CPU Comparison

A

AMD

AMD

AMD Ryzen 5 7645HX

CORE STATE Dragon Range

CORE SPECS 6 Cores / 12 Threads

CLOCK SPEED 4 Base / 5 GHz Turbo

CACHE 32 MB (shared)

MAX TDP 45W

ARCHITECTURE Zen 4

nm

PROCESS 5 nm

LAUNCH DATE 2023

VS

A

AMD

AMD

Ryzen 9 3900

CORE STATE Matisse

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3.1 Base / 4.3 GHz Turbo

CACHE 64 MB

MAX TDP 65W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2019

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

2,268

2,619

cinebench_cinebench_r15_singlecore

320

369

cinebench_cinebench_r20_multicore

9,451

10,914

cinebench_cinebench_r20_singlecore

1,334

1,540

cinebench_cinebench_r23_multicore

22,504

25,988

cinebench_cinebench_r23_singlecore

3,177

3,669

geekbench_multicore

11,586

N/A

geekbench_singlecore

2,657

N/A

passmark_data_compression

302,256

413,887

passmark_data_encryption

17,900

26,657

passmark_extended_instructions

22,969

26,073

passmark_find_prime_numbers

178

203

passmark_floating_point_math

48,798

56,730

passmark_integer_math

77,432

97,698

passmark_multithread

26,476

30,586

passmark_physics

1,497

1,617

passmark_random_string_sorting

34,434

44,902

passmark_single_thread

3,907

2,604

passmark_singlethread

3,907

2,604

DETAILED SPECIFICATIONS

SPECIFICATION

5 7645HX

9 3900

Core Specs

Cores

6

12 +100.0%

Threads

12

24 +100.0%

Base Clock (GHz)

4

3.1 -22.5%

Boost Clock (GHz)

5

4.3 -14.0%

Frequency (GHz)

4

3.1 -22.5%

Turbo Clock (GHz)

5

4.3 -14.0%

Multiplier

40

31 -22.5%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

64 KB (per core)

L2 Cache

1 MB (per core)

512 KB (per core)

L3 Cache

32 MB (shared)

64 MB

Power

TDP (W)

45

65 +44.4%

PPT

—

88 W

Configurable TDP

75 W

—

Architecture

Architecture

Zen 4

Zen 2

Codename

Dragon Range

Matisse

Generation

Ryzen 5 (Zen 4 (Dragon Range))

Ryzen 9 (Zen 2 (Matisse))

Process Size

5 nm

7 nm

Transistors

6,570 million

7,600 million

Die Size

71 mm²

2x 74 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

DDR4

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

83.2 GB/s

51.2 GB/s

ECC Memory

Yes

No

Platform

Socket

AMD Socket FL1

AMD Socket AM4

Chipsets

—

A300, X300, A320, B350, X370, B450, X470, A520, B550, X570

PCIe

Gen 5, 28 Lanes(CPU only)

Gen 4, 24 Lanes(CPU only)

AMD Multi-Die

IO Process Size

6 nm

12 nm

Graphics

Integrated Graphics

Radeon 610M

—

Other

Market

Mobile

Desktop

Production Status

Active

Active

Launch Price

—

$499

Part Number

100-000000872

100-000000070

Package

µFC-BGAFL1

µOPGA-1331

Tj Max

100°C

95°C

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