AMD Ryzen AI Embedded P164i vs Intel Core 3 201TE Comparison

FAQ

Q: What are the core and thread counts for the AMD Ryzen AI Embedded P164i and the Intel Core 3 201TE?

A: The AMD Ryzen AI Embedded P164i has 8 cores and 16 threads, while the Intel Core 3 201TE has 4 cores and 8 threads.

Q: Which processor has the higher boost clock?

A: The AMD Ryzen AI Embedded P164i boosts up to 5.00 GHz, which is higher than the Intel Core 3 201TE's 4.60 GHz boost clock.

Q: How do the two processors differ in process node technology?

A: The AMD Ryzen AI Embedded P164i uses a 4 nm process from TSMC, while the Intel Core 3 201TE uses a 10 nm process fabricated by Intel.

Q: Which processor supports PCIe Gen 5?

A: The Intel Core 3 201TE supports PCIe Gen 5 with 16 lanes (CPU only), whereas the AMD Ryzen AI Embedded P164i supports PCIe Gen 4 with 16 lanes (CPU only).

Q: What memory types does each processor support?

A: The AMD Ryzen AI Embedded P164i supports DDR5 and LPDDR5X memory, while the Intel Core 3 201TE supports DDR4 and DDR5 memory.

Q: What is the thermal design power (TDP) for each processor?

A: The AMD Ryzen AI Embedded P164i has a TDP of 28 watts, while the Intel Core 3 201TE has a TDP of 45 watts.

Architecture Differences

The AMD Ryzen AI Embedded P164i, codenamed Gorgon Point, belongs to the Ryzen AI Embedded generation built on a hybrid of Zen 5 and Zen 5c cores. It uses an 8-core, 16-thread configuration with a base clock of 2.00 GHz and a boost clock of 5.00 GHz. The silicon is manufactured on a 4 nm process at TSMC, with a die size of 233 mm². Cache distribution includes 80 KB of L1 per core, 1 MB of L2 per core, and 8 MB of L3 cache. This processor integrates Radeon 880M graphics, supports dual-channel DDR5 and LPDDR5X memory with a bandwidth of 89.6 GB/s, and includes ECC memory support. It is designed for the mobile market segment and uses AMD Socket FP8.

The Intel Core 3 201TE, codenamed Bartlett Lake, offers a 4-core, 8-thread layout with a base clock of 2.90 GHz and a boost clock of 4.60 GHz. It is manufactured on a 10 nm process at Intel, with a die size of 163 mm². The cache hierarchy provides 80 KB of L1 per core, 1.25 MB of L2 per core, and 12 MB of shared L3 cache. Integrated graphics come in the form of UHD Graphics 730. Memory support covers DDR4 and DDR5 in dual-channel configuration, with a bandwidth of 76.8 GB/s, and ECC memory is supported. This part targets the desktop segment on Intel Socket 1700 and carries a part number of SRPKDQ5CK.

Key architectural differences include core count, process node, cache layout, integrated GPU, memory types, and PCIe generation. The AMD part offers double the cores and threads, a finer process node, and a larger die. The Intel part provides a higher base clock, more L3 cache, and PCIe Gen 5 connectivity. The AMD processor's L3 cache is 8 MB total, while the Intel processor's L3 is 12 MB shared. L2 cache per core favors Intel at 1.25 MB versus AMD's 1 MB. Both processors support ECC memory, but the memory types differ: AMD supports LPDDR5X in addition to DDR5, while Intel supports DDR4 in addition to DDR5. The AMD processor's memory bandwidth is higher at 89.6 GB/s compared to 76.8 GB/s for Intel. The market segments differ as well, with AMD positioned as a mobile part and Intel as a desktop part.

Head-to-Head Benchmarks

The database contains no recorded benchmark scores for either processor. Both the AMD Ryzen AI Embedded P164i and the Intel Core 3 201TE show an average benchmark score of 0, and no head-to-head benchmark entries are available. The percentile versus all CPUs stands at 50 for both parts, indicating a neutral position in the absence of measured performance data. No wins are recorded for either side in direct comparison, as the winsA and winsB fields are both zero.

Without benchmark results, performance conclusions must rely on architectural specifications. The AMD processor's core advantage is substantial in parallel workloads. With 8 cores and 16 threads versus 4 cores and 8 threads, the AMD part can handle twice as many threads simultaneously. This suggests a clear advantage in multi-threaded applications such as compilation, rendering, or virtualization. The boost clock difference also favors AMD, with 5.00 GHz versus 4.60 GHz, which can benefit single-threaded performance when the workload scales with frequency.

