Intel Arc G3 vs Qualcomm Snapdragon X1P-26-100 Comparison

Intel
INTEL

Intel Arc G3

CORE STATE Panther Lake
CORE SPECS 14 Cores / 14 Threads
CLOCK SPEED 1.9 Base / 4.6 GHz Turbo
CACHE 18 MB (shared)
MAX TDP 25W
ARCHITECTURE Panther Lake
nm
PROCESS 3 nm
LAUNCH DATE 2026
VS
Unknown
CPU

Snapdragon X1P-26-100

CORE STATE Oryon
CORE SPECS 8 Cores / 8 Threads
CLOCK SPEED 3 Base
CACHE 6 MB (shared)
MAX TDP 25W
ARCHITECTURE Oryon
nm
PROCESS 4 nm
LAUNCH DATE 2024

Analysis: Intel Arc G3 vs Qualcomm Snapdragon X1P-26-100

Where Each One Wins

The benchmark data presents a clear functional split between these two mobile processors. The Intel Arc G3, built on the Panther Lake architecture, positions itself as the higher-core-count option with 14 cores and 14 threads, while the Qualcomm Snapdragon X1P-26-100 counters with 8 cores and 8 threads based on the Oryon architecture. Since the head-to-head benchmark results are empty and both processors hold an identical 50th percentile ranking among all CPUs, the recorded data does not provide a definitive performance winner in any specific workload category. Instead, the measurable differences lie in their structural and architectural characteristics.

The Intel Arc G3 wins on raw core count and thread count, offering 14 cores versus 8 cores and 14 threads versus 8 threads, which indicates a potential advantage in heavily multithreaded tasks such as content creation, compilation workloads, or virtualized environments. The Qualcomm Snapdragon X1P-26-100 wins on clock frequency at its base state, running at 3.00 GHz compared to the Intel part’s 1.90 GHz base clock. That higher base clock suggests the Snapdragon may deliver stronger single-thread responsiveness in lightly threaded scenarios where frequency dominates. However, the Intel part provides a boost clock of 4.60 GHz, while the Snapdragon’s boost clock is not recorded in the database, so peak single-core capability cannot be directly compared.

The integrated graphics also divide the two. The Intel Arc G3 ships with the Arc B370 iGPU, while the Qualcomm part uses the Adreno X1-45. Without benchmark scores for either GPU, the analysis must rely on architectural positioning. The Intel part’s Panther Lake generation and its higher core count suggest a design aimed at sustained productivity, while the Snapdragon’s Oryon design with a higher base clock targets efficiency-oriented mobile workloads. Both share a 25 TDP rating, indicating similar thermal envelopes, but the underlying design philosophies differ.

FAQ

Q: Which processor has more cores and threads?

A: The Intel Arc G3 has 14 cores and 14 threads. The Qualcomm Snapdragon X1P-26-100 has 8 cores and 8 threads. The Intel part offers 6 additional cores and 6 additional threads.

Q: What are the base clock speeds of each processor?

A: The Intel Arc G3 runs at a base clock of 1.90 GHz. The Qualcomm Snapdragon X1P-26-100 runs at a base clock of 3.00 GHz. The Snapdragon’s base clock is 1.10 GHz higher.

Q: Does the Intel Arc G3 have a boost clock?

A: Yes, the Intel Arc G3 has a boost clock of 4.60 GHz. The Qualcomm Snapdragon X1P-26-100 does not have a recorded boost clock in the database.

Q: What process nodes do these processors use?

A: The Intel Arc G3 uses a 3 nm process node fabricated by Intel. The Qualcomm Snapdragon X1P-26-100 uses a 4 nm process node fabricated by TSMC.

Q: How do their cache hierarchies differ?

A: The Intel Arc G3 has 192 KB of L1 cache per core, 2.5 MB of L2 cache per core, and 18 MB of shared L3 cache. The Qualcomm Snapdragon X1P-26-100 has 288 KB of L1 cache per core, 12 MB of L2 cache per module, and 6 MB of shared L3 cache.

Q: What PCIe generations and lane counts do they support?

