CPU Comparison

AMD
AMD

AMD Sempron 3100+

CORE STATE Roma
CORE SPECS 1 Cores / 1 Threads
CLOCK SPEED 1800 Base
CACHE โ€”
MAX TDP 25W
ARCHITECTURE K8
nm
PROCESS 90 nm
LAUNCH DATE 2005
VS
Intel
INTEL

Core i7-620LM

CORE STATE Arrandale
CORE SPECS 2 Cores / 4 Threads
CLOCK SPEED 2000 Base / 2.8 GHz Turbo
CACHE 4 MB (shared)
MAX TDP 25W
ARCHITECTURE Westmere
nm
PROCESS 32 nm
LAUNCH DATE 2010

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
N/A
120
cinebench_cinebench_r20_multicore
N/A
501
cinebench_cinebench_r20_singlecore
N/A
70
cinebench_cinebench_r23_multicore
N/A
1,195
cinebench_cinebench_r23_singlecore
N/A
168
geekbench_multicore
N/A
636
geekbench_singlecore
N/A
379

DETAILED SPECIFICATIONS

SPECIFICATION
Sempron 3100+
i7-620LM
Core Specs
Cores
1
2 +100.0%
Threads
1
4 +300.0%
Base Clock (GHz)
1,800
2,000 +11.1%
Boost Clock (GHz)
โ€”
2.8
Frequency (GHz)
1,800
2,000 +11.1%
Turbo Clock (GHz)
โ€”
2.8
Multiplier
9
15 +66.7%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
128 KB
64 KB (per core)
L2 Cache
256 KB
256 KB (per core)
L3 Cache
โ€”
4 MB (shared)
Power
TDP (W)
25
25 0.0%
Architecture
Architecture
K8
Westmere
Codename
Roma
Arrandale
Generation
Mobile Sempron (Roma)
Core i7 (Arrandale)
Process Size
90 nm
32 nm
Transistors
69 million
382 million
Die Size
โ€”
81 mmยฒ
Foundry
โ€”
Intel
Memory
Memory Support
โ€”
DDR3
Memory Bus
Single-channel
Dual-channel
Memory Bandwidth
โ€”
17.1 GB/s
ECC Memory
No
No
Platform
Socket
AMD Socket 754
Intel BGA 1288
Chipsets
โ€”
PM55, HM55, QM57, HM57
PCIe
โ€”
Gen 2
Graphics
Integrated Graphics
On certain motherboards (Chipset feature)
HD Graphics (Ironlake)
Other
Market
Mobile
Mobile
Production Status
End-of-life
End-of-life
Launch Price
โ€”
$300
Part Number
SMS3100BQX3LE
SLBMLSLBSUQ4B8
Package
ยตPGA
mFCBGA10
Tj Max
โ€”
105ยฐC
View Sempron 3100+ Details View Core i7-620LM Details