AMD Ryzen 3 210 vs Qualcomm Snapdragon X2E-94-100 Comparison

AMD
AMD

AMD Ryzen 3 210

CORE STATE Hawk Point
CORE SPECS 4 Cores / 8 Threads
CLOCK SPEED 3 Base / 4.7 GHz Turbo
CACHE 8 MB (shared)
MAX TDP 28W
ARCHITECTURE Zen 4
nm
PROCESS 4 nm
LAUNCH DATE 2025
VS
Unknown
CPU

Snapdragon X2E-94-100

CORE STATE Glymur
CORE SPECS 18 Cores / 18 Threads
CLOCK SPEED 4.45 Base / 4.7 GHz Turbo
CACHE 9 MB (shared)
MAX TDP —
ARCHITECTURE Glymur
nm
PROCESS 3 nm
LAUNCH DATE 2026

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
1,128
N/A
cinebench_cinebench_r15_singlecore
159
N/A
cinebench_cinebench_r20_multicore
4,703
N/A
cinebench_cinebench_r20_singlecore
664
N/A
cinebench_cinebench_r23_multicore
11,198
N/A
cinebench_cinebench_r23_singlecore
1,581
N/A
passmark_data_compression
152,017
N/A
passmark_data_encryption
8,607
N/A
passmark_extended_instructions
11,464
N/A
passmark_find_prime_numbers
49
N/A
passmark_floating_point_math
23,649
N/A
passmark_integer_math
37,933
N/A
passmark_multithread
13,585
N/A
passmark_physics
821
N/A
passmark_random_string_sorting
19,454
N/A
passmark_single_thread
3,724
N/A
passmark_singlethread
3,724
N/A

Analysis: AMD Ryzen 3 210 vs Qualcomm Snapdragon X2E-94-100

The AMD Ryzen 3 210 and Qualcomm Snapdragon X2E-94-100 represent two fundamentally different approaches to mobile computing. The Ryzen 3 210 is a compact 4-core processor built on AMD's Zen 4 architecture, while the Snapdragon X2E-94-100 is a massive 18-core part using Qualcomm's Glymur design. The database currently contains extensive benchmark results for the AMD chip, which holds a 71st percentile ranking among all CPUs, while the Snapdragon sits at the 50th percentile with no recorded benchmark scores yet. This analysis compares what the recorded data shows about both processors, focusing on architectural choices, measured performance, and the specification gaps between them.

FAQ

Q: How does the core count differ between these two processors?

A: The AMD Ryzen 3 210 uses 4 cores with 8 threads, while the Qualcomm Snapdragon X2E-94-100 packs 18 cores with 18 threads. This 14-core difference reflects completely different design philosophies: AMD targets efficiency with fewer, faster threads, while Qualcomm opts for massive parallel throughput.

Q: What is the performance gap in multi-core workloads?

A: The Ryzen 3 210 scores 11,198 points in Cinebench R23 multi-core and 4,703 in Cinebench R20 multi-core. Since the Snapdragon has no recorded benchmarks, the database cannot yet quantify the gap, but the 18-core configuration suggests it may close the distance in heavily threaded tasks.

Q: Which processor has higher single-core performance?

A: The Ryzen 3 210 delivers 1,581 points in Cinebench R23 single-core and 664 in Cinebench R20 single-core. Its boost clock reaches 4.70 GHz, matching the Snapdragon's maximum boost frequency exactly. The Snapdragon's base clock is higher at 4.45 GHz versus 3.00 GHz for the AMD chip.

Q: How do memory systems compare?

A: The Snapdragon X2E-94-100 uses triple-channel LPDDR5X with a memory bandwidth of 228.6 GB/s, nearly triple the Ryzen 3 210's dual-channel DDR5 bandwidth of 89.6 GB/s. The Snapdragon also includes 9 MB of shared L3 cache versus 8 MB on the AMD part.

Q: What process nodes are used?

A: The Snapdragon X2E-94-100 is fabricated on TSMC's 3 nm process, while the Ryzen 3 210 uses TSMC's 4 nm node. Both chips are built at the same foundry, but the Snapdragon benefits from the more advanced manufacturing process.

Q: Which processor has more cache per core?

A: The Snapdragon X2E-94-100 allocates 288 KB of L1 cache per core and 16 MB of L2 per module, whereas the Ryzen 3 210 provides 64 KB of L1 per core and 1 MB of L2 per core. The AMD design pairs 8 MB of shared L3 with the smaller per-core caches.

Architecture Differences

The architectural divide between these two processors is stark. The AMD Ryzen 3 210 uses the Zen 4 microarchitecture under the Hawk Point codename, built on a 4 nm TSMC process. It packs 20,900 million transistors onto a 137 mm² die. The Snapdragon X2E-94-100, codenamed Glymur, belongs to the Snapdragon X2 Elite generation and uses a more advanced 3 nm TSMC process on a larger 220 mm² die. The transistor count for the Snapdragon is not recorded in the database.

