AMD Ryzen AI Embedded P164i vs Intel Arc G3 Comparison

AMD
AMD

AMD Ryzen AI Embedded P164i

CORE STATE Gorgon Point
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 2 Base / 5 GHz Turbo
CACHE 8 MB
MAX TDP 28W
ARCHITECTURE Gorgon Point
nm
PROCESS 4 nm
LAUNCH DATE 2026
VS
Intel
INTEL

Arc G3

CORE STATE Panther Lake
CORE SPECS 14 Cores / 14 Threads
CLOCK SPEED 1.9 Base / 4.6 GHz Turbo
CACHE 18 MB (shared)
MAX TDP 25W
ARCHITECTURE Panther Lake
nm
PROCESS 3 nm
LAUNCH DATE 2026

Analysis: AMD Ryzen AI Embedded P164i vs Intel Arc G3

FAQ

Q: What are the core and thread counts for each processor?

A: The AMD Ryzen AI Embedded P164i has 8 cores and 16 threads, while the Intel Arc G3 has 14 cores and 14 threads. The Intel part offers more physical cores, but the AMD part provides more threads.

Q: Which processor has a higher boost clock?

A: The AMD Ryzen AI Embedded P164i boosts up to 5.00 GHz, which is higher than the Intel Arc G3's boost clock of 4.60 GHz.

Q: What process nodes are used by these two chips?

A: The AMD Ryzen AI Embedded P164i is built on TSMC's 4 nm process, while the Intel Arc G3 uses Intel's 3 nm process node.

Q: Do both processors support ECC memory?

A: No. The AMD Ryzen AI Embedded P164i supports ECC memory, whereas the Intel Arc G3 does not.

Q: What integrated graphics do they feature?

A: The AMD Ryzen AI Embedded P164i includes a Radeon 880M, and the Intel Arc G3 includes an Arc B370.

Q: What is the memory bandwidth difference?

A: The Intel Arc G3 has a memory bandwidth of 136.5 GB/s, which is notably higher than the AMD Ryzen AI Embedded P164i's 89.6 GB/s.

The Verdict

The data from the database shows two distinct mobile processors aimed at different priorities. The AMD Ryzen AI Embedded P164i delivers a higher boost clock at 5.00 GHz and supports ECC memory, making it a candidate for workloads where data integrity and high single-thread speed matter. The Intel Arc G3 counters with more physical cores, a larger shared L3 cache (18 MB versus 8 MB), a smaller 3 nm process node, and significantly higher memory bandwidth at 136.5 GB/s.

Neither processor has recorded benchmark scores or wins in head-to-head testing in the database, so direct performance rankings are unavailable. Both share a 50th percentile rating among all CPUs. The choice depends on specific feature requirements. For memory bandwidth and multi-core physical core count, the Intel Arc G3 is the stronger option. For ECC support, a higher boost clock, and a dual-channel DDR5 memory path, the AMD Ryzen AI Embedded P164i is the more suitable choice.

Users who rely on ECC memory for error correction in compute tasks should select the AMD part. Users who need maximum memory throughput and a higher core count should consider the Intel part. The Intel chip also uses a smaller 3 nm process, which typically indicates a more advanced manufacturing node.

Head-to-Head Benchmarks

The database contains no recorded head-to-head benchmark results for these two processors. There are no wins recorded for either side, and no benchmark scores are listed for either the AMD Ryzen AI Embedded P164i or the Intel Arc G3. Consequently, a measured performance comparison cannot be derived from the available data. The only quantitative comparisons come from their specification sheets.

The AMD part's boost clock of 5.00 GHz is 0.40 GHz higher than the Intel Arc G3's 4.60 GHz. This suggests an advantage in single-threaded tasks that rely on maximum frequency, although no benchmark confirms this. The Intel part's base clock of 1.90 GHz is 0.10 GHz lower than the AMD's 2.00 GHz, but its core count is 14 versus 8, which could favor multi-threaded workloads if the cores scale efficiently.

Memory bandwidth is a clear differentiator. The Intel Arc G3 records 136.5 GB/s, which is 46.9 GB/s higher than the AMD Ryzen AI Embedded P164i's 89.6 GB/s. For memory-intensive applications, this gap could be substantial. The Intel part also has a larger L3 cache at 18 MB shared, compared to AMD's 8 MB, and larger per-core L1 and L2 caches. These memory-related differences are the most concrete measurable advantages in the database.

Specification Differences

The two processors differ across several specification fields. The AMD Ryzen AI Embedded P164i uses an AMD Socket FP8, while the Intel Arc G3 uses an Intel BGA 2540 socket. The AMD part has a TDP of 28 watts, and the Intel part has a TDP of 25 watts, a three-watt difference.

Memory support differs: the AMD chip supports DDR5 and LPDDR5X, while the Intel chip supports only LPDDR5X. Both use a dual-channel memory bus. ECC memory is supported on the AMD part, but not on the Intel part. The AMD processor provides PCIe Gen 4 with 16 lanes (CPU only), whereas the Intel processor provides PCIe Gen 5 with 4 lanes (CPU only). This indicates a trade-off between lane count and interface generation.

Process nodes differ as well: the AMD part uses TSMC's 4 nm process, and the Intel part uses Intel's own 3 nm process. The AMD die size is recorded as 233 mm², but the Intel die size is not listed. Cache configurations differ substantially. The AMD part has 80 KB L1 per core, 1 MB L2 per core, and 8 MB L3. The Intel part has 192 KB L1 per core, 2.5 MB L2 per core, and 18 MB shared L3. The Intel part has a larger cache at every level.

