CPU Comparison

AMD
AMD

AMD Ryzen 9 3900

CORE STATE Matisse
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3.1 Base / 4.3 GHz Turbo
CACHE 64 MB
MAX TDP 65W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2019
VS
AMD
AMD

Ryzen AI Max 390

CORE STATE Strix Halo
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3.2 Base / 5 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
2,619
3,635
cinebench_cinebench_r15_singlecore
369
513
cinebench_cinebench_r20_multicore
10,914
15,146
cinebench_cinebench_r20_singlecore
1,540
2,138
cinebench_cinebench_r23_multicore
25,988
36,064
cinebench_cinebench_r23_singlecore
3,669
5,091
passmark_data_compression
413,887
493,517
passmark_data_encryption
26,657
25,692
passmark_extended_instructions
26,073
39,250
passmark_find_prime_numbers
203
322
passmark_floating_point_math
56,730
93,598
passmark_integer_math
97,698
148,707
passmark_multithread
30,586
42,429
passmark_physics
1,617
2,754
passmark_random_string_sorting
44,902
53,851
passmark_single_thread
2,604
4,025
passmark_singlethread
2,604
4,025

DETAILED SPECIFICATIONS

SPECIFICATION
9 3900
AI Max 390
Core Specs
Cores
12
12 0.0%
Threads
24
24 0.0%
Base Clock (GHz)
3.1
3.2 +3.2%
Boost Clock (GHz)
4.3
5 +16.3%
Frequency (GHz)
3.1
3.2 +3.2%
Turbo Clock (GHz)
4.3
5 +16.3%
Multiplier
31
32 +3.2%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
80 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
64 MB
64 MB (shared)
Power
TDP (W)
65
55 -15.4%
PPT
88 W
—
Configurable TDP
—
45-120 W
Architecture
Architecture
Zen 2
Zen 5
Codename
Matisse
Strix Halo
Generation
Ryzen 9 (Zen 2 (Matisse))
Ryzen AI Max (Zen 5 (Strix Halo))
Process Size
7 nm
4 nm
Transistors
7,600 million
—
Die Size
2x 74 mm²
2x 70.6 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
LPDDR5X
Memory Bus
Dual-channel
Quad-channel
Memory Bandwidth
51.2 GB/s
256.0 GB/s
ECC Memory
No
Yes
Platform
Socket
AMD Socket AM4
AMD Socket FP11
Chipsets
A300, X300, A320, B350, X370, B450, X470, A520, B550, X570
—
PCIe
Gen 4, 24 Lanes(CPU only)
Gen 4, 16 Lanes(CPU only)
AMD Multi-Die
IO Process Size
12 nm
—
AI/NPU
NPU
—
Yes / 50 TOPS
Graphics
Integrated Graphics
—
Radeon 8050S
Other
Market
Desktop
Mobile
Production Status
Active
Active
Launch Price
$499
—
Part Number
100-000000070
100-000001423
Package
µOPGA-1331
FC-BGA
Tj Max
95°C
100°C
View Ryzen 9 3900 Details View Ryzen AI Max 390 Details