CPU Comparison

A

AMD

AMD

AMD Ryzen 9 3900X

CORE STATE Matisse

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3.8 Base / 4.6 GHz Turbo

CACHE 64 MB

MAX TDP 105W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2019

VS

i

Intel

INTEL

Core i7-1068NG7

CORE STATE Ice Lake-U

CORE SPECS 4 Cores / 8 Threads

CLOCK SPEED 2.3 Base / 4.1 GHz Turbo

CACHE 8 MB (shared)

MAX TDP 28W

ARCHITECTURE Ice Lake

nm

PROCESS 10 nm

LAUNCH DATE 2019

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,788

789

cinebench_cinebench_r15_singlecore

393

111

cinebench_cinebench_r20_multicore

11,618

3,291

cinebench_cinebench_r20_singlecore

1,640

464

cinebench_cinebench_r23_multicore

27,662

7,836

cinebench_cinebench_r23_singlecore

3,905

1,106

geekbench_multicore

9,924

N/A

geekbench_singlecore

1,708

N/A

passmark_data_compression

448,906

N/A

passmark_data_encryption

28,586

N/A

passmark_extended_instructions

29,221

N/A

passmark_find_prime_numbers

214

N/A

passmark_floating_point_math

58,434

N/A

passmark_integer_math

99,628

N/A

passmark_multithread

32,544

N/A

passmark_physics

1,794

N/A

passmark_random_string_sorting

48,300

N/A

passmark_single_thread

2,703

N/A

passmark_singlethread

2,703

N/A

DETAILED SPECIFICATIONS

SPECIFICATION

9 3900X

i7-1068NG7

Core Specs

Cores

12

4 -66.7%

Threads

24

8 -66.7%

Base Clock (GHz)

3.8

2.3 -39.5%

Boost Clock (GHz)

4.6

4.1 -10.9%

Frequency (GHz)

3.8

2.3 -39.5%

Turbo Clock (GHz)

4.6

4.1 -10.9%

Multiplier

38

23 -39.5%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

64 KB (per core)

L2 Cache

512 KB (per core)

256 KB (per core)

L3 Cache

64 MB

8 MB (shared)

Power

TDP (W)

105

28 -73.3%

PPT

142 W

—

Architecture

Architecture

Zen 2

Ice Lake

Codename

Matisse

Ice Lake-U

Generation

Ryzen 9 (Zen 2 (Matisse))

Core i7 (Sunny Cove-U)

Process Size

7 nm

10 nm

Transistors

7,600 million

—

Die Size

2x 74 mm²

123 mm²

Foundry

TSMC

Intel

Memory

Memory Support

DDR4

DDR4

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

51.2 GB/s

51.2 GB/s

ECC Memory

No

No

Platform

Socket

AMD Socket AM4

Intel BGA 1344

Chipsets

A300, X300, A320, B350, X370, B450, X470, A520, B550, X570

—

PCIe

Gen 4, 24 Lanes(CPU only)

Gen 3

AMD Multi-Die

IO Process Size

12 nm

—

Graphics

Integrated Graphics

—

Iris Plus

Other

Market

Desktop

Mobile

Production Status

Active

End-of-life

Launch Price

$499

$320

Part Number

100-000000023100-100000023BOX100-100000023MPK

SRG0U

Package

µOPGA-1331

FC-BGA16F

Tj Max

—

100°C

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