 GB/s is a recorded specification that the Intel part lacks, suggesting a wider or faster memory interface. The Qualcomm part uses LPDDR5X memory, which is optimized for mobile power envelopes. It integrates an Adreno X2-85 GPU and supports PCIe Gen 5 with 12 lanes, compared to the Intel part's PCIe Gen 4 with 8 lanes. The Qualcomm part is fabricated on a 3 nm TSMC process with a die size of 220 mm², while the Intel part uses Intel's 10 nm process with no die size recorded. The mobile segment designation and BGA 2343 socket reinforce its role in compact, power-sensitive systems.

Architecture Differences

The two processors diverge at the fundamental level of manufacturing and design. The Intel Core 7 160HL uses Intel's 10 nm process and is built on the Raptor Lake architecture with the Raptor Lake-PS codename. It belongs to the Core 7 generation and is produced by Intel. The Qualcomm Snapdragon X2E-78-100 uses TSMC's 3 nm process, a smaller node that generally permits higher transistor density and lower power consumption per operation. Its codename is Glymur, and it belongs to the Snapdragon X2 Elite generation. The die size of the Qualcomm part is recorded as 220 mm², whereas no die size is listed for the Intel part.

Core organization differs sharply. The Intel part has 14 cores and 20 threads, implying a hybrid arrangement with performance and efficiency cores, though the database does not explicitly list the core types. The Qualcomm part has 12 cores and 12 threads, meaning it does not use simultaneous multithreading. All 12 threads operate at a base clock of 4.00 GHz, which is uniform across the chip. The Intel part has a base clock of 2.50 GHz and a boost clock of 5.20 GHz, indicating frequency scaling across cores under load. The Intel part's cache hierarchy includes 80 KB of L1 per core, 2 MB of L2 per core, and 24 MB of shared L3 cache. The Qualcomm part has 288 KB of L1 per core and 16 MB of shared L2, with no L3 cache recorded. The Qualcomm part's L1 cache is substantially larger per core, which can improve single-thread performance for working sets that fit in L1.

Memory support also separates the two. The Intel part supports both DDR4 and DDR5 over a dual-channel memory bus, with no memory bandwidth figure recorded. The Qualcomm part supports LPDDR5X over a dual-channel bus, with a recorded memory bandwidth of 152.4 GB/s. This bandwidth figure suggests a wide memory interface suited for integrated graphics and data-intensive workloads. The Intel part's integrated graphics are Iris Xe with 96 execution units, while the Qualcomm part uses Adreno X2-85. PCIe connectivity differs as well: the Intel part provides Gen 4 with 8 CPU lanes, while the Qualcomm part provides Gen 5 with 12 CPU lanes. The Qualcomm part's newer PCIe generation and higher lane count give it more headroom for external devices such as GPUs or NVMe storage.

Power and platform characteristics further distinguish the parts. The Intel part has a recorded TDP of 45 watts, while the Qualcomm part has no TDP recorded. The Intel part uses Intel Socket 1700 and is classified as a desktop part. The Qualcomm part uses Qualcomm BGA 2343 and is classified as mobile. Neither part supports ECC memory. The Intel part does not have a recorded launch MSRP, and neither does the Qualcomm part. The Intel part was released on 2024-04-07, while the Qualcomm part has a release date of 2026-04-05, indicating a later market entry. Both parts are currently marked as Active in production status. The Qualcomm part has a part number of X2E78100, while the Intel part's part number is listed as unknown.

FAQ

Q: Which processor has more cores and threads?

A: The Intel Core 7 160HL has 14 cores and 20 threads. The Qualcomm Snapdragon X2E-78-100 has 12 cores and 12 threads. The Intel part provides 8 additional threads.

Q: What are the base clock speeds of the two processors?

A: The Intel Core 7 160HL has a base clock of 2.50 GHz and a boost clock of 5.20 GHz. The Qualcomm Snapdragon X2E-78-100 has a base clock of 4.00 GHz, with no boost clock recorded.

Q: How do the cache hierarchies compare?

A: The Intel part uses 80 KB of L1 per core, 2 MB of L2 per core, and 24 MB of shared L3. The Qualcomm part uses 288 KB of L1 per core and 16 MB of shared L2, with no L3 cache recorded.

Q: Which processor supports higher memory bandwidth?

A: The Qualcomm Snapdragon X2E-78-100 records a memory bandwidth of 152.4 GB/s with LPDDR5X support. The Intel Core 7 160HL lists DDR4 and DDR5 support but has no memory bandwidth figure recorded.

Q: What PCIe generations do the two processors use?

A: The Intel Core 7 160HL provides PCIe Gen 4 with 8 CPU lanes. The Qualcomm Snapdragon X2E-78-100 provides PCIe Gen 5 with 12 CPU lanes.

