CPU Comparison

A

AMD

AMD

AMD Sempron 3100+

CORE STATE Roma

CORE SPECS 1 Cores / 1 Threads

CLOCK SPEED 1800 Base

CACHE —

MAX TDP 25W

ARCHITECTURE K8

nm

PROCESS 90 nm

LAUNCH DATE 2005

VS

i

Intel

INTEL

Core i7-975

CORE STATE Bloomfield

CORE SPECS 4 Cores / 8 Threads

CLOCK SPEED 3.33 Base / 3.6 GHz Turbo

CACHE 8 MB (shared)

MAX TDP 130W

ARCHITECTURE Nehalem

nm

PROCESS 45 nm

LAUNCH DATE 2009

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

N/A

301

cinebench_cinebench_r20_multicore

N/A

1,256

cinebench_cinebench_r20_singlecore

N/A

177

cinebench_cinebench_r23_multicore

N/A

2,992

cinebench_cinebench_r23_singlecore

N/A

422

DETAILED SPECIFICATIONS

SPECIFICATION

Sempron 3100+

i7-975

Core Specs

Cores

1

4 +300.0%

Threads

1

8 +700.0%

Base Clock (GHz)

1,800

3.33 -99.8%

Boost Clock (GHz)

—

3.6

Frequency (GHz)

1,800

3.33 -99.8%

Turbo Clock (GHz)

—

3.6

Multiplier

9

25 +177.8%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

128 KB

64 KB (per core)

L2 Cache

256 KB

256 KB (per core)

L3 Cache

—

8 MB (shared)

Power

TDP (W)

25

130 +420.0%

Architecture

Architecture

K8

Nehalem

Codename

Roma

Bloomfield

Generation

Mobile Sempron (Roma)

Core i7 Extreme (Bloomfield)

Process Size

90 nm

45 nm

Transistors

69 million

731 million

Die Size

—

263 mm²

Foundry

—

Intel

Memory

Memory Support

—

DDR3

Memory Bus

Single-channel

Triple-channel

Memory Bandwidth

—

25.6 GB/s

ECC Memory

No

No

Platform

Socket

AMD Socket 754

Intel Socket 1366

PCIe

—

Gen 2

Graphics

Integrated Graphics

On certain motherboards (Chipset feature)

—

Other

Market

Mobile

Desktop

Production Status

End-of-life

End-of-life

Launch Price

—

$1059

Part Number

SMS3100BQX3LE

SLBEQ

Package

µPGA

FC-LGA8

Bundled Cooler

—

Yes

View Sempron 3100+ Details View Core i7-975 Details