CPU Comparison

AMD
AMD

AMD Ryzen 9 3900

CORE STATE Matisse
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3.1 Base / 4.3 GHz Turbo
CACHE 64 MB
MAX TDP 65W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2019
VS
Intel
INTEL

Core i9-13900HK

CORE STATE Raptor Lake-H
CORE SPECS 14 Cores / 20 Threads
CLOCK SPEED 2.6 Base / 5.4 GHz Turbo
CACHE 24 MB (shared)
MAX TDP 45W
ARCHITECTURE Raptor Lake
nm
PROCESS 10 nm
LAUNCH DATE 2023

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
2,619
2,412
cinebench_cinebench_r15_singlecore
369
340
cinebench_cinebench_r20_multicore
10,914
10,050
cinebench_cinebench_r20_singlecore
1,540
1,418
cinebench_cinebench_r23_multicore
25,988
23,929
cinebench_cinebench_r23_singlecore
3,669
3,378
passmark_data_compression
413,887
329,454
passmark_data_encryption
26,657
19,198
passmark_extended_instructions
26,073
19,534
passmark_find_prime_numbers
203
110
passmark_floating_point_math
56,730
68,020
passmark_integer_math
97,698
94,120
passmark_multithread
30,586
28,194
passmark_physics
1,617
1,896
passmark_random_string_sorting
44,902
36,662
passmark_single_thread
2,604
3,810
passmark_singlethread
2,604
3,810

DETAILED SPECIFICATIONS

SPECIFICATION
9 3900
i9-13900HK
Core Specs
Cores
12
14 +16.7%
Threads
24
20 -16.7%
Base Clock (GHz)
3.1
2.6 -16.1%
Boost Clock (GHz)
4.3
5.4 +25.6%
Frequency (GHz)
3.1
2.6 -16.1%
Turbo Clock (GHz)
4.3
5.4 +25.6%
Multiplier
31
26 -16.1%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
2 MB (per core)
L3 Cache
64 MB
24 MB (shared)
Power
TDP (W)
65
45 -30.8%
PL1
โ€”
45 W
PL2
โ€”
115 W
PPT
88 W
โ€”
Architecture
Architecture
Zen 2
Raptor Lake
Codename
Matisse
Raptor Lake-H
Generation
Ryzen 9 (Zen 2 (Matisse))
Core i9 (Raptor Lake-H)
Process Size
7 nm
10 nm
Transistors
7,600 million
โ€”
Die Size
2x 74 mmยฒ
257 mmยฒ
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR4, DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
โ€”
ECC Memory
No
No
DDR4 Speed
โ€”
3200 MT/s
DDR5 Speed
โ€”
5200 MT/s
Platform
Socket
AMD Socket AM4
Intel BGA 1744
Chipsets
A300, X300, A320, B350, X370, B450, X470, A520, B550, X570
WM790, HM770
PCIe
Gen 4, 24 Lanes(CPU only)
Gen 5, 8 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
โ€”
P-Cores: 6 E-Cores: 8
E-Core Frequency
โ€”
1900 MHz up to 4.1 GHz
AMD Multi-Die
IO Process Size
12 nm
โ€”
Graphics
Integrated Graphics
โ€”
Iris Xe Graphics 96EU
Other
Market
Desktop
Mobile
Production Status
Active
Active
Launch Price
$499
$697
Part Number
100-000000070
SRMJ3
Package
ยตOPGA-1331
FC-BGA16F
Tj Max
95ยฐC
100ยฐC
View Ryzen 9 3900 Details View Core i9-13900HK Details