CPU Comparison

A

AMD

AMD

AMD Ryzen 9 3900

CORE STATE Matisse

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3.1 Base / 4.3 GHz Turbo

CACHE 64 MB

MAX TDP 65W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2019

VS

i

Intel

INTEL

Core i9-8950HK

CORE STATE Coffee Lake-H

CORE SPECS 6 Cores / 12 Threads

CLOCK SPEED 2.9 Base / 4.7 GHz Turbo

CACHE 12 MB (shared)

MAX TDP 95W

ARCHITECTURE Coffee Lake

nm

PROCESS 14 nm

LAUNCH DATE 2018

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,619

888

cinebench_cinebench_r15_singlecore

369

125

cinebench_cinebench_r20_multicore

10,914

3,703

cinebench_cinebench_r20_singlecore

1,540

522

cinebench_cinebench_r23_multicore

25,988

8,817

cinebench_cinebench_r23_singlecore

3,669

1,244

passmark_data_compression

413,887

N/A

passmark_data_encryption

26,657

N/A

passmark_extended_instructions

26,073

N/A

passmark_find_prime_numbers

203

N/A

passmark_floating_point_math

56,730

N/A

passmark_integer_math

97,698

N/A

passmark_multithread

30,586

N/A

passmark_physics

1,617

N/A

passmark_random_string_sorting

44,902

N/A

passmark_single_thread

2,604

N/A

passmark_singlethread

2,604

N/A

geekbench_multicore

N/A

5,254

geekbench_singlecore

N/A

1,437

DETAILED SPECIFICATIONS

SPECIFICATION

9 3900

i9-8950HK

Core Specs

Cores

12

6 -50.0%

Threads

24

12 -50.0%

Base Clock (GHz)

3.1

2.9 -6.5%

Boost Clock (GHz)

4.3

4.7 +9.3%

Frequency (GHz)

3.1

2.9 -6.5%

Turbo Clock (GHz)

4.3

4.7 +9.3%

Multiplier

31

37 +19.4%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

64 KB (per core)

L2 Cache

512 KB (per core)

256 KB (per core)

L3 Cache

64 MB

12 MB (shared)

Power

TDP (W)

65

95 +46.2%

PPT

88 W

—

Architecture

Architecture

Zen 2

Coffee Lake

Codename

Matisse

Coffee Lake-H

Generation

Ryzen 9 (Zen 2 (Matisse))

Core i9 (Coffee Lake-H)

Process Size

7 nm

14 nm

Transistors

7,600 million

—

Die Size

2x 74 mm²

149 mm²

Foundry

TSMC

Intel

Memory

Memory Support

DDR4

DDR4

Memory Bus

Dual-channel

—

Memory Bandwidth

51.2 GB/s

—

ECC Memory

No

No

Platform

Socket

AMD Socket AM4

Intel BGA 1440

Chipsets

A300, X300, A320, B350, X370, B450, X470, A520, B550, X570

—

PCIe

Gen 4, 24 Lanes(CPU only)

—

AMD Multi-Die

IO Process Size

12 nm

—

Graphics

Integrated Graphics

—

UHD 630

Other

Market

Desktop

Mobile

Production Status

Active

End-of-life

Launch Price

$499

—

Part Number

100-000000070

SRCKN

Package

µOPGA-1331

FC-BGA1440

Tj Max

95°C

—

View Ryzen 9 3900 Details View Core i9-8950HK Details