Release dates differ by roughly two and a half months, with the AMD part listed for March 2026 and the Intel part for May 2026. Both are marked as Active in production status, and both have locked multipliers. The Intel part has a recorded part number of SA4QZ, while the AMD part's part number is unknown. Neither has a launch MSRP in the database.

Architecture Differences

The AMD Ryzen AI Embedded P164i comes from the Gorgon Point codename and belongs to the Ryzen AI Embedded generation, which uses a combination of Zen 5 and Zen 5c cores. The Intel Arc G3 belongs to the Panther Lake codename and the Arc G3 generation. These are architecturally distinct designs from different manufacturers.

The AMD part is built on TSMC's 4 nm node, while the Intel part uses Intel's 3 nm node. The foundry difference is notable: AMD relies on TSMC, and Intel uses its own fabrication. The AMD die size is 233 mm²; the Intel die size is not recorded.

Core architecture differs in both count and threading. The AMD part provides 8 cores and 16 threads, indicating simultaneous multithreading. The Intel part provides 14 cores and 14 threads, meaning one thread per core. This is a fundamental design difference. The AMD part's Zen 5 / Zen 5c hybrid arrangement likely mixes high-performance and high-efficiency cores, while the Intel part's Panther Lake architecture uses its own core layout.

Cache hierarchy is also different. The AMD part has 80 KB of L1 per core, 1 MB of L2 per core, and 8 MB of L3. The Intel part has 192 KB of L1 per core, 2.5 MB of L2 per core, and 18 MB of shared L3. The Intel part's larger per-core caches and larger L3 pool indicate a different approach to data locality and memory latency management.

The integrated graphics differ: the AMD part includes a Radeon 880M, and the Intel part includes an Arc B370. These are separate GPU architectures from AMD and Intel respectively. The memory controller differs as well, with the AMD part supporting DDR5 and LPDDR5X, while the Intel part supports only LPDDR5X. The Intel part has a higher memory bandwidth at 136.5 GB/s, which reflects its memory architecture.

PCIe support differs in generation and lane count. The AMD part uses PCIe Gen 4 with 16 lanes, and the Intel part uses PCIe Gen 5 with 4 lanes. This means the AMD part offers more physical lanes for expansion, while the Intel part offers a newer interface standard with fewer lanes.

Where Each One Wins

The AMD Ryzen AI Embedded P164i wins in several specific areas. It has a higher boost clock at 5.00 GHz, which favors workloads that depend on maximum single-core frequency. It supports ECC memory, which is critical for applications where data corruption is unacceptable, such as financial modeling, scientific computing, or server-like tasks. The AMD part also supports DDR5 memory, providing a broader memory compatibility range. Its PCIe Gen 4 with 16 lanes offers more expansion capability for multiple devices. The AMD part also has a lower TDP at 28 watts versus 25 watts, a minor difference, but it still reflects a power envelope suitable for mobile deployment. Its die size is recorded at 233 mm², which may indicate a larger physical package.

The Intel Arc G3 wins in areas related to memory throughput and cache capacity. It has 14 physical cores versus 8, which could benefit multi-threaded workloads that scale with core count, provided the software can use them. Its memory bandwidth is 136.5 GB/s, substantially higher than the AMD part's 89.6 GB/s. This gives it an edge in memory-bound tasks such as large data set processing, video editing, or analytics. Its L3 cache is 18 MB shared, more than double the AMD part's 8 MB. Per-core L1 and L2 caches are also larger, which can reduce memory latency for frequently accessed data. The Intel part uses a 3 nm process node, which is smaller than the AMD part's 4 nm node, potentially offering better transistor density. Its PCIe Gen 5 interface, while limited to 4 lanes, provides higher per-lane bandwidth for compatible devices. The Intel part also has a base clock of 1.90 GHz, which is close to the AMD part's 2.00 GHz.

For workloads where ECC support and high boost frequency are non-negotiable, the AMD Ryzen AI Embedded P164i is the clear selection. For workloads where memory bandwidth, cache size, and physical core count take priority, the Intel Arc G3 is the better fit. The database does not provide benchmark results to confirm these theoretical advantages, so these conclusions are drawn strictly from the specification differences recorded.

DETAILED SPECIFICATIONS

SPECIFICATION
AI Embedded P164i
G3
Core Specs
Cores
8
14 +75.0%
Threads
16
14 -12.5%
Base Clock (GHz)
2
1.9 -5.0%
Boost Clock (GHz)
5
4.6 -8.0%
Frequency (GHz)
2
1.9 -5.0%
Turbo Clock (GHz)
5
4.6 -8.0%
Multiplier
20
19 -5.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
192 KB (per core)
L2 Cache
1 MB (per core)
2.5 MB (per core)
L3 Cache
8 MB
18 MB (shared)
Power
TDP (W)
28
25 -10.7%
Configurable TDP
15-54 W
15-45 W
Architecture
Codename
Gorgon Point
Panther Lake
Generation
Ryzen AI Embedded (Zen 5 / Zen 5c)
Arc G3 (Panther Lake)
Process Size
4 nm
3 nm
Die Size
233 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5, LPDDR5X
LPDDR5X
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
136.5 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket FP8
Intel BGA 2540
PCIe
Gen 4, 16 Lanes(CPU only)
Gen 5, 4 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
3 + 5
P-Cores: 2 E-Cores: 12
E-Core Frequency
2000 MHz up to 3.3 GHz
1500 MHz up to 3.3 GHz
LP E-Cores
4
AI/NPU
NPU
Yes / 50 TOPS
Yes / 46 TOPS
Graphics
Integrated Graphics
Radeon 880M
Arc B370
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
unknown
SA4QZ
Package
FP8
FC-BGA
Tj Max
105°C
100°C
View Ryzen AI Embedded P164i Details View Arc G3 Details