CPU Comparison
AMD
AMD Ryzen 9 3900
CORE STATE
Matisse
CORE SPECS
12 Cores / 24 Threads
CLOCK SPEED
3.1 Base / 4.3 GHz Turbo
CACHE
64 MB
MAX TDP
65W
ARCHITECTURE
Zen 2
PROCESS
7 nm
LAUNCH DATE
2019
VS
INTEL
Core 9 270H
CORE STATE
Raptor Lake-H
CORE SPECS
14 Cores / 20 Threads
CLOCK SPEED
2.7 Base / 5.8 GHz Turbo
CACHE
24 MB (shared)
MAX TDP
45W
ARCHITECTURE
Raptor Lake
PROCESS
10 nm
LAUNCH DATE
2024
PERFORMANCE BENCHMARKS
cinebench_cinebench_r15_multicore
cinebench_cinebench_r15_singlecore
cinebench_cinebench_r20_multicore
cinebench_cinebench_r20_singlecore
cinebench_cinebench_r23_multicore
cinebench_cinebench_r23_singlecore
passmark_data_compression
passmark_data_encryption
passmark_extended_instructions
passmark_find_prime_numbers
passmark_floating_point_math
passmark_integer_math
passmark_multithread
passmark_physics
passmark_random_string_sorting
passmark_single_thread
passmark_singlethread
DETAILED SPECIFICATIONS
SPECIFICATION
9 3900
9 270H
Core Specs
Cores
12
14
+16.7%
Threads
24
20
-16.7%
Base Clock (GHz)
3.1
2.7
-12.9%
Boost Clock (GHz)
4.3
5.8
+34.9%
Frequency (GHz)
3.1
2.7
-12.9%
Turbo Clock (GHz)
4.3
5.8
+34.9%
Multiplier
31
27
-12.9%
SMP CPUs
1
1
0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
2 MB (per core)
L3 Cache
64 MB
24 MB (shared)
Power
TDP (W)
65
45
-30.8%
PL1
โ
45 W
PL2
โ
115 W
PPT
88 W
โ
Architecture
Architecture
Zen 2
Raptor Lake
Codename
Matisse
Raptor Lake-H
Generation
Ryzen 9
(Zen 2 (Matisse))
Core 9
(Raptor Lake Refresh)
Process Size
7 nm
10 nm
Transistors
7,600 million
โ
Die Size
2x 74 mmยฒ
โ
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR4, DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
โ
ECC Memory
No
No
DDR4 Speed
โ
3200 MT/s
DDR5 Speed
โ
5200 MT/s
Platform
Socket
AMD Socket AM4
Intel BGA 1744
Chipsets
A300, X300, A320, B350, X370, B450, X470, A520, B550, X570
WM790, HM770
PCIe
Gen 4, 24 Lanes(CPU only)
Gen 5, 8 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
โ
P-Cores: 6
E-Cores: 8
E-Core Frequency
โ
2000 MHz
up to 4.1 GHz
AMD Multi-Die
IO Process Size
12 nm
โ
Graphics
Integrated Graphics
โ
Iris Xe Graphics 96EU
Other
Market
Desktop
Mobile
Production Status
Active
Active
Launch Price
$499
$697
Part Number
100-000000070
SRQ6V
Package
ยตOPGA-1331
FC-BGA16F
Tj Max
95ยฐC
100ยฐC