CPU Comparison

A

AMD

AMD

AMD Ryzen 9 3900X

CORE STATE Matisse

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3.8 Base / 4.6 GHz Turbo

CACHE 64 MB

MAX TDP 105W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2019

VS

A

AMD

AMD

Ryzen Embedded V2546

CORE STATE Renoir

CORE SPECS 6 Cores / 12 Threads

CLOCK SPEED 3 Base / 3.95 GHz Turbo

CACHE 8 MB (shared)

MAX TDP 35W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2020

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,788

827

cinebench_cinebench_r15_singlecore

393

116

cinebench_cinebench_r20_multicore

11,618

3,446

cinebench_cinebench_r20_singlecore

1,640

486

cinebench_cinebench_r23_multicore

27,662

8,207

cinebench_cinebench_r23_singlecore

3,905

1,158

geekbench_multicore

9,924

N/A

geekbench_singlecore

1,708

N/A

passmark_data_compression

448,906

136,097

passmark_data_encryption

28,586

8,046

passmark_extended_instructions

29,221

8,799

passmark_find_prime_numbers

214

22

passmark_floating_point_math

58,434

18,534

passmark_integer_math

99,628

30,739

passmark_multithread

32,544

9,656

passmark_physics

1,794

441

passmark_random_string_sorting

48,300

13,926

passmark_single_thread

2,703

1,609

passmark_singlethread

2,703

1,609

DETAILED SPECIFICATIONS

SPECIFICATION

9 3900X

Embedded V2546

Core Specs

Cores

12

6 -50.0%

Threads

24

12 -50.0%

Base Clock (GHz)

3.8

3 -21.1%

Boost Clock (GHz)

4.6

3.95 -14.1%

Frequency (GHz)

3.8

3 -21.1%

Turbo Clock (GHz)

4.6

3.95 -14.1%

Multiplier

38

30 -21.1%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

64 KB (per core)

L2 Cache

512 KB (per core)

512 KB (per core)

L3 Cache

64 MB

8 MB (shared)

Power

TDP (W)

105

35 -66.7%

PPT

142 W

—

Configurable TDP

—

54 W

Architecture

Architecture

Zen 2

Zen 2

Codename

Matisse

Renoir

Generation

Ryzen 9 (Zen 2 (Matisse))

Ryzen Embedded (Zen 2 (Renoir))

Process Size

7 nm

7 nm

Transistors

7,600 million

9,800 million

Die Size

2x 74 mm²

156 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

DDR4

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

51.2 GB/s

51.2 GB/s

ECC Memory

No

Yes

Platform

Socket

AMD Socket AM4

AMD Socket FP6

Chipsets

A300, X300, A320, B350, X370, B450, X470, A520, B550, X570

—

PCIe

Gen 4, 24 Lanes(CPU only)

Gen 3, 20 Lanes(CPU only)

AMD Multi-Die

IO Process Size

12 nm

—

Graphics

Integrated Graphics

—

Radeon Graphics 384SP

Other

Market

Desktop

Desktop

Production Status

Active

Active

Launch Price

$499

—

Part Number

100-000000023100-100000023BOX100-100000023MPK

100-000000246

Package

µOPGA-1331

FP6

Tj Max

—

105°C

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