CPU Comparison

AMD
AMD

AMD Ryzen 9 3900

CORE STATE Matisse
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3.1 Base / 4.3 GHz Turbo
CACHE 64 MB
MAX TDP 65W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2019
VS
Intel
INTEL

Core i7-10850H

CORE STATE Comet Lake-H
CORE SPECS 6 Cores / 12 Threads
CLOCK SPEED 2.7 Base / 5.1 GHz Turbo
CACHE 12 MB (shared)
MAX TDP 45W
ARCHITECTURE Comet Lake
nm
PROCESS 14 nm
LAUNCH DATE 2020

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
2,619
997
cinebench_cinebench_r15_singlecore
369
140
cinebench_cinebench_r20_multicore
10,914
4,155
cinebench_cinebench_r20_singlecore
1,540
586
cinebench_cinebench_r23_multicore
25,988
9,893
cinebench_cinebench_r23_singlecore
3,669
1,396
passmark_data_compression
413,887
165,882
passmark_data_encryption
26,657
3,890
passmark_extended_instructions
26,073
10,381
passmark_find_prime_numbers
203
41
passmark_floating_point_math
56,730
25,216
passmark_integer_math
97,698
39,919
passmark_multithread
30,586
11,643
passmark_physics
1,617
718
passmark_random_string_sorting
44,902
21,537
passmark_single_thread
2,604
2,668
passmark_singlethread
2,604
2,668
geekbench_multicore
N/A
5,396
geekbench_singlecore
N/A
1,457

DETAILED SPECIFICATIONS

SPECIFICATION
9 3900
i7-10850H
Core Specs
Cores
12
6 -50.0%
Threads
24
12 -50.0%
Base Clock (GHz)
3.1
2.7 -12.9%
Boost Clock (GHz)
4.3
5.1 +18.6%
Frequency (GHz)
3.1
2.7 -12.9%
Turbo Clock (GHz)
4.3
5.1 +18.6%
Multiplier
31
27 -12.9%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
256 KB (per core)
L3 Cache
64 MB
12 MB (shared)
Power
TDP (W)
65
45 -30.8%
PPT
88 W
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Architecture
Architecture
Zen 2
Comet Lake
Codename
Matisse
Comet Lake-H
Generation
Ryzen 9 (Zen 2 (Matisse))
Core i7 (Comet Lake-H)
Process Size
7 nm
14 nm
Transistors
7,600 million
โ€”
Die Size
2x 74 mmยฒ
โ€”
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
46.9 GB/s
ECC Memory
No
No
Platform
Socket
AMD Socket AM4
Intel BGA 1440
Chipsets
A300, X300, A320, B350, X370, B450, X470, A520, B550, X570
โ€”
PCIe
Gen 4, 24 Lanes(CPU only)
Gen 3, 16 Lanes(CPU only)
AMD Multi-Die
IO Process Size
12 nm
โ€”
Graphics
Integrated Graphics
โ€”
UHD Graphics
Other
Market
Desktop
Mobile
Production Status
Active
Active
Launch Price
$499
โ€”
Part Number
100-000000070
SRH8P
Package
ยตOPGA-1331
FC-BGA1440
Tj Max
95ยฐC
100ยฐC
View Ryzen 9 3900 Details View Core i7-10850H Details