AMD Ryzen AI 9 HX PRO 475 vs Intel Processor U303L Comparison
AMD Ryzen AI 9 HX PRO 475
Processor U303L
PERFORMANCE BENCHMARKS
Analysis: AMD Ryzen AI 9 HX PRO 475 vs Intel Processor U303L
The Verdict
The AMD Ryzen AI 9 HX PRO 475 is the clear performance leader in this comparison. The recorded data shows a 94th percentile ranking among all CPUs, with an average benchmark score of 74,496. The Intel Processor U303L sits at the 50th percentile, which places it in the middle of the database rather than at the top. The AMD part delivers a 12-core, 24-thread configuration with a boost clock of 5.20 GHz, while the Intel part offers 5 cores, 6 threads, and a 2.60 GHz boost. This is not a close contest on raw compute.
The Intel Processor U303L does have one notable advantage: it is a lower-power design at 15 W TDP versus 28 W for the AMD chip. Systems built around the Intel part can target more power-constrained chassis. The AMD part, however, is the one for workloads that need sustained multi-threaded throughput. The data indicates that the AMD processor is the correct selection for users prioritizing compute density and high single-thread performance. The Intel part is for scenarios where a lighter power envelope is the primary constraint, and where the workload is modest enough to run within a 5-core, 6-thread design.
Where Each One Wins
The AMD Ryzen AI 9 HX PRO 475 wins on every measurable performance axis in this database. Its 12 cores and 24 threads give it a massive structural advantage in parallel workloads. The 5.20 GHz boost clock positions it strongly for latency-sensitive tasks that depend on single-thread speed. The PassMark single-thread score of 4,301 confirms that this part is not just a multi-core specialist; it also has strong per-core capability.
The Intel Processor U303L has no benchmark entries in the database, so there are no recorded wins for it in any test category. Its case rests entirely on its specification profile. The 15 W TDP is the lowest in this pairing, making it suitable for fanless or very compact designs. It supports DDR4 and DDR5 memory, which gives system designers flexibility in memory selection. Its 12 MB of shared L3 cache is smaller than the AMD part's 16 MB, but the Intel architecture uses a different cache layout with 1.25 MB of L2 per core versus 1 MB per core on the AMD side. The Intel part also uses the Intel Socket 1700 platform, which is a well-established socket in the database.
For users who need to run heavily threaded applications such as rendering, compilation, or data processing, the AMD part is the only rational choice from the recorded data. For users who need a low-power processor for basic tasks within a 15 W envelope, the Intel part is the one that fits that requirement.
Architecture Differences
The AMD Ryzen AI 9 HX PRO 475 uses the Zen 5 architecture under the Gorgon Point codename. It belongs to the Ryzen AI PRO 400 generation, which combines Zen 5 and Zen 5c cores. The process node is 4 nm at TSMC. The die size is 233 mm². The cache hierarchy uses 80 KB of L1 per core, 1 MB of L2 per core, and a 16 MB L3 cache. Memory support covers DDR5 and LPDDR5X over a dual-channel bus, with 89.6 GB/s of memory bandwidth. ECC memory is supported. The integrated graphics are Radeon 890M. The socket is AMD Socket FP8, and the CPU provides Gen 4 PCIe with 16 lanes.
The Intel Processor U303L uses the Raptor Lake architecture under the Raptor Lake-PS codename. It is part of the Intel Processor generation. The process node is 10 nm at Intel's own foundry. The cache hierarchy uses 80 KB of L1 per core, 1.25 MB of L2 per core, and 12 MB of shared L3. Memory support covers DDR4 and DDR5 over a dual-channel bus; no memory bandwidth figure is recorded in the database. ECC memory is not supported. The integrated graphics are UHD Graphics 96EU. The socket is Intel Socket 1700, and the CPU provides Gen 4 PCIe with 8 lanes.
These are fundamentally different designs. The AMD part is built on a newer, denser 4 nm process at TSMC, while the Intel part uses Intel's 10 nm process. The AMD part has more than double the core count and four times the thread count. The AMD part also carries a larger L3 cache and a higher boost clock. The Intel part has a higher L2 allocation per core and supports DDR4, which the AMD part does not. The Intel part also has a lower TDP and a launch MSRP of $285, stated once for the record.
FAQ
Q: Which processor has more cores and threads?
A: The AMD Ryzen AI 9 HX PRO 475 has 12 cores and 24 threads. The Intel Processor U303L has 5 cores and 6 threads.
Q: What are the boost clock speeds of the two processors?
A: The AMD Ryzen AI 9 HX PRO 475 boosts to 5.20 GHz. The Intel Processor U303L boosts to 2.60 GHz.
