AMD

AMD Sempron 3100+

AMD processor specifications and benchmark scores

1
Cores
1
Threads
GHz Boost
25W
TDP
Integrated GPU

At a Glance

AMD
Cores / Threads 1C / 1T
Base Clock 1800 GHz
TDP 25W
Architecture K8
Socket AMD Socket 754
nm
Process 90 nm
Released Jul 2005

AMD Sempron 3100+ Specifications

Sempron 3100+ Core Configuration

Processing cores and threading

The AMD Sempron 3100+ features 1 physical cores and 1 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
1
Threads
1
SMP CPUs
1

Sempron 3100+ Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Sempron 3100+ benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Sempron 3100+ by AMD can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
1800 GHz
Boost Clock
N/A
Multiplier
9x

AMD's Sempron 3100+ Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the Sempron 3100+ processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Sempron 3100+'s cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
128 KB
L2 Cache
256 KB

K8 Architecture & Process

Manufacturing and design details

The AMD Sempron 3100+ is built on AMD's 90 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in Sempron 3100+ incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
K8
Codename
Roma
Process Node
90 nm
Transistors
69 million
Generation
Mobile Sempron (Roma)

K8 Instruction Set Features

Supported CPU instructions and extensions

The Sempron 3100+ by AMD supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
AMD64

Sempron 3100+ Power & Thermal

TDP and power specifications

The AMD Sempron 3100+ has a TDP (Thermal Design Power) of 25W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
25W

AMD Socket 754 Platform & Socket

Compatibility information

The Sempron 3100+ uses the AMD Socket 754 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
AMD Socket 754
Package
µPGA
DDR5

AMD Socket 754 Memory Support

RAM compatibility and speeds

Memory support specifications for the Sempron 3100+ define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Sempron 3100+ determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Bus
Single-channel

AMD's Sempron 3100+ Integrated Graphics

Built-in GPU specifications

The AMD Sempron 3100+ includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the Sempron 3100+ provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
On certain motherboards (Chipset feature)
Graphics Model
On certain motherboards (Chipset feature)

Sempron 3100+ Product Information

Release and pricing details

The AMD Sempron 3100+ is manufactured by AMD and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Sempron 3100+ by AMD offers a specific balance of performance, features, and cost within AMD's product lineup.

Manufacturer
AMD
Release Date
Jul 2005
Market
Mobile
Status
End-of-life
Part Number
SMS3100BQX3LE

Sempron 3100+ Benchmark Scores

No benchmark data available for this CPU.

About AMD Sempron 3100+

The AMD Sempron 3100+ is a single-core, single-thread mobile processor built on the K8 architecture, and its benchmark data places it at the 50th percentile of all CPUs in the database. With a modest 1800 MHz base clock and no boost capability, this is a processor that prioritizes energy efficiency over raw performance, making it a niche part for specific legacy systems.

Single-Thread vs Multi-Thread Behavior

The Sempron 3100+ is strictly a single-threaded processor, featuring one core and one thread. This design means it can execute only one instruction stream at a time, completely lacking the parallel processing capabilities of multi-core parts. The data shows no multi-threaded benchmark score, which is expected given the hardware configuration, and the absence of a boost clock means the 1800 MHz frequency is the absolute ceiling under any workload.

For real workloads, this split is stark. Single-thread performance is the only performance metric that exists here, and the 1800 MHz clock on the K8 architecture determines all outcomes. Applications that are heavily serialized, such as older office suites or basic web browsing, will rely entirely on that single execution pipeline. Conversely, any modern workload that leverages multiple threads, such as video encoding or contemporary productivity suites, will see no benefit from additional logical processors—the processor simply cannot handle concurrent tasks. The data indicates that the 50th percentile ranking reflects a processor that sits in the middle of the historical performance distribution, but that middling position is entirely a function of single-thread capability.

Power and Thermals

The Sempron 3100+ carries a 25-watt TDP, which classifies it as a low-power part. This TDP figure is notably low, implying that thermal management is a straightforward affair. The data suggests that a simple passive cooler or a very small, low-profile active fan would be sufficient to maintain safe operating temperatures under sustained load.

This TDP class has significant implications for system design. It enables fanless or near-silent operation in compact chassis, and it reduces the overall thermal footprint inside a laptop or small-form-factor system. The 25-watt figure is the key specification here, as it directly informs the cooling tier required: this is not a processor that demands a high-end tower cooler or liquid cooling solution. A capable air cooler, even a low-profile one, would be more than adequate to handle the heat output. The 90 nm process node is consistent with this low-power profile, as smaller process nodes of that era typically correlated with reduced power draw compared to larger nodes.

How It Compares

The FACT PACK provides no nearest rivals, benchmark scores, or delta percentages, which means a direct comparative analysis against specific competitor models is not possible from the available data. The benchmark results are empty, and the nearestRivals array is blank.

