CPU Comparison

A

AMD

AMD

AMD Ryzen 9 3900

CORE STATE Matisse

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3.1 Base / 4.3 GHz Turbo

CACHE 64 MB

MAX TDP 65W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2019

VS

i

Intel

INTEL

Core Ultra 9 275HX

CORE STATE Arrow Lake-HX

CORE SPECS 24 Cores / 24 Threads

CLOCK SPEED 2.7 Base / 5.4 GHz Turbo

CACHE 36 MB (shared)

MAX TDP 55W

ARCHITECTURE Arrow Lake

nm

PROCESS 3 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,619

4,839

cinebench_cinebench_r15_singlecore

369

683

cinebench_cinebench_r20_multicore

10,914

20,163

cinebench_cinebench_r20_singlecore

1,540

2,846

cinebench_cinebench_r23_multicore

25,988

48,008

cinebench_cinebench_r23_singlecore

3,669

6,777

passmark_data_compression

413,887

618,338

passmark_data_encryption

26,657

48,016

passmark_extended_instructions

26,073

47,687

passmark_find_prime_numbers

203

457

passmark_floating_point_math

56,730

193,324

passmark_integer_math

97,698

156,314

passmark_multithread

30,586

56,415

passmark_physics

1,617

3,377

passmark_random_string_sorting

44,902

75,710

passmark_single_thread

2,604

4,727

passmark_singlethread

2,604

4,727

DETAILED SPECIFICATIONS

SPECIFICATION

9 3900

Ultra 9 275HX

Core Specs

Cores

12

24 +100.0%

Threads

24

24 0.0%

Base Clock (GHz)

3.1

2.7 -12.9%

Boost Clock (GHz)

4.3

5.4 +25.6%

Frequency (GHz)

3.1

2.7 -12.9%

Turbo Clock (GHz)

4.3

5.4 +25.6%

Multiplier

31

27 -12.9%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

192 KB (per core)

L2 Cache

512 KB (per core)

3 MB (per core)

L3 Cache

64 MB

36 MB (shared)

Power

TDP (W)

65

55 -15.4%

PL1

—

55 W

PL2

—

160 W

PPT

88 W

—

Architecture

Architecture

Zen 2

Arrow Lake

Codename

Matisse

Arrow Lake-HX

Generation

Ryzen 9 (Zen 2 (Matisse))

Ultra 9 (Arrow Lake-HX)

Process Size

7 nm

3 nm

Transistors

7,600 million

17,800 million

Die Size

2x 74 mm²

243 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

DDR5

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

51.2 GB/s

102.4 GB/s

ECC Memory

No

No

Platform

Socket

AMD Socket AM4

Intel BGA 2114

Chipsets

A300, X300, A320, B350, X370, B450, X470, A520, B550, X570

WM880, HM870

PCIe

Gen 4, 24 Lanes(CPU only)

Gen 5, 20 Lanes(CPU only)

Intel Hybrid

Hybrid Cores

—

P-Cores: 8 E-Cores: 16

E-Core Frequency

—

2.1 GHz up to 4.6 GHz

AMD Multi-Die

IO Process Size

12 nm

—

AI/NPU

NPU

—

Yes / 13 TOPS

Graphics

Integrated Graphics

—

Arc Xe-LPG Graphics 64EU

Other

Market

Desktop

Mobile

Production Status

Active

Active

Launch Price

$499

—

Part Number

100-000000070

SRVFK

Package

µOPGA-1331

FC-BGA

Tj Max

95°C

105°C

View Ryzen 9 3900 Details View Core Ultra 9 275HX Details