AMD Ryzen AI Embedded P164 vs Intel Core 3 201TE Comparison

AMD
AMD

AMD Ryzen AI Embedded P164

CORE STATE Gorgon Point
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 2 Base / 5 GHz Turbo
CACHE 8 MB
MAX TDP 28W
ARCHITECTURE Gorgon Point
nm
PROCESS 4 nm
LAUNCH DATE 2026
VS
Intel
INTEL

Core 3 201TE

CORE STATE Bartlett Lake
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 2.9 Base / 4.6 GHz Turbo
CACHE 12 MB (shared)
MAX TDP 45W
ARCHITECTURE Bartlett Lake
nm
PROCESS 10 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

passmark_data_compression
327,891
N/A
passmark_data_encryption
16,055
N/A
passmark_extended_instructions
24,193
N/A
passmark_find_prime_numbers
71
N/A
passmark_floating_point_math
55,799
N/A
passmark_integer_math
87,940
N/A
passmark_multithread
25,889
N/A
passmark_physics
1,210
N/A
passmark_random_string_sorting
34,801
N/A
passmark_single_thread
4,029
N/A
passmark_singlethread
4,029
N/A

Analysis: AMD Ryzen AI Embedded P164 vs Intel Core 3 201TE

Head-to-Head Benchmarks

The recorded data does not include any direct head-to-head benchmark comparisons between the AMD Ryzen AI Embedded P164 and the Intel Core 3 201TE. The database contains a complete set of PassMark results for the AMD part, while the Intel Core 3 201TE has no benchmark entries listed. This absence of comparable measurements means a traditional side-by-side score comparison cannot be produced from the available facts.

What can be established is the AMD processor's standalone performance profile. Its average benchmark score is 52,901, placing it in the 91st percentile of all CPUs tracked in the database. The nearest rival measurements confirm its standing: the AMD Ryzen 5 9500F scores 52,873, a delta of 0.1 percent, and the Intel Xeon 634 scores 52,974, a delta of -0.1 percent. The AMD EPYC 7313P trails by 0.6 percent with a score of 53,206, and the AMD Ryzen 9 7900X is behind by 0.7 percent at 53,288. These figures indicate the P164 sits within a tight performance cluster, effectively matching those established desktop and server parts in aggregate workload results.

Looking at the individual PassMark sub-tests, the P164 shows notable strengths in specific operations. It scores 327,891 in data compression, 87,940 in integer math, and 55,799 in floating point math. Single-thread performance is recorded at 4,029, while multithread performance is 25,889. Extended instructions yield 24,193, and random string sorting achieves 34,801. Data encryption scores 16,055, physics checks come in at 1,210, and find prime numbers posts 71.

The Intel Core 3 201TE, by contrast, has no recorded benchmark scores in the database. Its percentile rank is listed as 50, but with an average benchmark score of 0, this percentile figure cannot be validated against any measured workload. The data therefore provides no basis for determining which processor wins any specific test. Wins are recorded as 0 for both parts because no head-to-head measurements exist.

Where Each One Wins

Without head-to-head benchmark data, the analysis shifts to architectural capabilities and recorded specifications. The AMD Ryzen AI Embedded P164 delivers 8 cores and 16 threads, whereas the Intel Core 3 201TE provides 4 cores and 8 threads. In multi-threaded workloads that scale with core count, the AMD part has a structural advantage based on core and thread availability. Its boost clock reaches 5.00 GHz, compared to 4.60 GHz for the Intel part, which may benefit single-threaded tasks if the AMD processor can sustain that frequency under load.

The AMD processor uses a 4 nm process from TSMC, while the Intel part uses a 10 nm process from Intel. Smaller process nodes typically enable higher transistor density and improved power efficiency per unit of work, though the database does not provide direct efficiency measurements. The AMD die is 233 mm², while the Intel die is 163 mm². Cache configurations differ: the AMD part has 80 KB L1 per core, 1 MB L2 per core, and 8 MB of L3. The Intel part also has 80 KB L1 per core, but 1.25 MB L2 per core and 12 MB of shared L3. Larger L3 cache on the Intel side may help with workloads that exhibit high cache reuse.