Q: Which processor supports ECC memory?
A: The AMD Ryzen AI 9 HX PRO 475 supports ECC memory. The Intel Processor U303L does not.
Q: What memory types does each processor support?
A: The AMD Ryzen AI 9 HX PRO 475 supports DDR5 and LPDDR5X. The Intel Processor U303L supports DDR4 and DDR5.
Q: How do the two processors compare in the database percentile ranking?
A: The AMD Ryzen AI 9 HX PRO 475 ranks in the 94th percentile among all CPUs. The Intel Processor U303L ranks in the 50th percentile.
Q: What is the TDP difference between the two?
A: The AMD Ryzen AI 9 HX PRO 475 has a 28 W TDP. The Intel Processor U303L has a 15 W TDP.
Head-to-Head Benchmarks
There are no direct head-to-head benchmark entries recorded between the AMD Ryzen AI 9 HX PRO 475 and the Intel Processor U303L. The Intel part has no benchmark scores in the database at all, so a side-by-side test-by-test comparison is not possible. The available data instead comes from the AMD part's individual benchmark results and its nearest rival comparisons.
The AMD Ryzen AI 9 HX PRO 475 posts an average benchmark score of 74,496. Its nearest rival, the AMD Ryzen 9 9950X, has an average score of 74,640, which places the Ryzen AI 9 HX PRO 475 at a delta of -0.2 percent. The AMD Ryzen 7 PRO 9745 scores 74,761, a delta of -0.4 percent. The AMD EPYC 4545P scores 75,373, a delta of -1.2 percent. The Intel Core Ultra 9 285 scores 75,488, a delta of -1.3 percent. This places the Ryzen AI 9 HX PRO 475 within 1.3 percent of some of the highest-scoring parts in the database, which is a narrow margin for a mobile processor.
In individual PassMark tests, the AMD part shows strength across the board. The multi-thread score is 36,487. The integer math score is 126,829. The floating point math score is 79,887. The data compression score is 461,650. The data encryption score is 23,132. The extended instructions score is 31,969. The find prime numbers score is 130. The physics score is 1,877. The random string sorting score is 48,894. The single-thread score is 4,301.
The Intel Processor U303L has no corresponding scores, so the database cannot show where it would land on these tests. What the data does show is that the AMD part performs at a level comparable to desktop-class flagship processors, while the Intel part has no recorded performance data to compare. The structural differences in core count, thread count, and clock speed strongly suggest the AMD part would dominate in every PassMark category, but the database records no direct evidence for the Intel part's scores.
Specification Differences
The two processors differ in nearly every major specification field.
| Specification | AMD Ryzen AI 9 HX PRO 475 | Intel Processor U303L |
|---|---|---|
| Cores | 12 | 5 |
| Threads | 24 | 6 |
| Base clock | 2.00 GHz | 1.20 GHz |
| Boost clock | 5.20 GHz | 2.60 GHz |
| TDP | 28 W | 15 W |
| Socket | AMD Socket FP8 | Intel Socket 1700 |
| Architecture | Zen 5 | Raptor Lake |
| Codename | Gorgon Point | Raptor Lake-PS |
| Generation | Ryzen AI PRO 400 (Zen 5 / Zen 5c) | Intel Processor (Raptor Lake) |
| Process node | 4 nm | 10 nm |
| Foundry | TSMC | Intel |
| Die size | 233 mm² | Not recorded |
| L1 cache | 80 KB per core | 80 KB per core |
| L2 cache | 1 MB per core | 1.25 MB per core |
| L3 cache | 16 MB | 12 MB shared |
| Memory support | DDR5, LPDDR5X | DDR4, DDR5 |
| Memory bus | Dual-channel | Dual-channel |
| Memory bandwidth | 89.6 GB/s | Not recorded |
| ECC memory | Yes | No |
| PCIe | Gen 4, 16 lanes (CPU only) | Gen 4, 8 lanes (CPU only) |
| Integrated graphics | Radeon 890M | UHD Graphics 96EU |
| Market segment | Mobile | Mobile |
| Production status | Active | Active |
| Release date | 2026-01-04 | 2024-04-07 |
| Multiplier unlocked | No | No |
| Part number | 100-000001683 | SRPKEQ5CV |
The AMD part is newer, with a release date of 2026-01-04 versus 2024-04-07 for the Intel part. The AMD part uses a smaller 4 nm process at TSMC, while the Intel part uses a 10 nm process at Intel. The AMD part has double the L3 cache and double the PCIe lanes. The Intel part has a slightly larger L2 allocation per core and adds DDR4 support. The Intel part has a lower TDP and a launch MSRP of $285. Every other specification field favors the AMD part in raw capability.