CPU Comparison

AMD
AMD

AMD Ryzen 3 4100

CORE STATE Renoir
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 3.8 Base / 4 GHz Turbo
CACHE 8 MB (shared)
MAX TDP 65W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2022
VS
AMD
AMD

Ryzen 9 3900

CORE STATE Matisse
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3.1 Base / 4.3 GHz Turbo
CACHE 64 MB
MAX TDP 65W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2019

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
946
2,619
cinebench_cinebench_r15_singlecore
133
369
cinebench_cinebench_r20_multicore
3,945
10,914
cinebench_cinebench_r20_singlecore
556
1,540
cinebench_cinebench_r23_multicore
9,394
25,988
cinebench_cinebench_r23_singlecore
1,326
3,669
passmark_data_compression
149,609
413,887
passmark_data_encryption
9,133
26,657
passmark_extended_instructions
9,923
26,073
passmark_find_prime_numbers
23
203
passmark_floating_point_math
19,128
56,730
passmark_integer_math
32,307
97,698
passmark_multithread
11,050
30,586
passmark_physics
563
1,617
passmark_random_string_sorting
15,760
44,902
passmark_single_thread
2,531
2,604
passmark_singlethread
2,531
2,604

DETAILED SPECIFICATIONS

SPECIFICATION
3 4100
9 3900
Core Specs
Cores
4
12 +200.0%
Threads
8
24 +200.0%
Base Clock (GHz)
3.8
3.1 -18.4%
Boost Clock (GHz)
4
4.3 +7.5%
Frequency (GHz)
3.8
3.1 -18.4%
Turbo Clock (GHz)
4
4.3 +7.5%
Multiplier
38
31 -18.4%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
512 KB (per core)
512 KB (per core)
L3 Cache
8 MB (shared)
64 MB
Power
TDP (W)
65
65 0.0%
PPT
88 W
Configurable TDP
45W
Architecture
Architecture
Zen 2
Zen 2
Codename
Renoir
Matisse
Generation
Ryzen 3 (Zen 2 (Renoir))
Ryzen 9 (Zen 2 (Matisse))
Process Size
7 nm
7 nm
Transistors
9,800 million
7,600 million
Die Size
156 mm²
2x 74 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR4
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
51.2 GB/s
51.2 GB/s
ECC Memory
No
No
Platform
Socket
AMD Socket AM4
AMD Socket AM4
Chipsets
AMD 300 Series*, AMD 400 Series, AMD 500 Series
A300, X300, A320, B350, X370, B450, X470, A520, B550, X570
PCIe
Gen 3, 8 Lanes(CPU only)
Gen 4, 24 Lanes(CPU only)
AMD Multi-Die
IO Process Size
12 nm
Other
Market
Desktop
Desktop
Production Status
Active
Active
Launch Price
$99
$499
Part Number
100-000000510100-100000510BOX
100-000000070
Package
µOPGA-1331
µOPGA-1331
Tj Max
95°C
95°C
View Ryzen 3 4100 Details View Ryzen 9 3900 Details