RADEON

AMD FirePro V3900

AMD graphics card specifications and benchmark scores

1 GB
VRAM
MHz Boost
50W
TDP
128
Bus Width

At a Glance

AMD
VRAM 1 GB
Shaders 480
Bus Width 128-bit
TDP 50W
Memory Type GDDR3
Architecture TeraScale 2
nm
Process 40 nm
Released Feb 2012

AMD FirePro V3900 Specifications

GPU Core

Shader units and compute resources

The AMD FirePro V3900 GPU core specifications define its raw processing power for graphics and compute workloads. Shading units (also called CUDA cores, stream processors, or execution units depending on manufacturer) handle the parallel calculations required for rendering. TMUs (Texture Mapping Units) process texture data, while ROPs (Render Output Units) handle final pixel output. Higher shader counts generally translate to better GPU benchmark performance, especially in demanding games and 3D applications.

Shading Units
480
Shaders
480
TMUs
24
ROPs
8
Compute Units
6

FirePro V3900 Clock Speeds

GPU and memory frequencies

Clock speeds directly impact the FirePro V3900's performance in GPU benchmarks and real-world gaming. The base clock represents the minimum guaranteed frequency, while the boost clock indicates peak performance under optimal thermal conditions. Memory clock speed affects texture loading and frame buffer operations. The FirePro V3900 by AMD dynamically adjusts frequencies based on workload, temperature, and power limits to maximize performance while maintaining stability.

GPU Clock
650 MHz
Memory Clock
900 MHz 1800 Mbps effective
GDDR GDDR 6X 6X

AMD's FirePro V3900 Memory

VRAM capacity and bandwidth

VRAM (Video RAM) is dedicated memory for storing textures, frame buffers, and shader data. The FirePro V3900's memory capacity determines how well it handles high-resolution textures and multiple displays. Memory bandwidth, measured in GB/s, affects how quickly data moves between the GPU and VRAM. Higher bandwidth improves performance in memory-intensive scenarios like 4K gaming. The memory bus width and type (GDDR6, GDDR6X, HBM) significantly influence overall GPU benchmark scores.

Memory Size
1024 MB
VRAM
1,024 MB
Memory Type
GDDR3
VRAM Type
GDDR3
Memory Bus
128 bit
Bus Width
128-bit
Bandwidth
28.80 GB/s

FirePro V3900 by AMD Cache

On-chip cache hierarchy

On-chip cache provides ultra-fast data access for the FirePro V3900, reducing the need to fetch data from slower VRAM. L1 and L2 caches store frequently accessed data close to the compute units. AMD's Infinity Cache (L3) dramatically increases effective bandwidth, improving GPU benchmark performance without requiring wider memory buses. Larger cache sizes help maintain high frame rates in memory-bound scenarios and reduce power consumption by minimizing VRAM accesses.

L1 Cache
8 KB (per CU)
L2 Cache
256 KB

FirePro V3900 Theoretical Performance

Compute and fill rates

Theoretical performance metrics provide a baseline for comparing the AMD FirePro V3900 against other graphics cards. FP32 (single-precision) performance, measured in TFLOPS, indicates compute capability for gaming and general GPU workloads. FP64 (double-precision) matters for scientific computing. Pixel and texture fill rates determine how quickly the GPU can render complex scenes. While real-world GPU benchmark results depend on many factors, these specifications help predict relative performance levels.

FP32 (Float)
624.0 GFLOPS
Pixel Rate
5.200 GPixel/s
Texture Rate
15.60 GTexel/s

TeraScale 2 Architecture & Process

Manufacturing and design details

The AMD FirePro V3900 is built on AMD's TeraScale 2 architecture, which defines how the GPU processes graphics and compute workloads. The manufacturing process node affects power efficiency, thermal characteristics, and maximum clock speeds. Smaller process nodes pack more transistors into the same die area, enabling higher performance per watt. Understanding the architecture helps predict how the FirePro V3900 will perform in GPU benchmarks compared to previous generations.

Architecture
TeraScale 2
GPU Name
Turks
Process Node
40 nm
Foundry
TSMC
Transistors
716 million
Die Size
118 mm²
Density
6.1M / mm²

Power & Thermal

TDP and power requirements

Power specifications for the AMD FirePro V3900 determine PSU requirements and thermal management needs. TDP (Thermal Design Power) indicates the heat output under typical loads, guiding cooler selection. Power connector requirements ensure adequate power delivery for stable operation during demanding GPU benchmarks. The suggested PSU wattage accounts for the entire system, not just the graphics card. Efficient power delivery enables the FirePro V3900 to maintain boost clocks without throttling.

