AMD Ryzen 7 9850X3D vs AMD Ryzen 7 PRO 8840HS Comparison

AMD
AMD

AMD Ryzen 7 9850X3D

CORE STATE Granite Ridge
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 4.7 Base / 5.6 GHz Turbo
CACHE 96 MB (shared)
MAX TDP 120W
ARCHITECTURE Zen 5
nm
PROCESS 4 nm
LAUNCH DATE 2026
VS
AMD
AMD

Ryzen 7 PRO 8840HS

CORE STATE Hawk Point
CORE SPECS 8 Cores / 16 Threads
CLOCK SPEED 3.3 Base / 5.1 GHz Turbo
CACHE 16 MB (shared)
MAX TDP 28W
ARCHITECTURE Zen 4
nm
PROCESS 4 nm
LAUNCH DATE 2024

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
3,551
2,458
cinebench_cinebench_r15_singlecore
343
271.5
cinebench_cinebench_r23_multicore
22,807
14,784
cinebench_cinebench_r23_singlecore
2,228
1,724
passmark_data_compression
474,501
311,199
passmark_data_encryption
22,856
18,838
passmark_extended_instructions
39,272
22,298
passmark_find_prime_numbers
435
84
passmark_floating_point_math
81,998
55,739
passmark_integer_math
123,140
93,342
passmark_multithread
41,318
26,646
passmark_physics
4,171
1,351
passmark_random_string_sorting
49,764
37,922
passmark_single_thread
4,704
3,692
passmark_singlethread
4,704
3,692

Analysis: AMD Ryzen 7 9850X3D vs AMD Ryzen 7 PRO 8840HS

The AMD Ryzen 7 9850X3D and the AMD Ryzen 7 PRO 8840HS are both 8-core, 16-thread processors from AMD, but they serve entirely different market segments. The 9850X3D is a desktop-oriented part from the 9000 series, built on the Zen 5 architecture and codenamed Granite Ridge. The PRO 8840HS is a mobile processor from the 8000 series, using the Zen 4 architecture with the Hawk Point codename. The recorded benchmark data shows a complete sweep: the 9850X3D wins all 15 head-to-head comparisons, with zero wins for the PRO 8840HS. The average benchmark score of 58386 for the desktop chip versus 39603 for the mobile chip places them 92 and 87 percentiles among all CPUs, respectively.

Where Each One Wins

The data shows a clear separation in workload suitability. The AMD Ryzen 7 9850X3D wins every single benchmark in the comparison set, which includes Cinebench R15 and R23 multi-core and single-core tests, plus a range of PassMark stress tests. In multi-threaded rendering tasks, the 9850X3D delivers a Cinebench R23 multi-core score of 22807, which is 54.3% ahead of the PRO 8840HS’s 14784. This indicates a substantial advantage for content creation, 3D rendering, and video encoding workloads where all cores are utilized.

The AMD Ryzen 7 PRO 8840HS does not win any head-to-head test. Its wins are absent across the entire benchmark suite, meaning there is no workload category where the mobile chip outperforms the desktop part. However, the PRO 8840HS is positioned as a mobile processor with a 28 TDP, which is significantly lower than the 120 TDP of the 9850X3D. The data does not include power consumption or efficiency measurements, but the TDP figures suggest the PRO 8840HS is designed for battery-powered laptops and compact systems where thermal and power constraints are primary considerations. The 9850X3D’s results point toward high-performance desktop builds where power draw is less of a limiting factor.

The percentile rankings reinforce this split. The 9850X3D sits at the 92nd percentile among all CPUs, while the PRO 8840HS is at the 87th percentile. The gap in average benchmark scores is 18783 points, or roughly 47.4% higher for the desktop chip. For users prioritizing raw compute throughput, the 9850X3D is the clear choice. For mobile users needing adequate performance in a low-power envelope, the PRO 8840HS remains the only option between the two, given its mobile socket and integrated Radeon 780M graphics.

Architecture Differences

The two processors differ fundamentally in their architecture generation. The AMD Ryzen 7 9850X3D uses the Zen 5 architecture on the Granite Ridge codename, while the AMD Ryzen 7 PRO 8840HS uses Zen 4 on the Hawk Point codename. Both are manufactured on a 4 nm process by TSMC, but the die sizes and transistor counts diverge sharply. The 9850X3D has a die size of 70.6 mm² with 8,315 million transistors, whereas the PRO 8840HS has a die size of 178 mm² with 25,000 million transistors. The mobile chip’s larger die and higher transistor count likely account for its integrated Radeon 780M graphics, whereas the desktop chip uses a simpler Radeon Graphics solution.

