CPU Comparison

AMD
AMD

AMD EPYC 8124P

CORE STATE Siena
CORE SPECS 16 Cores / 32 Threads
CLOCK SPEED 2.45 Base / 3 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 125W
ARCHITECTURE Zen 4c
nm
PROCESS 5 nm
LAUNCH DATE 2023
VS
AMD
AMD

Ryzen 9 3900

CORE STATE Matisse
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3.1 Base / 4.3 GHz Turbo
CACHE 64 MB
MAX TDP 65W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2019

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
3,085
2,619
cinebench_cinebench_r15_singlecore
435
369
cinebench_cinebench_r20_multicore
12,856
10,914
cinebench_cinebench_r20_singlecore
1,814
1,540
cinebench_cinebench_r23_multicore
30,611
25,988
cinebench_cinebench_r23_singlecore
4,321
3,669
passmark_data_compression
468,411
413,887
passmark_data_encryption
30,743
26,657
passmark_extended_instructions
29,666
26,073
passmark_find_prime_numbers
222
203
passmark_floating_point_math
72,395
56,730
passmark_integer_math
123,513
97,698
passmark_multithread
36,014
30,586
passmark_physics
3,356
1,617
passmark_random_string_sorting
64,067
44,902
passmark_single_thread
2,271
2,604
passmark_singlethread
2,271
2,604

DETAILED SPECIFICATIONS

SPECIFICATION
EPYC 8124P
9 3900
Core Specs
Cores
16
12 -25.0%
Threads
32
24 -25.0%
Base Clock (GHz)
2.45
3.1 +26.5%
Boost Clock (GHz)
3
4.3 +43.3%
Frequency (GHz)
2.45
3.1 +26.5%
Turbo Clock (GHz)
3
4.3 +43.3%
Multiplier
24.5
31 +26.5%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
64 KB (per core)
L2 Cache
1 MB (per core)
512 KB (per core)
L3 Cache
64 MB (shared)
64 MB
Power
TDP (W)
125
65 -48.0%
PPT
88 W
Configurable TDP
120-150 W
Architecture
Architecture
Zen 4c
Zen 2
Codename
Siena
Matisse
Generation
EPYC (Zen 4c (Siena))
Ryzen 9 (Zen 2 (Matisse))
Process Size
5 nm
7 nm
Transistors
17,750 million
7,600 million
Die Size
2x 73 mm²
2x 74 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
DDR4
Memory Bus
Six-channel
Dual-channel
Memory Bandwidth
230.4 GB/s
51.2 GB/s
ECC Memory
Yes
No
Platform
Socket
AMD Socket SP6
AMD Socket AM4
Chipsets
A300, X300, A320, B350, X370, B450, X470, A520, B550, X570
PCIe
Gen 5, 96 Lanes(CPU only)
Gen 4, 24 Lanes(CPU only)
AMD Multi-Die
IO Process Size
6 nm
12 nm
Other
Market
Server/Workstation
Desktop
Production Status
Active
Active
Launch Price
$639
$499
Part Number
100-000001135
100-000000070
Package
FC-LGA4844
µOPGA-1331
Tj Max
95°C
Bundled Cooler
None
View EPYC 8124P Details View Ryzen 9 3900 Details