CPU Comparison

A

AMD

AMD

AMD Ryzen 9 3900

CORE STATE Matisse

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3.1 Base / 4.3 GHz Turbo

CACHE 64 MB

MAX TDP 65W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2019

VS

A

AMD

AMD

Ryzen 9 9955HX3D

CORE STATE Fire Range

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 2.5 Base / 5.4 GHz Turbo

CACHE 128 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,619

5,289

cinebench_cinebench_r15_singlecore

369

746

cinebench_cinebench_r20_multicore

10,914

22,039

cinebench_cinebench_r20_singlecore

1,540

3,111

cinebench_cinebench_r23_multicore

25,988

52,475

cinebench_cinebench_r23_singlecore

3,669

7,408

passmark_data_compression

413,887

762,606

passmark_data_encryption

26,657

38,516

passmark_extended_instructions

26,073

60,405

passmark_find_prime_numbers

203

521

passmark_floating_point_math

56,730

140,559

passmark_integer_math

97,698

219,084

passmark_multithread

30,586

61,403

passmark_physics

1,617

4,653

passmark_random_string_sorting

44,902

81,627

passmark_single_thread

2,604

4,492

passmark_singlethread

2,604

4,492

DETAILED SPECIFICATIONS

SPECIFICATION

9 3900

9 9955HX3D

Core Specs

Cores

12

16 +33.3%

Threads

24

32 +33.3%

Base Clock (GHz)

3.1

2.5 -19.4%

Boost Clock (GHz)

4.3

5.4 +25.6%

Frequency (GHz)

3.1

2.5 -19.4%

Turbo Clock (GHz)

4.3

5.4 +25.6%

Multiplier

31

25 -19.4%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

64 MB

128 MB (shared)

Power

TDP (W)

65

55 -15.4%

PPT

88 W

74-101 W

Configurable TDP

—

75 W

Architecture

Architecture

Zen 2

Zen 5

Codename

Matisse

Fire Range

Generation

Ryzen 9 (Zen 2 (Matisse))

Ryzen 9 (Zen 5 (Fire Range))

Process Size

7 nm

4 nm

Transistors

7,600 million

16,630 million

Die Size

2x 74 mm²

2x 70.6 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

DDR5

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

51.2 GB/s

89.6 GB/s

ECC Memory

No

Yes

Platform

Socket

AMD Socket AM4

AMD Socket FL1

Chipsets

A300, X300, A320, B350, X370, B450, X470, A520, B550, X570

—

PCIe

Gen 4, 24 Lanes(CPU only)

Gen 5, 28 Lanes(CPU only)

AMD Multi-Die

IO Process Size

12 nm

6 nm

Graphics

Integrated Graphics

—

Radeon 610M

Other

Market

Desktop

Mobile

Production Status

Active

Active

Launch Price

$499

—

Part Number

100-000000070

100-000001030

Package

µOPGA-1331

µFC-BGAFL1

Tj Max

95°C

100°C

Bundled Cooler

—

None

View Ryzen 9 3900 Details View Ryzen 9 9955HX3D Details