A: The Intel Arc G3 supports PCIe Gen 5 with 4 lanes (CPU only). The Qualcomm Snapdragon X1P-26-100 supports PCIe Gen 4 with 12 lanes (CPU only). The Snapdragon offers 8 additional PCIe lanes but on an older generation.

Head-to-Head Benchmarks

The head-to-head benchmark table contains no entries, so no direct numerical comparisons of performance scores, frame rates, or throughput metrics exist in the database. Both processors also share an identical average benchmark score of 0, which reflects the absence of recorded benchmark data rather than a measured equivalence in performance. The percentile ranking for both sits at 50, placing each exactly at the median of all CPUs in the database, but this percentile is unaccompanied by any supporting score data.

Given the lack of benchmark numbers, the only quantitative comparisons available come from the specification fields. The Intel Arc G3 delivers a boost clock of 4.60 GHz, which exceeds the Snapdragon’s base clock of 3.00 GHz by 1.60 GHz. That delta represents the only recorded clock speed advantage for the Intel part. The Snapdragon’s base clock of 3.00 GHz exceeds the Intel part’s base clock of 1.90 GHz by 1.10 GHz, marking the Snapdragon’s only clock-related win. In memory bandwidth, the Intel Arc G3 records 136.5 GB/s, which is 1.3 GB/s higher than the Snapdragon’s 135.2 GB/s. That difference is narrow but measurable.

Core count differences are stark: the Intel part provides 14 cores versus 8 cores, a 6-core advantage. Thread count follows the same pattern with 14 threads versus 8 threads. Cache allocation also shows clear divergence. The Snapdragon has a larger per-core L1 cache at 288 KB versus 192 KB, a difference of 96 KB per core. The Snapdragon’s L2 cache is organized per module at 12 MB, while the Intel part allocates 2.5 MB per core. The Intel part’s shared L3 cache is 18 MB, which is 12 MB larger than the Snapdragon’s 6 MB shared L3. The aggregate cache picture favors the Intel part in total shared capacity, while the Snapdragon favors per-core L1 and per-module L2.

Specification Differences

The two processors differ across nearly every measurable specification field. Core and thread counts: Intel Arc G3 has 14 cores and 14 threads; Qualcomm Snapdragon X1P-26-100 has 8 cores and 8 threads. Base clocks: Intel runs at 1.90 GHz, Qualcomm at 3.00 GHz. Boost clocks: Intel provides 4.60 GHz, Qualcomm has no recorded boost clock. Both share a TDP of 25. Sockets differ: Intel uses BGA 2540, Qualcomm uses BGA 2073. Process nodes: Intel uses 3 nm fabricated by Intel, Qualcomm uses 4 nm fabricated by TSMC. Cache configurations: Intel has 192 KB L1 per core, 2.5 MB L2 per core, and 18 MB shared L3; Qualcomm has 288 KB L1 per core, 12 MB L2 per module, and 6 MB shared L3. Memory support: both use LPDDR5X with dual-channel memory buses. Memory bandwidth: Intel records 136.5 GB/s, Qualcomm records 135.2 GB/s. PCIe support: Intel uses Gen 5 with 4 lanes, Qualcomm uses Gen 4 with 12 lanes. Integrated graphics: Intel has Arc B370, Qualcomm has Adreno X1-45. Release dates: Intel released on 2026-05-27, Qualcomm released on 2024-08-27. Part numbers: Intel is SA4QZ, Qualcomm is X1P26100. Both have ECC memory set to false, both have unlocked multipliers set to false, and both target the mobile market segment with active production status.

Architecture Differences

The architectural split between the two parts reflects fundamentally different design sources. The Intel Arc G3 belongs to the Panther Lake codename and the Arc G3 generation, built on a 3 nm process node at Intel’s own foundry. The Qualcomm Snapdragon X1P-26-100 belongs to the Oryon codename and the Snapdragon X (Plus) generation, built on a 4 nm process node at TSMC. The Intel part uses a per-core cache design with 192 KB L1 and 2.5 MB L2 per core, plus an 18 MB shared L3. The Qualcomm part uses a per-module L2 arrangement of 12 MB, a 288 KB per-core L1, and a smaller 6 MB shared L3. The Intel part’s larger shared L3 suggests a design favoring broad data sharing across its 14 cores, while the Snapdragon’s larger per-core L1 and per-module L2 indicates a focus on localized data access with fewer cores.

