CPU Comparison

A

AMD

AMD

AMD Ryzen 9 3900

CORE STATE Matisse

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3.1 Base / 4.3 GHz Turbo

CACHE 64 MB

MAX TDP 65W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2019

VS

i

Intel

INTEL

Core Ultra 7 256V

CORE STATE Lunar Lake

CORE SPECS 8 Cores / 8 Threads

CLOCK SPEED 2.2 Base / 4.8 GHz Turbo

CACHE 12 MB (shared)

MAX TDP 17W

ARCHITECTURE Lunar Lake

nm

PROCESS 3 nm

LAUNCH DATE 2024

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,619

1,706

cinebench_cinebench_r15_singlecore

369

240

cinebench_cinebench_r20_multicore

10,914

7,111

cinebench_cinebench_r20_singlecore

1,540

1,003

cinebench_cinebench_r23_multicore

25,988

16,932

cinebench_cinebench_r23_singlecore

3,669

2,390

passmark_data_compression

413,887

189,814

passmark_data_encryption

26,657

14,265

passmark_extended_instructions

26,073

16,182

passmark_find_prime_numbers

203

195

passmark_floating_point_math

56,730

58,951

passmark_integer_math

97,698

43,350

passmark_multithread

30,586

19,894

passmark_physics

1,617

1,628

passmark_random_string_sorting

44,902

22,902

passmark_single_thread

2,604

4,030

passmark_singlethread

2,604

4,030

DETAILED SPECIFICATIONS

SPECIFICATION

9 3900

Ultra 7 256V

Core Specs

Cores

12

8 -33.3%

Threads

24

8 -66.7%

Base Clock (GHz)

3.1

2.2 -29.0%

Boost Clock (GHz)

4.3

4.8 +11.6%

Frequency (GHz)

3.1

2.2 -29.0%

Turbo Clock (GHz)

4.3

4.8 +11.6%

Multiplier

31

22 -29.0%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

192 KB (per core)

L2 Cache

512 KB (per core)

2.5 MB (per core)

L3 Cache

64 MB

12 MB (shared)

Power

TDP (W)

65

17 -73.8%

PPT

88 W

—

Architecture

Architecture

Zen 2

Lunar Lake

Codename

Matisse

Lunar Lake

Generation

Ryzen 9 (Zen 2 (Matisse))

Ultra 7 (Lunar Lake)

Process Size

7 nm

3 nm

Transistors

7,600 million

—

Die Size

2x 74 mm²

—

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

unknown Depends on motherboard

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

51.2 GB/s

—

ECC Memory

No

No

Platform

Socket

AMD Socket AM4

Intel BGA 2833

Chipsets

A300, X300, A320, B350, X370, B450, X470, A520, B550, X570

—

PCIe

Gen 4, 24 Lanes(CPU only)

Gen 5, 4 Lanes(CPU only)

Intel Hybrid

Hybrid Cores

—

P-Cores: 4 E-Cores: 4

E-Core Frequency

—

2.2 GHz up to 3.7 GHz

AMD Multi-Die

IO Process Size

12 nm

—

AI/NPU

NPU

—

Yes / 47 TOPS

Graphics

Integrated Graphics

—

Arc 140V

Other

Market

Desktop

Mobile

Production Status

Active

Active

Launch Price

$499

—

Part Number

100-000000070

SRPMPSRPMZ

Package

µOPGA-1331

FC-BGA

Tj Max

95°C

100°C

View Ryzen 9 3900 Details View Core Ultra 7 256V Details