CPU Comparison

AMD
AMD

AMD Ryzen 9 3900

CORE STATE Matisse
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3.1 Base / 4.3 GHz Turbo
CACHE 64 MB
MAX TDP 65W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2019
VS
Intel
INTEL

Xeon 6325P

CORE STATE Raptor Lake-R
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 3.5 Base / 5.2 GHz Turbo
CACHE 12 MB (shared)
MAX TDP 55W
ARCHITECTURE Raptor Lake
nm
PROCESS 10 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
2,619
1,374
cinebench_cinebench_r15_singlecore
369
193
cinebench_cinebench_r20_multicore
10,914
5,727
cinebench_cinebench_r20_singlecore
1,540
808
cinebench_cinebench_r23_multicore
25,988
13,638
cinebench_cinebench_r23_singlecore
3,669
1,925
passmark_data_compression
413,887
172,602
passmark_data_encryption
26,657
9,201
passmark_extended_instructions
26,073
11,167
passmark_find_prime_numbers
203
65
passmark_floating_point_math
56,730
37,598
passmark_integer_math
97,698
49,670
passmark_multithread
30,586
16,045
passmark_physics
1,617
1,028
passmark_random_string_sorting
44,902
19,534
passmark_single_thread
2,604
4,283
passmark_singlethread
2,604
4,283

DETAILED SPECIFICATIONS

SPECIFICATION
9 3900
6325P
Core Specs
Cores
12
4 -66.7%
Threads
24
8 -66.7%
Base Clock (GHz)
3.1
3.5 +12.9%
Boost Clock (GHz)
4.3
5.2 +20.9%
Frequency (GHz)
3.1
3.5 +12.9%
Turbo Clock (GHz)
4.3
5.2 +20.9%
Multiplier
31
35 +12.9%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
1.25 MB (per core)
L3 Cache
64 MB
12 MB (shared)
Power
TDP (W)
65
55 -15.4%
PPT
88 W
Architecture
Architecture
Zen 2
Raptor Lake
Codename
Matisse
Raptor Lake-R
Generation
Ryzen 9 (Zen 2 (Matisse))
Xeon 6 (Raptor Lake Refresh)
Process Size
7 nm
10 nm
Transistors
7,600 million
Die Size
2x 74 mm²
163 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR4, DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
ECC Memory
No
Yes
DDR4 Speed
3200 MT/s
DDR5 Speed
4800 MT/s
Platform
Socket
AMD Socket AM4
Intel Socket 1700
Chipsets
A300, X300, A320, B350, X370, B450, X470, A520, B550, X570
C262, C266
PCIe
Gen 4, 24 Lanes(CPU only)
Gen 5, 16 Lanes(CPU only)
AMD Multi-Die
IO Process Size
12 nm
Other
Market
Desktop
Server/Workstation
Production Status
Active
Active
Launch Price
$499
$281
Part Number
100-000000070
SRPLX
Package
µOPGA-1331
FC-LGA16A
Tj Max
95°C
100°C
Bundled Cooler
Laminar RM1
View Ryzen 9 3900 Details View Xeon 6325P Details