Memory bandwidth favors the AMD processor, which supports DDR5 and LPDDR5X with a recorded bandwidth of 89.6 GB/s. The Intel part supports DDR4 and DDR5 with 76.8 GB/s. Both use dual-channel memory buses and both support ECC memory. PCIe connectivity differs: the AMD part provides Gen 4 with 16 lanes (CPU only), while the Intel part provides Gen 5 with 16 lanes (CPU only). Gen 5 doubles the per-lane bandwidth compared to Gen 4, which may matter for storage or GPU workloads that utilize the PCIe interface.

Integrated graphics also distinguish the two. The AMD part uses a Radeon 880M, while the Intel part uses UHD Graphics 730. The database does not include graphics benchmark scores, so relative iGPU performance cannot be quantified. Market segments differ as well: the AMD part targets mobile platforms, while the Intel part targets desktop systems. Release dates show the Intel part arrived on 2025-01-12, while the AMD part arrived later on 2026-03-08.

Architecture Differences

The AMD Ryzen AI Embedded P164 is built on the Gorgon Point codename, part of the Ryzen AI Embedded generation using Zen 5 and Zen 5c cores. The Intel Core 3 201TE uses the Bartlett Lake codename, part of the Core 3 generation. These represent distinct architectural lineages from the two manufacturers.

Process technology diverges sharply. AMD uses a 4 nm node fabricated by TSMC, while Intel uses a 10 nm node fabricated by its own foundry. The die sizes reflect this difference: AMD's die measures 233 mm², Intel's measures 163 mm². The smaller process node allows AMD to pack 8 cores into a larger die area, while Intel fits 4 cores into a smaller die with larger per-core L2 cache.

Cache architecture shows a fundamental difference in organization. The AMD part allocates 1 MB of L2 per core and 8 MB of L3, which is not labeled as shared in the database. The Intel part allocates 1.25 MB of L2 per core and 12 MB of shared L3. The L3 cache on the Intel side is explicitly shared, whereas the AMD L3 is listed without a sharing qualifier. Per-core L1 cache is identical at 80 KB for both.

Memory controllers differ in supported types. AMD supports DDR5 and LPDDR5X, the latter being a low-power variant suited to mobile platforms. Intel supports DDR4 and DDR5, retaining compatibility with older DDR4 memory. Both use dual-channel buses, but the measured bandwidth favors AMD at 89.6 GB/s versus 76.8 GB/s for Intel.

PCIe generation is a notable architectural split. AMD provides Gen 4 connectivity with 16 CPU-only lanes. Intel provides Gen 5 connectivity with 16 CPU-only lanes. The newer Gen 5 standard doubles the theoretical bandwidth per lane, which may be relevant for high-throughput peripherals, but the database does not include practical throughput measurements.

Socket compatibility also differs. The AMD part uses AMD Socket FP8, a mobile-oriented socket. The Intel part uses Intel Socket 1700, a desktop socket that has been widely used across multiple Intel generations. These socket differences align with the respective market segments: mobile for AMD, desktop for Intel.

Specification Differences

The two processors differ across nearly every recorded specification field. Core count stands at 8 for AMD versus 4 for Intel. Thread count is 16 versus 8. Base clocks are 2.00 GHz for AMD and 2.90 GHz for Intel, meaning the Intel part starts at a higher frequency, while the AMD part boosts higher at 5.00 GHz versus 4.60 GHz.

Thermal design power differs substantially. The AMD part is rated at 28 W, while the Intel part is rated at 45 W. This indicates the AMD processor is designed for lower power envelopes, consistent with its mobile market segment, while the Intel part targets desktop platforms with higher power delivery.

Memory bandwidth is recorded at 89.6 GB/s for AMD and 76.8 GB/s for Intel. The AMD part supports DDR5 and LPDDR5X, while the Intel part supports DDR4 and DDR5. Both support ECC memory. Process node is 4 nm for AMD (TSMC) and 10 nm for Intel (Intel foundry). Die size is 233 mm² for AMD and 163 mm² for Intel.