Cache configurations show a major difference. The 9850X3D includes 80 KB of L1 cache per core, 1 MB of L2 cache per core, and a massive 96 MB of shared L3 cache. The PRO 8840HS has 64 KB of L1 cache per core, 1 MB of L2 cache per core, and only 16 MB of shared L3 cache. The 80 MB difference in L3 cache is a defining factor for the 9850X3D, as larger cache pools often benefit gaming and data-intensive workloads by reducing memory latency. The vCache3d field is null for both, so no additional 3D V-Cache information is recorded.

Clock speeds also differ. The 9850X3D has a base clock of 4.70 GHz and a boost clock of 5.60 GHz, while the PRO 8840HS starts at 3.30 GHz and boosts to 5.10 GHz. The 9850X3D’s higher base and boost clocks directly contribute to its single-thread performance lead. The multiplier is unlocked on the desktop chip, allowing overclocking, while the mobile chip is locked. PCIe support varies as well: the 9850X3D uses Gen 5 with 24 lanes from the CPU, and the PRO 8840HS uses Gen 4 with 20 lanes. Both support DDR5 memory in a dual-channel configuration with 89.6 GB/s bandwidth, and both have ECC memory enabled.

Head-to-Head Benchmarks

The largest single delta in the dataset is in the PassMark find prime numbers test, where the 9850X3D scores 435 versus the PRO 8840HS’s 84, a delta of 417.9%. This test is highly sensitive to clock speed and cache behavior, and the 9850X3D’s higher boost clock and larger L3 cache likely drive this extreme margin. PassMark physics also shows a massive gap: 4171 for the desktop chip versus 1351 for the mobile chip, a 208.7% difference. Physics simulations often scale with multi-core throughput, and the 9850X3D’s 55.1% advantage in PassMark multithread (41318 versus 26646) supports this interpretation.

In Cinebench R23 multi-core, the 9850X3D scores 22807 against 14784, a 54.3% lead. This is one of the more relevant real-world metrics for rendering workloads. The single-core R23 test shows a smaller but still significant gap: 2228 versus 1724, a 29.2% delta. The Cinebench R15 results follow the same pattern, with a 44.5% multi-core lead (3551 versus 2458) and a 26.3% single-core lead (343 versus 271.5). These results indicate that the 9850X3D’s advantage is not just in multi-threaded scenarios but also in lightly threaded tasks that rely on high clock speeds.

PassMark extended instructions show a 76.1% delta (39272 versus 22298), which measures SIMD and instruction set performance. Floating point math gives a 47.1% delta (81998 versus 55739), and integer math gives a 31.9% delta (123140 versus 93342). Data compression shows a 52.5% delta (474501 versus 311199), while data encryption is closer at 21.3% (22856 versus 18838). Random string sorting has a 31.2% delta (49764 versus 37922). The single-thread PassMark test confirms the single-core advantage: 4704 versus 3692, a 27.4% delta. In every measured category, the 9850X3D delivers a substantial performance increase, ranging from 21.3% to 417.9%.

Specification Differences

The core and thread counts are identical: both have 8 cores and 16 threads. The first major difference is the socket. The 9850X3D uses AMD Socket AM5, a desktop platform, while the PRO 8840HS uses AMD Socket FP7, a mobile platform. The market segment confirms this: Desktop for the 9850X3D and Mobile for the PRO 8840HS.

Clock speeds differ as noted: base clock 4.70 GHz versus 3.30 GHz, boost clock 5.60 GHz versus 5.10 GHz. TDP is a major differentiator: 120 watts for the desktop chip versus 28 watts for the mobile chip. The architecture and codename differ (Zen 5 and Granite Ridge versus Zen 4 and Hawk Point). The process node is the same at 4 nm, and both are from TSMC, but the transistor counts and die sizes are very different: 8,315 million transistors and 70.6 mm² for the 9850X3D versus 25,000 million transistors and 178 mm² for the PRO 8840HS.

Cache sizes differ in L1 (80 KB per core versus 64 KB per core) and L3 (96 MB shared versus 16 MB shared), with L2 being the same at 1 MB per core. Memory support is identical: DDR5, dual-channel, 89.6 GB/s bandwidth, and ECC enabled. PCIe generation and lanes differ: Gen 5 with 24 lanes for the desktop chip versus Gen 4 with 20 lanes for the mobile chip. Integrated graphics differ: Radeon Graphics for the 9850X3D versus Radeon 780M for the PRO 8840HS. The multiplier is unlocked on the desktop chip but locked on the mobile chip. The release dates differ: 2026-01-28 for the 9850X3D and 2024-04-15 for the PRO 8840HS. The launch MSRP for the 9850X3D is $499, while the PRO 8840HS has no recorded launch MSRP.

