CPU Comparison

A

AMD

AMD

AMD EPYC 7352

CORE STATE Rome

CORE SPECS 24 Cores / 48 Threads

CLOCK SPEED 2.3 Base / 3.2 GHz Turbo

CACHE 32 MB (per die)

MAX TDP 155W

ARCHITECTURE Zen 2

nm

PROCESS 7 nm

LAUNCH DATE 2019

VS

A

AMD

AMD

Ryzen AI Max+ PRO 395

CORE STATE Strix Halo

CORE SPECS 16 Cores / 32 Threads

CLOCK SPEED 3 Base / 5.1 GHz Turbo

CACHE 64 MB (shared)

MAX TDP 55W

ARCHITECTURE Zen 5

nm

PROCESS 4 nm

LAUNCH DATE 2025

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore

3,458

4,456

cinebench_cinebench_r15_singlecore

488

629

cinebench_cinebench_r20_multicore

14,411

18,569

cinebench_cinebench_r20_singlecore

2,034

2,621

cinebench_cinebench_r23_multicore

34,314

44,213

cinebench_cinebench_r23_singlecore

4,844

6,241

passmark_data_compression

660,712

641,407

passmark_data_encryption

44,426

33,060

passmark_extended_instructions

40,203

52,214

passmark_find_prime_numbers

301

285

passmark_floating_point_math

87,969

120,557

passmark_integer_math

148,605

191,369

passmark_multithread

40,370

52,005

passmark_physics

2,688

3,311

passmark_random_string_sorting

69,231

71,439

passmark_single_thread

1,979

4,132

passmark_singlethread

1,979

4,132

DETAILED SPECIFICATIONS

SPECIFICATION

EPYC 7352

AI Max+ PRO 395

Core Specs

Cores

24

16 -33.3%

Threads

48

32 -33.3%

Base Clock (GHz)

2.3

3 +30.4%

Boost Clock (GHz)

3.2

5.1 +59.4%

Frequency (GHz)

2.3

3 +30.4%

Turbo Clock (GHz)

3.2

5.1 +59.4%

Multiplier

23

30 +30.4%

SMP CPUs

2

1 -50.0%

Cache

L1 Cache

96 KB (per core)

80 KB (per core)

L2 Cache

512 KB (per core)

1 MB (per core)

L3 Cache

32 MB (per die)

64 MB (shared)

Total L3

128 MB

—

Power

TDP (W)

155

55 -64.5%

Configurable TDP

180 W

45-120 W

Architecture

Architecture

Zen 2

Zen 5

Codename

Rome

Strix Halo

Generation

EPYC (Zen 2 (Rome))

Ryzen AI Max (Zen 5 (Strix Halo))

Process Size

7 nm

4 nm

Transistors

15,200 million

—

Die Size

4x 74 mm²

—

Foundry

TSMC

TSMC

Memory

Memory Support

DDR4

LPDDR5X

Memory Bus

Eight-channel

Quad-channel

Memory Bandwidth

204.8 GB/s

256.0 GB/s

ECC Memory

Yes

Yes

Platform

Socket

AMD Socket SP3

AMD Socket FP11

PCIe

Gen 4, 128 Lanes(CPU only)

Gen 4, 16 Lanes(CPU only)

AMD Multi-Die

CCDs

4

—

Cores per CCD

6

—

IO Process Size

14 nm

—

AI/NPU

NPU

—

Yes / 50 TOPS

Graphics

Integrated Graphics

—

Radeon 8060S

Other

Market

Server/Workstation

Mobile

Production Status

Active

Active

Launch Price

$1350

—

Part Number

100-000000077

100-000001243

Package

FCLGA-4094

FC-BGA

Tj Max

—

100°C

View EPYC 7352 Details View Ryzen AI Max+ PRO 395 Details