Core organization sets them apart immediately. The Ryzen 3 210 operates with 4 cores and 8 threads, using simultaneous multithreading to process two threads per core. The Snapdragon runs 18 cores with 18 threads, indicating no multithreading per core, instead relying on raw core count for parallel work. This creates a 14-core advantage for Qualcomm but a 4-thread advantage per core for AMD.

Cache hierarchies follow different strategies. The AMD chip provides 64 KB of L1 and 1 MB of L2 per core, with 8 MB of shared L3. The Snapdragon allocates 288 KB of L1 per core and 16 MB of L2 per module, plus 9 MB of shared L3. The larger per-core L1 and module-level L2 on Qualcomm suggests a design aimed at feeding 18 cores efficiently, while AMD's smaller caches reflect the lower core count.

Memory architecture differs substantially. The Ryzen 3 210 supports dual-channel DDR5 with 89.6 GB/s bandwidth. The Snapdragon uses triple-channel LPDDR5X with 228.6 GB/s bandwidth, a 2.55x advantage in raw memory throughput. PCIe connectivity also differs: AMD provides Gen 4 with 14 lanes, while Qualcomm offers Gen 5 with 12 lanes, trading lane count for newer generation bandwidth.

Integrated graphics take separate paths. The Ryzen 3 210 includes the Radeon 740M, while the Snapdragon pairs with the Adreno X2-90. Both target mobile platforms, with the AMD chip using Socket FP7 and Qualcomm using BGA 2343. Neither processor supports ECC memory, and both have locked multipliers.

Head-to-Head Benchmarks

The database contains no direct head-to-head benchmark comparisons between the Ryzen 3 210 and Snapdragon X2E-94-100. All recorded scores belong to the AMD processor, covering Cinebench and PassMark test suites. The Snapdragon's benchmark array is empty, meaning no measured performance data exists for comparison.

Examining the AMD chip's recorded data provides a baseline for what the Snapdragon must beat. In Cinebench R23, the Ryzen 3 210 scores 11,198 multi-core and 1,581 single-core. The R20 results show 4,703 multi-core and 664 single-core, while R15 records 1,128 multi-core and 159 single-core. These scores place the Ryzen 3 210 at the 71st percentile among all CPUs, with an average benchmark score of 17,321.

PassMark results for the Ryzen 3 210 show strength in specific workloads. Integer math scores 37,933, floating point math hits 23,649, and extended instructions reach 11,464. Data compression scores 152,017, while data encryption manages 8,607. The single-thread PassMark score sits at 3,724, with multithread at 13,585. Physics processing scores 821, random string sorting hits 19,454, and prime number finding records 49.

The nearest rivals in the database for the Ryzen 3 210 provide context. The AMD Ryzen 5 4500 scores 17,333 on average, just 0.1% higher. The Intel Core 7 150U averages 17,395, a 0.4% edge. The AMD Ryzen 3 PRO 8300G scores 17,278, which is 0.2% below the Ryzen 3 210, and the Intel Core i5-12450H averages 17,239, a 0.5% deficit. These tight margins show the Ryzen 3 210 sits in a competitive mid-range cluster.

Without Snapdragon benchmark data, the head-to-head analysis must rely on architectural projections. The 18-core Snapdragon would likely dominate heavily threaded workloads if core scaling is efficient, but the Ryzen 3 210's higher per-thread performance from Zen 4 could keep single-core tasks competitive. The database's percentile ranking places the Snapdragon at 50th, but this reflects missing data rather than measured performance.

Specification Differences

The two processors diverge across nearly every specification field. Core count differs by 14 cores (4 versus 18), and thread count differs by 10 threads (8 versus 18). Base clocks show a 1.45 GHz gap, with the Snapdragon at 4.45 GHz versus 3.00 GHz for AMD, while boost clocks match exactly at 4.70 GHz. The TDP for AMD is 28 watts, with no TDP recorded for Qualcomm.

Process technology separates them by one node generation: 4 nm for AMD versus 3 nm for Qualcomm, both from TSMC. The die size differs by 83 mm², with AMD at 137 mm² and Qualcomm at 220 mm². Transistor count is recorded only for AMD at 20,900 million, while the Snapdragon's count is absent from the database.

Memory support shows different standards: DDR5 for AMD versus LPDDR5X for Qualcomm. The memory bus differs from dual-channel to triple-channel, and bandwidth jumps from 89.6 GB/s to 228.6 GB/s. Cache configurations vary across all levels. L1 per core is 64 KB for AMD versus 288 KB for Qualcomm. L2 per core for AMD is 1 MB, while Qualcomm uses 16 MB per module. Shared L3 is 8 MB for AMD and 9 MB for Qualcomm.

