CPU Comparison

A

AMD

AMD

AMD Sempron 3100+

CORE STATE Roma

CORE SPECS 1 Cores / 1 Threads

CLOCK SPEED 1800 Base

CACHE —

MAX TDP 25W

ARCHITECTURE K8

nm

PROCESS 90 nm

LAUNCH DATE 2005

VS

i

Intel

INTEL

Core i5-650

CORE STATE Clarkdale

CORE SPECS 2 Cores / 4 Threads

CLOCK SPEED 3.2 Base / 3.47 GHz Turbo

CACHE 4 MB (shared)

MAX TDP 73W

ARCHITECTURE Westmere

nm

PROCESS 32 nm

LAUNCH DATE 2010

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

N/A

192

cinebench_cinebench_r20_multicore

N/A

802

cinebench_cinebench_r20_singlecore

N/A

112

cinebench_cinebench_r23_multicore

N/A

1,911

cinebench_cinebench_r23_singlecore

N/A

269

DETAILED SPECIFICATIONS

SPECIFICATION

Sempron 3100+

i5-650

Core Specs

Cores

1

2 +100.0%

Threads

1

4 +300.0%

Base Clock (GHz)

1,800

3.2 -99.8%

Boost Clock (GHz)

—

3.47

Frequency (GHz)

1,800

3.2 -99.8%

Turbo Clock (GHz)

—

3.47

Multiplier

9

24 +166.7%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

128 KB

64 KB (per core)

L2 Cache

256 KB

256 KB (per core)

L3 Cache

—

4 MB (shared)

Power

TDP (W)

25

73 +192.0%

Architecture

Architecture

K8

Westmere

Codename

Roma

Clarkdale

Generation

Mobile Sempron (Roma)

Core i5 (Clarkdale)

Process Size

90 nm

32 nm

Transistors

69 million

382 million

Die Size

—

81 mm²

Foundry

—

Intel

Memory

Memory Support

—

DDR3

Memory Bus

Single-channel

Dual-channel

Memory Bandwidth

—

21.3 GB/s

ECC Memory

No

No

Platform

Socket

AMD Socket 754

Intel Socket 1156

Chipsets

—

Intel H57, Intel H55, Intel P55

PCIe

—

Gen 2, 16 Lanes(CPU only)

Graphics

Integrated Graphics

On certain motherboards (Chipset feature)

Intel HD

Other

Market

Mobile

Desktop

Production Status

End-of-life

End-of-life

Launch Price

—

$176

Part Number

SMS3100BQX3LE

SLBTJSLBLK

Package

µPGA

FC-LGA10

View Sempron 3100+ Details View Core i5-650 Details