CPU Comparison

A

AMD

AMD

AMD Ryzen 5 7235HS

CORE STATE Rembrandt-R

CORE SPECS 4 Cores / 8 Threads

CLOCK SPEED 3.2 Base / 4.2 GHz Turbo

CACHE 8 MB (shared)

MAX TDP 45W

ARCHITECTURE Zen 3+

nm

PROCESS 6 nm

LAUNCH DATE —

VS

A

AMD

AMD

Ryzen 9 3900

CORE STATE Matisse

CORE SPECS 12 Cores / 24 Threads

CLOCK SPEED 3.1 Base / 4.3 GHz Turbo

CACHE 64 MB

MAX TDP 65W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2019

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

1,050

2,619

cinebench_cinebench_r15_singlecore

148

369

cinebench_cinebench_r20_multicore

4,375

10,914

cinebench_cinebench_r20_singlecore

617

1,540

cinebench_cinebench_r23_multicore

10,418

25,988

cinebench_cinebench_r23_singlecore

1,470

3,669

passmark_data_compression

152,168

413,887

passmark_data_encryption

9,051

26,657

passmark_extended_instructions

10,887

26,073

passmark_find_prime_numbers

31

203

passmark_floating_point_math

23,091

56,730

passmark_integer_math

40,174

97,698

passmark_multithread

12,243

30,586

passmark_physics

574

1,617

passmark_random_string_sorting

15,294

44,902

passmark_single_thread

2,873

2,604

passmark_singlethread

2,873

2,604

DETAILED SPECIFICATIONS

SPECIFICATION

5 7235HS

9 3900

Core Specs

Cores

4

12 +200.0%

Threads

8

24 +200.0%

Base Clock (GHz)

3.2

3.1 -3.1%

Boost Clock (GHz)

4.2

4.3 +2.4%

Frequency (GHz)

3.2

3.1 -3.1%

Turbo Clock (GHz)

4.2

4.3 +2.4%

Multiplier

32

31 -3.1%

SMP CPUs

1

1 0.0%

Cache

L1 Cache

64 KB (per core)

64 KB (per core)

L2 Cache

512 KB (per core)

512 KB (per core)

L3 Cache

8 MB (shared)

64 MB

Power

TDP (W)

45

65 +44.4%

PPT

—

88 W

Configurable TDP

35-54 W

—

Architecture

Architecture

Zen 3+

Zen 2

Codename

Rembrandt-R

Matisse

Generation

Ryzen 5 (Zen 3+ (Rembrandt))

Ryzen 9 (Zen 2 (Matisse))

Process Size

6 nm

7 nm

Transistors

—

7,600 million

Die Size

210 mm²

2x 74 mm²

Foundry

TSMC

TSMC

Memory

Memory Support

DDR5

DDR4

Memory Bus

Dual-channel

Dual-channel

Memory Bandwidth

76.8 GB/s

51.2 GB/s

ECC Memory

Yes

No

Platform

Socket

AMD Socket FP7

AMD Socket AM4

Chipsets

—

A300, X300, A320, B350, X370, B450, X470, A520, B550, X570

PCIe

Gen 4, 20 Lanes(CPU only)

Gen 4, 24 Lanes(CPU only)

AMD Multi-Die

IO Process Size

—

12 nm

Graphics

Integrated Graphics

Radeon 660M

—

Other

Market

Mobile

Desktop

Production Status

Active

Active

Launch Price

—

$499

Part Number

100-000001507

100-000000070

Package

FP7r2

µOPGA-1331

Tj Max

95°C

95°C

View Ryzen 5 7235HS Details View Ryzen 9 3900 Details