The Intel processor counters with a higher base clock of 2.90 GHz versus 2.00 GHz. This means at idle or low-load states, the Intel part runs at a higher frequency. The larger shared L3 cache of 12 MB on Intel versus 8 MB on AMD could improve cache hit rates in certain workloads. Intel also supports PCIe Gen 5, which offers double the bandwidth of PCIe Gen 4 for compatible devices, potentially benefiting data-intensive peripherals. The Intel part's smaller die size of 163 mm² versus AMD's 233 mm² indicates a simpler manufacturing footprint, though the process node difference (10 nm Intel versus 4 nm TSMC) changes the density comparison.

The AMD processor's memory bandwidth of 89.6 GB/s exceeds Intel's 76.8 GB/s. This provides a measurable advantage in memory-bound tasks. The support for LPDDR5X on AMD gives additional flexibility for low-power memory configurations, while Intel's DDR4 support allows for lower-cost memory implementations. Both processors support ECC memory, which is relevant for embedded and reliability-focused deployments.

The Verdict

The data indicates that the AMD Ryzen AI Embedded P164i is the stronger choice for workloads that scale with core count and memory bandwidth. Its 8-core, 16-thread configuration, combined with a 5.00 GHz boost clock and 89.6 GB/s memory bandwidth, positions it for parallel processing tasks. The 4 nm process node from TSMC suggests better power efficiency per transistor, and the 28 W TDP confirms a lower thermal envelope. This processor targets the mobile segment, making it suitable for compact or power-constrained systems.

The Intel Core 3 201TE, with 4 cores and 8 threads, a 4.60 GHz boost clock, and 12 MB of shared L3 cache, offers a different trade-off. Its 45 W TDP allows for higher sustained power delivery. The PCIe Gen 5 support provides a forward-looking interface for high-bandwidth peripherals. The desktop market segment and Intel Socket 1700 compatibility indicate a traditional desktop deployment path. The higher base clock of 2.90 GHz means the Intel part operates at a higher frequency even before boost engagement.

The absence of benchmark data means no measured performance ranking can be assigned. The percentile versus all CPUs is identical for both parts at 50, reflecting the lack of recorded scores. The architectural analysis shows AMD leading in core count, threads, boost clock, process node, memory bandwidth, and integrated GPU capabilities (Radeon 880M versus UHD Graphics 730). Intel leads in base clock, L2 cache per core, L3 cache total, PCIe generation, and die size efficiency.

For multi-threaded throughput, the AMD processor's doubled core and thread count provides a structural advantage that no other specification difference can offset. For single-threaded latency-sensitive tasks, the higher base clock and larger L3 cache on Intel may reduce average access times. The launch MSRP for the Intel Core 3 201TE is $134, which provides a reference point for that part. The AMD processor has no recorded launch MSRP in the database.

Specification Differences

| Specification | AMD Ryzen AI Embedded P164i | Intel Core 3 201TE |

|----------------|-----------------------------|--------------------|

| Cores | 8 | 4 |

| Threads | 16 | 8 |

| Base Clock | 2.00 GHz | 2.90 GHz |

| Boost Clock | 5.00 GHz | 4.60 GHz |

| TDP | 28 W | 45 W |

| Socket | AMD Socket FP8 | Intel Socket 1700 |

| Codename | Gorgon Point | Bartlett Lake |

| Generation | Ryzen AI Embedded (Zen 5 / Zen 5c) | Core 3 (Bartlett Lake) |

| Process Node | 4 nm | 10 nm |

| Foundry | TSMC | Intel |

| Die Size | 233 mm² | 163 mm² |

| L1 Cache | 80 KB (per core) | 80 KB (per core) |

| L2 Cache | 1 MB (per core) | 1.25 MB (per core) |

| L3 Cache | 8 MB | 12 MB (shared) |

| Memory Support | DDR5, LPDDR5X | DDR4, DDR5 |

| Memory Bus | Dual-channel | Dual-channel |

| Memory Bandwidth | 89.6 GB/s | 76.8 GB/s |

| ECC Memory | Yes | Yes |

| PCIe | Gen 4, 16 Lanes (CPU only) | Gen 5, 16 Lanes (CPU only) |

| Integrated Graphics | Radeon 880M | UHD Graphics 730 |

| Market Segment | Mobile | Desktop |

| Production Status | Active | Active |

| Release Date | 2026-03-08 | 2025-01-12 |

| Launch MSRP | None recorded | $134 |

| Multiplier Unlocked | No | No |

| Part Number | Unknown | SRPKDQ5CK |