FAQ

Q: Which processor has the higher boost clock?

A: The AMD Ryzen 7 9850X3D has a boost clock of 5.60 GHz, compared to the AMD Ryzen 7 PRO 8840HS’s 5.10 GHz.

Q: How much larger is the L3 cache on the 9850X3D?

A: The 9850X3D has 96 MB of shared L3 cache, while the PRO 8840HS has 16 MB of shared L3 cache, a difference of 80 MB.

Q: What is the TDP difference between the two processors?

A: The 9850X3D has a TDP of 120 watts, and the PRO 8840HS has a TDP of 28 watts.

Q: Do both processors support ECC memory?

A: Yes, both the 9850X3D and the PRO 8840HS have ECC memory support enabled, and both use DDR5 memory in a dual-channel configuration.

Q: Which processor has a newer architecture?

A: The 9850X3D uses the Zen 5 architecture, while the PRO 8840HS uses Zen 4. The 9850X3D also has a later release date of 2026-01-28 compared to 2024-04-15 for the PRO 8840HS.

Q: What is the average benchmark score difference?

A: The 9850X3D has an average benchmark score of 58386, and the PRO 8840HS has an average of 39603, giving the desktop chip a 18783-point advantage.

The Verdict

The recorded data points to the AMD Ryzen 7 9850X3D as the superior performer in every tested workload. Its 15 wins out of 15 head-to-head benchmarks, with deltas ranging from 21.3% in data encryption to 417.9% in prime number finding, show a decisive performance lead. The 92nd percentile ranking versus the 87th percentile for the PRO 8840HS confirms the desktop chip’s higher standing in the overall CPU hierarchy. Users building a desktop system for rendering, simulation, or compute-intensive tasks should select the 9850X3D based on its multi-core and single-core scores, which lead by 54.3% and 29.2% in Cinebench R23, respectively.

The AMD Ryzen 7 PRO 8840HS, while losing all benchmarks, remains relevant for its intended mobile segment. Its 28 TDP and compact 178 mm² die with integrated Radeon 780M graphics make it a suitable choice for laptops and portable workstations where the 120 TDP and desktop socket of the 9850X3D are not viable. The PRO 8840HS’s 87th percentile still places it above most CPUs, and its 16 MB L3 cache and Zen 4 architecture provide adequate performance for everyday productivity and moderate workloads. The choice between the two is dictated by platform and power constraints, not by performance, since the 9850X3D wins outright in all recorded metrics.

DETAILED SPECIFICATIONS

SPECIFICATION
7 9850X3D
7 PRO 8840HS
Core Specs
Cores
8
8 0.0%
Threads
16
16 0.0%
Base Clock (GHz)
4.7
3.3 -29.8%
Boost Clock (GHz)
5.6
5.1 -8.9%
Frequency (GHz)
4.7
3.3 -29.8%
Turbo Clock (GHz)
5.6
5.1 -8.9%
Multiplier
47
33 -29.8%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
64 KB (per core)
L2 Cache
1 MB (per core)
1 MB (per core)
L3 Cache
96 MB (shared)
16 MB (shared)
Power
TDP (W)
120
28 -76.7%
PPT
162 W
—
Configurable TDP
—
20-30 W
Architecture
Architecture
Zen 5
Zen 4
Codename
Granite Ridge
Hawk Point
Generation
Ryzen 7 (Zen 5 (Granite Ridge))
Ryzen 7 (Zen 4 (Hawk Point))
Process Size
4 nm
4 nm
Transistors
8,315 million
25,000 million
Die Size
70.6 mm²
178 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR5
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
89.6 GB/s
ECC Memory
Yes
Yes
Platform
Socket
AMD Socket AM5
AMD Socket FP7
Chipsets
X870E, X870, B850, B840, X670E, X670, B650E, B650, A620
—
PCIe
Gen 5, 24 Lanes(CPU only)
Gen 4, 20 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
—
AI/NPU
NPU
—
Yes / 16 TOPS
Graphics
Integrated Graphics
Radeon Graphics
Radeon 780M
Other
Market
Desktop
Mobile
Production Status
Active
Active
Launch Price
$499
—
Part Number
100-000001973
100-000001353(FP7r2),100-000001381(FP7)
Package
FC-LGA1718
FP7, FP7r2
Tj Max
95°C
100°C
Bundled Cooler
None
—
View Ryzen 7 9850X3D Details View Ryzen 7 PRO 8840HS Details