TDP
50 W
TDP
50W
Power Connectors
None
Suggested PSU
250 W

FirePro V3900 by AMD Physical & Connectivity

Dimensions and outputs

Physical dimensions of the AMD FirePro V3900 are critical for case compatibility. Card length, height, and slot width determine whether it fits in your chassis. The PCIe interface version affects bandwidth for communication with the CPU. Display outputs define monitor connectivity options, with modern cards supporting multiple high-resolution displays simultaneously. Verify these specifications against your case and motherboard before purchasing to ensure a proper fit.

Slot Width
Single-slot
Length
168 mm 6.6 inches
Height
69 mm 2.7 inches
Bus Interface
PCIe 2.0 x16
Display Outputs
1x DVI1x DisplayPort 1.1
Display Outputs
1x DVI1x DisplayPort 1.1

AMD API Support

Graphics and compute APIs

API support determines which games and applications can fully utilize the AMD FirePro V3900. DirectX 12 Ultimate enables advanced features like ray tracing and variable rate shading. Vulkan provides cross-platform graphics capabilities with low-level hardware access. OpenGL remains important for professional applications and older games. CUDA (NVIDIA) and OpenCL enable GPU compute for video editing, 3D rendering, and scientific applications. Higher API versions unlock newer graphical features in GPU benchmarks and games.

DirectX
11.2 (11_0)
DirectX
11.2 (11_0)
OpenGL
4.4
OpenGL
4.4
OpenCL
1.2
Shader Model
5.0

FirePro V3900 Product Information

Release and pricing details

The AMD FirePro V3900 is manufactured by AMD as part of their graphics card lineup. Release date and launch pricing provide context for comparing GPU benchmark results with competing products from the same era. Understanding the product lifecycle helps evaluate whether the FirePro V3900 by AMD represents good value at current market prices. Predecessor and successor information aids in tracking generational improvements and planning future upgrades.

Manufacturer
AMD
Release Date
Feb 2012
Production
End-of-life
Predecessor
FireGL
Successor
Radeon Pro GCN

About AMD FirePro V3900

AMD FirePro V3900 is an end-of-life professional graphics card from the FirePro Terascale (Vx900) generation, built on the TeraScale 2 architecture. The Turks chip is manufactured by TSMC on a 40 nm process, with 716 million transistors on a 118 mm² die, a transistor density of 6.1M / mm². The card was released on 2012-02-06, sits between FireGL and Radeon Pro GCN in the product lineage, and uses a PCIe 2.0 x16 bus interface. Its database result is a Geekbench OpenCL score of 1564, which places it at the 8th percentile of all GPUs. That low percentile might suggest a weak card, but the nearestRivals data shows a very tight cluster around the V3900's score.

Memory Subsystem

The V3900 uses 1024 MB of GDDR3 on a 128-bit memory bus. Memory runs at 900 MHz, or 1800 Mbps effective, yielding 28.80 GB/s of bandwidth. A 1024 MB frame buffer is small for high-resolution work; as resolution increases, texture sets and render targets consume capacity quickly. The 28.80 GB/s bandwidth is also narrow, so memory-bound operations cannot sustain high throughput. Pixel rate is 5.200 GPixel/s and texture rate is 15.60 GTexel/s, which further limits how much geometry and texture detail can be pushed per frame. For high resolutions, this is a restrictive memory package. The GDDR3 type and 128-bit interface define a hard ceiling for data transfer, meaning even the 480 shading units can spend time waiting on memory. The data indicates that the V3900 is most comfortable with workloads that fit within the 1024 MB buffer and do not require streaming large amounts of texture data.

How It Compares

Each nearest rival is close in average score. The NVIDIA GeForce GT 620 has an average score of 1560, and the V3900 is 0.3% higher. That margin is essentially a tie in this OpenCL benchmark; no practical performance advantage can be expected from a 0.3% delta.

The AMD Radeon HD 7570 has an average score of 1557, and the V3900 is 0.4% higher. Again, the delta is small enough that the ranking could shift under different workload conditions, but the listed result favors the FirePro.

The AMD Radeon HD 6570 has an average score of 1554, and the V3900 is 0.6% higher. This is the largest positive delta in the nearestRivals set, yet it remains a modest margin.