Q: What are the manufacturing process nodes?

A: The Intel Core 7 160HL is fabricated on Intel's 10 nm process. The Qualcomm Snapdragon X2E-78-100 is fabricated on TSMC's 3 nm process with a die size of 220 mm².

Head-to-Head Benchmarks

The database contains no recorded benchmark scores for either processor, and the head-to-head benchmark list is empty. The wins field shows zero wins for both parts. Without measured performance data, the comparison relies entirely on the recorded specifications. The most decisive specification difference is thread count: the Intel part delivers 20 threads versus 12, a 66.7% advantage. For multithreaded workloads, this is the largest numeric gap in the comparison. The Intel part also offers a boost clock of 5.20 GHz, which is 30% higher than the Qualcomm part's base clock of 4.00 GHz, though boost clocks and base clocks are not directly comparable. The Qualcomm part's base clock of 4.00 GHz is 60% higher than the Intel part's base clock of 2.50 GHz, indicating that the Qualcomm part sustains higher frequency at idle or moderate load.

Cache capacity is another area of divergence. The Qualcomm part's L1 cache of 288 KB per core is 3.6 times larger than the Intel part's 80 KB per core. For workloads with high temporal locality, this larger L1 can reduce memory access latency. The L2 cache configurations are not directly comparable: the Intel part allocates 2 MB per core, while the Qualcomm part shares 16 MB across all cores. The Intel part adds 24 MB of shared L3, which the Qualcomm part lacks entirely. Total on-chip cache is not directly comparable because the Intel part's L2 is per-core and its L3 is shared, while the Qualcomm part has only per-core L1 and shared L2.

Memory bandwidth is recorded only for the Qualcomm part at 152.4 GB/s. The Intel part has no bandwidth figure, so no direct comparison is possible. The Qualcomm part's LPDDR5X support and dual-channel bus are its recorded memory characteristics, while the Intel part supports both DDR4 and DDR5. The Qualcomm part's PCIe Gen 5 with 12 lanes exceeds the Intel part's PCIe Gen 4 with 8 lanes in both generation and lane count. The manufacturing process favors the Qualcomm part on paper: TSMC's 3 nm node is smaller than Intel's 10 nm node, and the Qualcomm die size is recorded at 220 mm². The Intel part's TDP is 45 watts, which is a fixed power target, while the Qualcomm part has no TDP recorded. The Intel part is a desktop processor on Socket 1700, released in 2024, while the Qualcomm part is a mobile processor on BGA 2343, released in 2026. The later release date and smaller process node suggest the Qualcomm part benefits from more recent fabrication technology, but the absence of benchmark data prevents any performance conclusion. The percentile ranking for both parts is identical at 50, placing them at the median of all CPUs in the database.

DETAILED SPECIFICATIONS

SPECIFICATION
7 160HL
Snapdragon X2E-78-100
Core Specs
Cores
14
12 -14.3%
Threads
20
12 -40.0%
Base Clock (GHz)
2.5
4 +60.0%
Boost Clock (GHz)
5.2
—
Frequency (GHz)
2.5
4 +60.0%
Turbo Clock (GHz)
5.2
—
Multiplier
25
40 +60.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
288 KB (per core)
L2 Cache
2 MB (per core)
16 MB (shared)
L3 Cache
24 MB (shared)
—
Power
TDP (W)
45
—
PL1
45 W
—
PL2
115 W
—
Architecture
Architecture
Raptor Lake
—
Codename
Raptor Lake-PS
Glymur
Generation
Core 7 (Raptor Lake-PS)
Snapdragon X2 (Elite)
Process Size
10 nm
3 nm
Die Size
—
220 mm²
Foundry
Intel
TSMC
Memory
Memory Support
DDR4, DDR5
LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
—
152.4 GB/s
ECC Memory
No
No
DDR4 Speed
3200 MT/s
—
DDR5 Speed
5200 MT/s
—
Platform
Socket
Intel Socket 1700
Qualcomm BGA 2343
PCIe
Gen 4, 8 Lanes(CPU only)
Gen 5, 12 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
P-Cores: 6 E-Cores: 8
6 + 6
E-Core Frequency
1800 MHz up to 4 GHz
3.4 GHz
AI/NPU
NPU
—
Yes / 80 TOPS
Graphics
Integrated Graphics
Iris Xe Graphics 96EU
Adreno X2-85
Other
Market
Desktop
Mobile
Production Status
Active
Active
Part Number
unknown
X2E78100
Package
FC-LGA16A
FC-BGA
Tj Max
100°C
—
View Core 7 160HL Details View Snapdragon X2E-78-100 Details