CPU Comparison

AMD
AMD

AMD Ryzen 5 230

CORE STATE Hawk Point
CORE SPECS 6 Cores / 12 Threads
CLOCK SPEED 3.5 Base / 4.9 GHz Turbo
CACHE 16 MB (shared)
MAX TDP 28W
ARCHITECTURE Zen 4
nm
PROCESS 4 nm
LAUNCH DATE 2025
VS
AMD
AMD

Ryzen 9 3900

CORE STATE Matisse
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3.1 Base / 4.3 GHz Turbo
CACHE 64 MB
MAX TDP 65W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2019

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
1,799
2,619
cinebench_cinebench_r15_singlecore
253
369
cinebench_cinebench_r20_multicore
7,499
10,914
cinebench_cinebench_r20_singlecore
1,058
1,540
cinebench_cinebench_r23_multicore
17,857
25,988
cinebench_cinebench_r23_singlecore
2,521
3,669
passmark_data_compression
244,106
413,887
passmark_data_encryption
14,715
26,657
passmark_extended_instructions
17,717
26,073
passmark_find_prime_numbers
72
203
passmark_floating_point_math
42,041
56,730
passmark_integer_math
70,624
97,698
passmark_multithread
21,009
30,586
passmark_physics
963
1,617
passmark_random_string_sorting
29,569
44,902
passmark_single_thread
3,490
2,604
passmark_singlethread
3,490
2,604

DETAILED SPECIFICATIONS

SPECIFICATION
5 230
9 3900
Core Specs
Cores
6
12 +100.0%
Threads
12
24 +100.0%
Base Clock (GHz)
3.5
3.1 -11.4%
Boost Clock (GHz)
4.9
4.3 -12.2%
Frequency (GHz)
3.5
3.1 -11.4%
Turbo Clock (GHz)
4.9
4.3 -12.2%
Multiplier
35
31 -11.4%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
1 MB (per core)
512 KB (per core)
L3 Cache
16 MB (shared)
64 MB
Power
TDP (W)
28
65 +132.1%
PPT
88 W
Configurable TDP
15-30 W
Architecture
Architecture
Zen 4
Zen 2
Codename
Hawk Point
Matisse
Generation
Ryzen 5 (Zen 4 (Hawk Point))
Ryzen 9 (Zen 2 (Matisse))
Process Size
4 nm
7 nm
Transistors
25,000 million
7,600 million
Die Size
178 mm²
2x 74 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR4
Memory Bus
Dual-channel
Dual-channel
Memory Bandwidth
89.6 GB/s
51.2 GB/s
ECC Memory
No
No
Platform
Socket
AMD Socket FP8
AMD Socket AM4
Chipsets
A300, X300, A320, B350, X370, B450, X470, A520, B550, X570
PCIe
Gen 4, 20 Lanes(CPU only)
Gen 4, 24 Lanes(CPU only)
AMD Multi-Die
IO Process Size
12 nm
AI/NPU
XDNA NPU
16 TOPS
Graphics
Integrated Graphics
Radeon 760M
Other
Market
Mobile
Desktop
Production Status
Active
Active
Launch Price
$499
Part Number
100-000001726
100-000000070
Package
FP8, FP7, FP7r2
µOPGA-1331
Tj Max
100°C
95°C
View Ryzen 5 230 Details View Ryzen 9 3900 Details