The NVIDIA GeForce RTX 3060 8 GB is the only listed rival with a higher average score, at 1577. The V3900 trails by 0.8%. Despite the RTX card being the top of this local group, the gap is still less than a full percentage point.

Benchmark Performance

The benchmark data contains one Geekbench OpenCL test, and the score of 1564 also serves as the average benchmark score. Because there is only this single result, the 8th percentile standing is tied directly to that number. A percentile of 8 means the V3900 ranks below the overwhelming majority of GPUs in the database. The nearestRivals context shows that this low absolute standing is not caused by an enormous distance to immediate peers. The V3900 beats the GeForce GT 620 by 0.3%, the Radeon HD 7570 by 0.4%, and the Radeon HD 6570 by 0.6%. It loses to the RTX 3060 8 GB by 0.8%. These deltas are all below a full percentage point, so the V3900 is positioned inside a tightly packed score band. In absolute terms, 1564 points is an entry-level compute result. In relative terms, the card is competitive with the exact products listed in nearestRivals. The small margins suggest that benchmark measurement variation could reorder these cards without implying a large performance difference. The data does not show a wide gulf between the V3900 and any listed rival; instead, it shows a dense grouping of similar OpenCL performers.

Who Should Consider It

The memory subsystem and benchmark scores point to lower resolutions and reduced settings. The 1024 MB GDDR3 buffer and 28.80 GB/s bandwidth make high-resolution texture workloads impractical. The 5.200 GPixel/s and 15.60 GTexel/s rates indicate that fillrate-heavy effects will degrade quickly as resolution rises. The 480 shading units provide a reasonable amount of shader work for basic graphics, but the 8th percentile and 1564 OpenCL score show that demanding compute tasks are beyond this card. The display outputs, 1x DVI and 1x DisplayPort 1.1, allow a DVI display and a DisplayPort display to be connected directly. The 50 W TDP and single-slot design make installation straightforward. For users running legacy applications that work within the DirectX 11.2 (11_0) and OpenGL 4.4 feature set, the V3900 can still operate. For more recent or more memory-intensive workloads, the data suggests staying at lower resolutions, reducing texture detail, and avoiding high settings.

Ray Tracing and Feature Set

The V3900 has no ray tracing cores and no tensor cores; rtCores and tensorCores are both null in the specification. It therefore has no dedicated hardware for ray-traced effects and no tensor-based acceleration. The available execution resources are 480 shading units, 24 texture mapping units, and 8 ROPs. API support is DirectX 11.2 (11_0) and OpenGL 4.4. Vulkan support is not present. The lack of Vulkan excludes applications that require Vulkan for rendering. The lack of RT cores means ray-traced workloads would need to rely on shader-based approaches on the TeraScale 2 architecture, which is not a realistic path for serious ray tracing. The feature set is characteristic of the FirePro Terascale generation: rasterization-oriented, with a single DVI output and a single DisplayPort 1.1 output. The absence of tensor cores also means any workload expecting tensor acceleration will not be supported at the hardware level. The API list is fixed and older, which further narrows the software environment where this card can be useful.

Power and Cooling

The V3900 is rated at a 50 W TDP, which is low enough for a single-slot cooler. The card measures 168 mm (6.6 inches) in length and 69 mm (2.7 inches) in height; width is not specified. It requires no auxiliary power connectors, with power delivered through the PCIe 2.0 x16 slot. The suggested power supply is 250 W, a modest requirement that aligns with the 50 W TDP. The end-of-life production status means the card is no longer manufactured, but the physical requirements are easy to satisfy in a system with an available PCIe x16 slot. No power cables are needed, and the single-slot footprint leaves space for other expansion cards. The 250 W PSU recommendation is low enough for basic desktop systems, and the absence of power connectors simplifies installation. Overall, the V3900 is a low-power, low-profile professional card whose main limitations are its memory size, memory bandwidth, API support, and lack of dedicated ray tracing or tensor hardware.

Detailed benchmark scores and charts for the AMD FirePro V3900 are below.

Benchmark Scores

geekbench_openclSource

Geekbench OpenCL tests GPU compute performance using the cross-platform OpenCL API. This shows how AMD FirePro V3900 handles parallel computing tasks like video encoding and scientific simulations.

geekbench_opencl #599 of 650
1,565
0%
Max: 388,405
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