Cache specifications differ in L2 and L3. AMD has 1 MB L2 per core and 8 MB L3. Intel has 1.25 MB L2 per core and 12 MB shared L3. L1 is identical at 80 KB per core. PCIe capability is Gen 4 with 16 lanes for AMD and Gen 5 with 16 lanes for Intel. Integrated graphics are Radeon 880M for AMD and UHD Graphics 730 for Intel.

Market segments are mobile for AMD and desktop for Intel. Release dates are 2026-03-08 for AMD and 2025-01-12 for Intel. The multiplier is locked on both parts. The Intel part has a recorded part number of SRPKDQ5CK, while the AMD part number is listed as unknown. The Intel launch MSRP is $134, stated once here as recorded in the database.

FAQ

Q: Which processor has more cores and threads?

A: The AMD Ryzen AI Embedded P164 has 8 cores and 16 threads. The Intel Core 3 201TE has 4 cores and 8 threads.

Q: What are the boost clock speeds of each processor?

A: The AMD part boosts to 5.00 GHz, while the Intel part boosts to 4.60 GHz. The base clocks are 2.00 GHz for AMD and 2.90 GHz for Intel.

Q: How does memory bandwidth compare between the two?

A: The AMD processor records 89.6 GB/s of memory bandwidth, while the Intel processor records 76.8 GB/s. Both use dual-channel memory buses, but AMD supports DDR5 and LPDDR5X, whereas Intel supports DDR4 and DDR5.

Q: What are the TDP ratings?

A: The AMD Ryzen AI Embedded P164 is rated at 28 W. The Intel Core 3 201TE is rated at 45 W.

Q: Which processor supports PCIe Gen 5?

A: The Intel Core 3 201TE supports PCIe Gen 5 with 16 lanes (CPU only). The AMD Ryzen AI Embedded P164 supports PCIe Gen 4 with 16 lanes (CPU only).

Q: What is the process node and foundry for each?

A: The AMD part uses a 4 nm process from TSMC. The Intel part uses a 10 nm process from Intel. Die sizes are 233 mm² for AMD and 163 mm² for Intel.

Q: Do both processors support ECC memory?

A: Yes, both the AMD Ryzen AI Embedded P164 and the Intel Core 3 201TE support ECC memory.

DETAILED SPECIFICATIONS

SPECIFICATION
AI Embedded P164
3 201TE
Core Specs
Cores
8
4 -50.0%
Threads
16
8 -50.0%
Base Clock (GHz)
2
2.9 +45.0%
Boost Clock (GHz)
5
4.6 -8.0%
Frequency (GHz)
2
2.9 +45.0%
Turbo Clock (GHz)
5
4.6 -8.0%
Multiplier
20
29 +45.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
80 KB (per core)
L2 Cache
1 MB (per core)
1.25 MB (per core)
L3 Cache
8 MB
12 MB (shared)
Power
TDP (W)
28
45 +60.7%
PL1
45 W
PL2
106 W
Configurable TDP
15-54 W
Architecture
Codename
Gorgon Point
Bartlett Lake
Generation
Ryzen AI Embedded (Zen 5 / Zen 5c)
Core 3 (Bartlett Lake)
Process Size
4 nm
10 nm
Die Size
233 mm²
163 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR5, LPDDR5X
DDR4, DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
76.8 GB/s
ECC Memory
Yes
Yes
DDR4 Speed
3200 MT/s
Platform
Socket
AMD Socket FP8
Intel Socket 1700
Chipsets
W680, R680E, Q670e, Q670, H610E, H610
PCIe
Gen 4, 16 Lanes(CPU only)
Gen 5, 16 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
3 + 5
E-Core Frequency
2000 MHz up to 3.3 GHz
AI/NPU
NPU
Yes / 50 TOPS
Graphics
Integrated Graphics
Radeon 880M
UHD Graphics 730
Other
Market
Mobile
Desktop
Production Status
Active
Active
Launch Price
$134
Part Number
unknown
SRPKDQ5CK
Package
FP8
FC-LGA16A
Tj Max
105°C
100°C
View Ryzen AI Embedded P164 Details View Core 3 201TE Details