The integrated graphics also differ by architecture. Intel pairs the Arc G3 with the Arc B370 iGPU, while Qualcomm pairs the Snapdragon with the Adreno X1-45. The PCIe implementations diverge: Intel supports Gen 5 but only 4 lanes, Qualcomm supports Gen 4 with 12 lanes. That trade-off means the Intel part offers a newer PCIe standard with fewer lanes, while the Qualcomm part offers an older standard with more lanes. The release timeline places the Qualcomm part in 2024, while the Intel part arrives in 2026, indicating the Intel design is substantially newer in the database’s recorded release dates. Both parts run on LPDDR5X memory with dual-channel buses, and both are locked against multiplier adjustments.

The Verdict

The recorded data points to distinct usage profiles. The Intel Arc G3, with 14 cores, 14 threads, a 4.60 GHz boost clock, and 18 MB of shared L3 cache, suits workloads that scale across many threads and require substantial shared cache. Its 3 nm process node and Intel foundry production indicate a newer manufacturing approach. The Qualcomm Snapdragon X1P-26-100, with a 3.00 GHz base clock and a 4 nm process node from TSMC, suits scenarios where sustained base frequency matters more than core count. Its 8 cores and 8 threads limit its multithreaded ceiling, but its higher base clock may deliver snappier single-threaded performance in everyday tasks.

Memory bandwidth barely separates them, with the Intel part ahead by 1.3 GB/s. The Snapdragon offers a wider PCIe connection at Gen 4 with 12 lanes, which may benefit systems needing more attached devices, while the Intel part’s Gen 5 with 4 lanes prioritizes per-lane speed over lane count. The Snapdragon’s earlier 2024 release date and its higher base clock suggest a mature, frequency-oriented design. The Intel part’s 2026 release date, higher core count, and larger shared L3 point toward a future-facing, throughput-oriented design. For users prioritizing multithreaded throughput, cache capacity, and the latest process node, the Intel Arc G3 delivers the structural advantages. For users prioritizing base clock speed, per-core L1 cache size, and PCIe lane count, the Qualcomm Snapdragon X1P-26-100 holds the edge. Neither part shows a benchmark-derived winner in the database, so the choice rests on the specification differences above.

DETAILED SPECIFICATIONS

SPECIFICATION
G3
Snapdragon X1P-26-100
Core Specs
Cores
14
8 -42.9%
Threads
14
8 -42.9%
Base Clock (GHz)
1.9
3 +57.9%
Boost Clock (GHz)
4.6
—
Frequency (GHz)
1.9
3 +57.9%
Turbo Clock (GHz)
4.6
—
Multiplier
19
30 +57.9%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
192 KB (per core)
288 KB (per core)
L2 Cache
2.5 MB (per core)
12 MB (per module)
L3 Cache
18 MB (shared)
6 MB (shared)
Power
TDP (W)
25
25 0.0%
PL2
—
35 W
Configurable TDP
15-45 W
—
Architecture
Codename
Panther Lake
Oryon
Generation
Arc G3 (Panther Lake)
Snapdragon X (Plus)
Process Size
3 nm
4 nm
Foundry
Intel
TSMC
Memory
Memory Support
LPDDR5X
LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
136.5 GB/s
135.2 GB/s
ECC Memory
No
No
Platform
Socket
Intel BGA 2540
Qualcomm BGA 2073
PCIe
Gen 5, 4 Lanes(CPU only)
Gen 4, 12 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
P-Cores: 2 E-Cores: 12
—
E-Core Frequency
1500 MHz up to 3.3 GHz
—
LP E-Cores
4
—
AI/NPU
NPU
Yes / 46 TOPS
Yes / 45 TOPS
Graphics
Integrated Graphics
Arc B370
Adreno X1-45
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
SA4QZ
X1P26100
Package
FC-BGA
FC-BGA
Tj Max
100°C
—
View Arc G3 Details View Snapdragon X1P-26-100 Details