CPU Comparison

AMD
AMD

AMD Ryzen 9 3900

CORE STATE Matisse
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3.1 Base / 4.3 GHz Turbo
CACHE 64 MB
MAX TDP 65W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2019
VS
AMD
AMD

Ryzen 9 8945HX

CORE STATE Dragon Range
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2.5 Base / 5.4 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 4
nm
PROCESS 5 nm
LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
2,619
4,305
cinebench_cinebench_r15_singlecore
369
607
cinebench_cinebench_r20_multicore
10,914
17,939
cinebench_cinebench_r20_singlecore
1,540
2,532
cinebench_cinebench_r23_multicore
25,988
42,713
cinebench_cinebench_r23_singlecore
3,669
6,030
passmark_data_compression
413,887
646,896
passmark_data_encryption
26,657
39,600
passmark_extended_instructions
26,073
47,600
passmark_find_prime_numbers
203
267
passmark_floating_point_math
56,730
118,280
passmark_integer_math
97,698
198,352
passmark_multithread
30,586
50,251
passmark_physics
1,617
2,027
passmark_random_string_sorting
44,902
74,420
passmark_single_thread
2,604
3,963
passmark_singlethread
2,604
3,963

DETAILED SPECIFICATIONS

SPECIFICATION
9 3900
9 8945HX
Core Specs
Cores
12
16 +33.3%
Threads
24
32 +33.3%
Base Clock (GHz)
3.1
2.5 -19.4%
Boost Clock (GHz)
4.3
5.4 +25.6%
Frequency (GHz)
3.1
2.5 -19.4%
Turbo Clock (GHz)
4.3
5.4 +25.6%
Multiplier
31
24 -22.6%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
1 MB (per core)
L3 Cache
64 MB
64 MB (shared)
Power
TDP (W)
65
55 -15.4%
PPT
88 W
Configurable TDP
45-75 W
Architecture
Architecture
Zen 2
Zen 4
Codename
Matisse
Dragon Range
Generation
Ryzen 9 (Zen 2 (Matisse))
Ryzen 9 (Zen 4 (Dragon Range))
Process Size
7 nm
5 nm
Transistors
7,600 million
13,140 million
Die Size
2x 74 mm²
2x 71 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
83.2 GB/s
ECC Memory
No
No
Platform
Socket
AMD Socket AM4
AMD Socket FL1
Chipsets
A300, X300, A320, B350, X370, B450, X470, A520, B550, X570
PCIe
Gen 4, 24 Lanes(CPU only)
Gen 5, 28 Lanes(CPU only)
AMD Multi-Die
IO Process Size
12 nm
6 nm
Graphics
Integrated Graphics
Radeon 610M
Other
Market
Desktop
Mobile
Production Status
Active
Active
Launch Price
$499
Part Number
100-000000070
100-000001848
Package
µOPGA-1331
µFC-BGAFL1
Tj Max
95°C
100°C
View Ryzen 9 3900 Details View Ryzen 9 8945HX Details