CPU Comparison

AMD
AMD

AMD EPYC Embedded 8224P

CORE STATE Siena
CORE SPECS 24 Cores / 48 Threads
CLOCK SPEED 2.55 Base / 3 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 160W
ARCHITECTURE Zen 4c
nm
PROCESS 5 nm
LAUNCH DATE 2023
VS
AMD
AMD

Ryzen 9 3900

CORE STATE Matisse
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3.1 Base / 4.3 GHz Turbo
CACHE 64 MB
MAX TDP 65W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2019

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
4,187
2,619
cinebench_cinebench_r15_singlecore
590
369
cinebench_cinebench_r20_multicore
17,447
10,914
cinebench_cinebench_r20_singlecore
2,462
1,540
cinebench_cinebench_r23_multicore
41,542
25,988
cinebench_cinebench_r23_singlecore
5,864
3,669
passmark_data_compression
681,754
413,887
passmark_data_encryption
43,619
26,657
passmark_extended_instructions
46,091
26,073
passmark_find_prime_numbers
286
203
passmark_floating_point_math
120,066
56,730
passmark_integer_math
193,256
97,698
passmark_multithread
48,873
30,586
passmark_physics
4,110
1,617
passmark_random_string_sorting
85,505
44,902
passmark_single_thread
2,357
2,604
passmark_singlethread
2,357
2,604

DETAILED SPECIFICATIONS

SPECIFICATION
EPYC Embedded 8224P
9 3900
Core Specs
Cores
24
12 -50.0%
Threads
48
24 -50.0%
Base Clock (GHz)
2.55
3.1 +21.6%
Boost Clock (GHz)
3
4.3 +43.3%
Frequency (GHz)
2.55
3.1 +21.6%
Turbo Clock (GHz)
3
4.3 +43.3%
Multiplier
25.5
31 +21.6%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
1 MB (per core)
512 KB (per core)
L3 Cache
64 MB (shared)
64 MB
Power
TDP (W)
160
65 -59.4%
PPT
—
88 W
Configurable TDP
155-225 W
—
Architecture
Architecture
Zen 4c
Zen 2
Codename
Siena
Matisse
Generation
EPYC (Zen 4c (Siena))
Ryzen 9 (Zen 2 (Matisse))
Process Size
5 nm
7 nm
Transistors
17,750 million
7,600 million
Die Size
2x 73 mm²
2x 74 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR4
Memory Bus
Six-channel
Dual-channel
Memory Bandwidth
230.4 GB/s
51.2 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket SP6
AMD Socket AM4
Chipsets
—
A300, X300, A320, B350, X370, B450, X470, A520, B550, X570
PCIe
Gen 5, 96 Lanes(CPU only)
Gen 4, 24 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
12 nm
Other
Market
Server/Workstation
Desktop
Production Status
Active
Active
Launch Price
—
$499
Part Number
100-000001418
100-000000070
Package
FC-LGA4844
µOPGA-1331
Tj Max
—
95°C
Bundled Cooler
None
—
View EPYC Embedded 8224P Details View Ryzen 9 3900 Details