CPU Comparison

A

AMD

AMD

AMD Ryzen 9 3900

CORE STATE Matisse

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3.1 Base / 4.3 GHz Turbo

CACHE 64 MB

MAX TDP 65W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2019

VS

A

AMD

AMD

Ryzen AI Max PRO 385

CORE STATE Strix Halo

CORE SPECS 8 Cores / 16 Threads

CLOCK SPEED 3.6 Base / 5 GHz Turbo

CACHE 32 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,619

2,865

cinebench_cinebench_r15_singlecore

369

404

cinebench_cinebench_r20_multicore

10,914

11,938

cinebench_cinebench_r20_singlecore

1,540

1,685

cinebench_cinebench_r23_multicore

25,988

28,424

cinebench_cinebench_r23_singlecore

3,669

4,012

passmark_data_compression

413,887

399,839

passmark_data_encryption

26,657

19,947

passmark_extended_instructions

26,073

33,915

passmark_find_prime_numbers

203

169

passmark_floating_point_math

56,730

72,648

passmark_integer_math

97,698

108,717

passmark_multithread

30,586

33,441

passmark_physics

1,617

1,772

passmark_random_string_sorting

44,902

41,537

passmark_single_thread

2,604

4,052

passmark_singlethread

2,604

4,052

DETAILED SPECIFICATIONS

SPECIFICATION

9 3900

AI Max PRO 385

Core Specs

Cores

12

8 -33.3%

Threads

24

16 -33.3%

Base Clock (GHz)

3.1

3.6 +16.1%

Boost Clock (GHz)

4.3

5 +16.3%

Frequency (GHz)

3.1

3.6 +16.1%

Turbo Clock (GHz)

4.3

5 +16.3%

Multiplier

31

36 +16.1%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

80 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

64 MB

32 MB (shared)

Power

TDP (W)

65

55 -15.4%

PPT

88 W

—

Configurable TDP

—

45-120 W

Architecture

Architecture

Zen 2

Zen 5

Codename

Matisse

Strix Halo

Generation

Ryzen 9 (Zen 2 (Matisse))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

7 nm

4 nm

Transistors

7,600 million

—

Die Size

2x 74 mm²

—

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

LPDDR5X

Memory Bus

Dual-channel

Quad-channel

Memory Bandwidth

51.2 GB/s

256.0 GB/s

ECC Memory

No

Yes

Platform

Socket

AMD Socket AM4

AMD Socket FP11

Chipsets

A300, X300, A320, B350, X370, B450, X470, A520, B550, X570

—

PCIe

Gen 4, 24 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AMD Multi-Die

IO Process Size

12 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

—

Radeon 8050S

Other

Market

Desktop

Mobile

Production Status

Active

Active

Launch Price

$499

—

Part Number

100-000000070

100-000001422

Package

µOPGA-1331

FC-BGA

Tj Max

95°C

100°C

View Ryzen 9 3900 Details View Ryzen AI Max PRO 385 Details