PCIe connectivity differs in both generation and lane count. AMD uses Gen 4 with 14 lanes, Qualcomm uses Gen 5 with 12 lanes. The integrated graphics units are completely different: Radeon 740M for AMD, Adreno X2-90 for Qualcomm. Sockets differ (FP7 versus BGA 2343), part numbers differ (100-000001612 versus X2E94100), and release dates are separated by over a year, with AMD launching in January 2025 and Qualcomm in April 2026.

Where Each One Wins

The Ryzen 3 210 demonstrates clear strengths in single-threaded and lightly threaded workloads based on recorded data. Its Cinebench R23 single-core score of 1,581 and PassMark single-thread score of 3,724 indicate strong per-core performance from the Zen 4 architecture. The 4-core, 8-thread design with dual-channel DDR5 memory at 89.6 GB/s suits everyday productivity tasks, web browsing, and applications that rely on a few fast threads. The 28-watt TDP positions it as an efficient mobile option, and its smaller 137 mm² die suggests lower manufacturing complexity.

The Snapdragon X2E-94-100 targets workloads that scale with core count. Its 18 cores and 18 threads, combined with 228.6 GB/s of triple-channel LPDDR5X memory bandwidth, point toward heavy parallel processing. The 3 nm process node and larger 220 mm² die indicate a high-end design meant for sustained multi-core throughput. The 16 MB L2 per module and 288 KB L1 per core suggest a cache system optimized to feed many cores simultaneously, which could benefit video encoding, 3D rendering, and scientific computing.

The benchmark data favors the Ryzen 3 210 in measured performance, but the Snapdragon's potential remains unquantified. The AMD chip's 71st percentile ranking among all CPUs, with an average score of 17,321, places it above the 50th percentile occupied by the Snapdragon, though this gap reflects missing data rather than direct comparison. The nearest rival data for the Ryzen 3 210 shows it trading blows with the Ryzen 5 4500, Ryzen 3 PRO 8300G, Intel Core 7 150U, and Core i5-12450H, all within a 0.5% margin.

For single-core responsiveness, the Ryzen 3 210 wins based on its recorded 1,581 Cinebench R23 score and matching 4.70 GHz boost clock. For multi-core throughput, the Snapdragon's 18-core configuration and triple-channel memory provide the architectural foundation for victory, assuming core scaling approaches linearity. The Snapdragon also leads in memory bandwidth by 139 GB/s, which benefits memory-intensive workloads. The Ryzen 3 210 counters with lower power consumption at 28 watts and a more mature software ecosystem for its x86 instruction set.

The choice between these processors depends on workload type. The Ryzen 3 210 suits users prioritizing fast single-thread performance and efficiency. The Snapdragon X2E-94-100 appeals to users running heavily threaded applications that can exploit 18 cores and the superior memory subsystem. Until benchmark data for the Snapdragon appears in the database, the Ryzen 3 210 remains the only chip with verified performance numbers, holding a 71st percentile position against all recorded CPUs.

DETAILED SPECIFICATIONS

SPECIFICATION
3 210
Snapdragon X2E-94-100
Core Specs
Cores
4
18 +350.0%
Threads
8
18 +125.0%
Base Clock (GHz)
3
4.45 +48.3%
Boost Clock (GHz)
4.7
4.7 0.0%
Frequency (GHz)
3
4.45 +48.3%
Turbo Clock (GHz)
4.7
4.7 0.0%
Multiplier
30
44.5 +48.3%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
288 KB (per core)
L2 Cache
1 MB (per core)
16 MB (per module)
L3 Cache
8 MB (shared)
9 MB (shared)
Power
TDP (W)
28
—
Configurable TDP
15-30 W
—
Architecture
Architecture
Zen 4
—
Codename
Hawk Point
Glymur
Generation
Ryzen 3 (Zen 4 (Hawk Point))
Snapdragon X2 (Elite)
Process Size
4 nm
3 nm
Transistors
20,900 million
—
Die Size
137 mm²
220 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
LPDDR5X
Memory Bus
Dual-channel
Triple-channel
Memory Bandwidth
89.6 GB/s
228.6 GB/s
ECC Memory
No
No
Platform
Socket
AMD Socket FP7
Qualcomm BGA 2343
PCIe
Gen 4, 14 Lanes(CPU only)
Gen 5, 12 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
1 + 3
12 + 6
E-Core Frequency
2.8 GHz up to 3.3 GHz
3.6 GHz
AI/NPU
NPU
—
Yes / 80 TOPS
Graphics
Integrated Graphics
Radeon 740M
Adreno X2-90
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
100-000001612
X2E94100
Package
FP8
FC-BGA
Tj Max
100°C
—
View Ryzen 3 210 Details View Snapdragon X2E-94-100 Details