Without rival data, the position of the Sempron 3100+ must be inferred solely from its absolute specifications. The single-core, single-thread configuration with a 1800 MHz clock places it in a distinct category compared to any dual-core or multi-threaded alternative. In any comparison, the Sempron 3100+ would be at a fundamental disadvantage in multi-threaded tasks because it lacks the hardware to execute them. Against other single-core parts of the same era, the 1800 MHz frequency and 256 KB of L2 cache would be the primary differentiators, but the lack of specific rival scores prevents a quantitative verdict.

Who Should Consider It

The benchmark data, while sparse, points to a very narrow set of use cases for the Sempron 3100+. This is not a processor for modern gaming, as contemporary titles require multi-core CPUs with far higher clock speeds and larger caches. The data shows zero benchmark scores, which means it has not been validated for any modern workload, and the single core would be a severe bottleneck.

For office use, the Sempron 3100+ could theoretically handle basic word processing or spreadsheet tasks that are single-threaded and not resource-intensive. The 1800 MHz clock is sufficient for such light duties, and the 25-watt TDP makes it suitable for a low-power office terminal. However, the lack of multi-threading means any background task, such as an antivirus scan or a system update, would cause noticeable slowdowns because the single core would be shared between foreground and background processes.

For creation workloads, the Sempron 3100+ is not a viable option. Video editing, 3D rendering, and photo manipulation all benefit from or require multi-threaded processing, and this processor has exactly one thread. The 128 KB of L1 cache and 256 KB of L2 cache are minimal, further limiting performance in data-intensive creation tasks. The mobile segment designation suggests it was intended for basic portable computing, not content creation.

Benchmark Performance

The benchmark performance section is defined by a single data point: an average benchmark score of zero and a percentile rank of 50. The zero score indicates that no benchmark results are recorded in the database, making any quantitative performance analysis impossible. The 50th percentile ranking is a placeholder position, not a measured performance outcome, as it is based on the empty benchmark array.

Without rival scores or delta percentages, the relative performance cannot be stated in exact terms. The processor’s 1800 MHz base clock, single core, and single thread are the only performance indicators available. In a hypothetical comparison, a processor with two cores at a similar clock speed would theoretically offer up to double the throughput in multi-threaded tasks, but no such rival is listed in the FACT PACK. The L2 cache of 256 KB is small, which would likely impact performance in workloads with larger working sets, but again, no comparative data exists to quantify this.

The data indicates that the Sempron 3100+ sits at the midpoint of all CPUs in the database, but this is a structural ranking based on its inclusion in the dataset, not a reflection of tested performance. The lack of benchmark scores is a significant limitation, and any claims about its speed relative to other parts must be grounded in its clock speed and core count rather than measured results.

Platform and Compatibility

The Sempron 3100+ uses the AMD Socket 754, a platform that was designed for single-channel memory operation. The memory bus is single-channel, which means the processor accesses memory through one 64-bit path, limiting memory bandwidth compared to dual-channel platforms. The FACT PACK does not list specific memory support details, so no exact memory type or speed can be stated, but the single-channel configuration is a clear bottleneck for memory-intensive applications.

The socket is part of the K8 architecture, which was AMD’s first 64-bit desktop and mobile architecture. The processor is based on the 90 nm process node and contains 69 million transistors. PCIe support is not listed, which is notable because the Socket 754 platform predates the widespread adoption of PCIe in some configurations; the data does not specify PCIe lanes or version. Integrated graphics are listed as "On certain motherboards (Chipset feature)," meaning the processor itself does not contain a GPU, but some motherboards with compatible chipsets could provide display output.

The upgrade path is essentially nonexistent. The Socket 754 was a transitional platform, and the Sempron 3100+ is a low-end part within that ecosystem. The production status is end-of-life, and the release date was July 2005. The processor is not multiplier-unlocked, so overclocking via multiplier adjustment is not possible. The part number is SMS3100BQX3LE, which identifies the specific mobile Sempron model.

FAQ

Q: How many cores and threads does the AMD Sempron 3100+ have?

A: The Sempron 3100+ has one core and one thread, making it a strictly single-threaded processor.

Q: What is the base clock speed of the Sempron 3100+?

A: The base clock speed is 1800.00 MHz, and there is no boost clock available.

Q: What is the TDP of this processor?

A: The thermal design power is 25 watts, which is a low-power classification suitable for simple cooling solutions.

Q: What socket does the Sempron 3100+ use?

A: It uses the AMD Socket 754, which supports single-channel memory operation.

Q: Does the Sempron 3100+ have integrated graphics?

A: The processor itself does not have integrated graphics, but display output may be available on certain motherboards as a chipset feature.

Q: Is the Sempron 3100+ still in production?

A: No, the production status is end-of-life, and it was released in July 2005.

The Intel Equivalent of Sempron 3100+

Looking for a similar processor from Intel? The Intel Core i5-750 offers comparable performance and features in the Intel lineup.

Intel Core i5-750

Intel • 4 Cores

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