INTEL

Intel Xeon X3450

Intel processor specifications and benchmark scores

4
Cores
8
Threads
3.2
GHz Boost
95W
TDP
ECC Memory

At a Glance

Intel
Cores / Threads 4C / 8T
Boost Clock 3.2 GHz
Base Clock 2.67 GHz
L3 Cache 8 MB (shared)
TDP 95W
Architecture Nehalem
Socket Intel Socket 1156
nm
Process 45 nm
Released Sep 2009

Intel Xeon X3450 Specifications

Xeon X3450 Core Configuration

Processing cores and threading

The Intel Xeon X3450 features 4 physical cores and 8 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
4
Threads
8
SMP CPUs
1

X3450 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Xeon X3450 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Xeon X3450 by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
2.67 GHz
Boost Clock
3.2 GHz
Multiplier
20x

Intel's Xeon X3450 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the X3450 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Xeon X3450's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
64 KB (per core)
L2 Cache
256 KB (per core)
L3 Cache
8 MB (shared)

Nehalem Architecture & Process

Manufacturing and design details

The Intel Xeon X3450 is built on Intel's 45 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in X3450 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Nehalem
Codename
Lynnfield
Process Node
45 nm
Foundry
Intel
Transistors
774 million
Die Size
296 mm²
Generation
Xeon (Lynnfield)

Nehalem Instruction Set Features

Supported CPU instructions and extensions

The Xeon X3450 by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4.1
SSE4.2
Intel 64
VT-x

X3450 Power & Thermal

TDP and power specifications

The Intel Xeon X3450 has a TDP (Thermal Design Power) of 95W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
95W

Intel Socket 1156 Platform & Socket

Compatibility information

The Xeon X3450 uses the Intel Socket 1156 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel Socket 1156
PCIe
Gen 2, 16 Lanes(CPU only)
DMI
2.5 GT/s
Package
FC-LGA8
DDR5

Intel Socket 1156 Memory Support

RAM compatibility and speeds

Memory support specifications for the X3450 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Xeon X3450 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR3
Memory Bus
Dual-channel
Memory Bandwidth
21.3 GB/s
ECC Memory
Supported

Xeon X3450 Product Information

Release and pricing details

The Intel Xeon X3450 is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Xeon X3450 by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Sep 2009
Launch Price
$241
Market
Server/Workstation
Status
End-of-life
Part Number
SLBLD

Xeon X3450 Benchmark Scores

cinebench_cinebench_r15_multicoreSource

Cinebench R15 multi-core renders a complex 3D scene using all CPU threads simultaneously. This test reveals how Intel Xeon X3450 performs in parallel rendering workloads like video production and 3D animation. Higher scores mean faster render times in professional applications.

cinebench_cinebench_r15_multicore #1557 of 1967
245
2%
Max: 14,978

cinebench_cinebench_r20_multicoreSource

Cinebench R20 multi-core uses a scene requiring 4x more computational power than R15. This test better reflects modern CPU capabilities for professional rendering on Intel Xeon X3450.

cinebench_cinebench_r20_multicore #1380 of 1786
1,021
2%
Max: 62,412
Compare with other CPUs

cinebench_cinebench_r20_singlecoreSource

Cinebench R20 single-core tests one thread against a more demanding scene than R15. This reveals the true single-thread rendering capability of Intel Xeon X3450.

cinebench_cinebench_r20_singlecore #1375 of 1776
144
2%
Max: 8,811

cinebench_cinebench_r23_multicoreSource

Cinebench R23 multi-core is the current standard for CPU rendering benchmarks with a 10-minute minimum runtime. This extended test reveals sustained performance of Intel Xeon X3450 after thermal limits kick in.

cinebench_cinebench_r23_multicore #1525 of 1938
2,431
2%
Max: 148,601
Compare with other CPUs

cinebench_cinebench_r23_singlecoreSource

Cinebench R23 single-core measures sustained single-thread performance over 10 minutes. This reveals how Intel Xeon X3450 maintains boost clocks under continuous load.

cinebench_cinebench_r23_singlecore #1517 of 1923
343
2%
Max: 20,979

About Intel Xeon X3450

The Intel Xeon X3450 is a 4-core, 8-thread processor from Intel, built on the 45 nm Nehalem architecture with the Lynnfield codename. It was released on 2009-09-07, targets the server/workstation segment, and is now end-of-life. The base clock is 2.67 GHz, the boost clock is 3.20 GHz, and the TDP is 95 W. It has 8 MB of shared L3 cache, supports DDR3 memory in a dual-channel configuration, and carries an average benchmark score of 839. That score places the X3450 at the 22nd percentile of all CPUs in the database. Its launch MSRP was $241.

Benchmark Performance

The aggregate benchmark data shows a chip sitting well down the performance distribution. The X3450 scores 245 in Cinebench R15 multicore, 1024 in Cinebench R20 multicore, and 2440 in Cinebench R23 multicore. Single-core scores are 144 in Cinebench R20 and 344 in Cinebench R23. These are low absolute numbers, and the 22nd percentile overall standing reinforces that position.

Looking at the nearest rivals, the X3450 is essentially tied with all of them. Its 839 average score exactly matches the Intel Xeon X5470, which also scores 839 and has a 0% delta. It is 0.2% behind the Intel Core i7-3520M’s 841, 0.3% ahead of the Intel Core i7-920’s 836, and 0.4% behind the AMD FX-8800P’s 843. These are tiny margins; the data does not indicate a meaningful performance gap among this group.

For a CPU from the Nehalem generation, the Cinebench results are plausible for a 4-core/8-thread part, but the absolute scores are far below what the highest-scoring CPUs in the database achieve. The X3450’s position is defined less by a particular strong point than by an aged but functional balance of cores and clock speed.

How It Compares

  • Intel Xeon X5470, The direct peer. Both have an average score of 839, and the delta is 0%. For workloads captured by this database average, moving from one to the other would produce no measurable change in CPU-bound performance.
  • Intel Core i7-3520M, The X3450 trails by 0.2% against this rival’s 841 average. That margin is so small that it falls inside normal run-to-run variance. The two should be treated as equivalent in aggregate performance.
  • Intel Core i7-920, The X3450 leads by 0.3%, with the i7-920 averaging 836. The edge exists in the data, but it is not large enough to be a deciding factor in any real workload.
  • AMD FX-8800P, The largest separation in this rival group is a 0.4% deficit, with the FX-8800P averaging 843. Even the biggest delta here is negligible. All four nearest rivals occupy the same performance band, and the X3450 is not an outlier in either direction.

Power and Thermals

The X3450 is a 95 W part. On a 45 nm process with 774 million transistors and a 296 mm² die, that TDP represents a moderate thermal load. The architecture is old, but the power envelope is manageable by a standard air cooler; no exotic cooling is necessary.

Because the chip has no integrated graphics listed in the data, the system must carry a discrete GPU. That adds its own heat, but it does not change the CPU cooler requirement. For a small server or workstation, a tower-style CPU cooler or a decent cooling solution in a chassis with airflow should be enough. Sustained all-core workloads will still produce meaningful heat, but the 95 W TDP keeps the X3450 in a mainstream cooling tier.

Who Should Consider It

The X3450 is an end-of-life server/workstation chip with a 22nd-percentile aggregate score. It is not the right starting point for a modern performance desktop. Gamers should look elsewhere: the single-core scores are low, at 144 in Cinebench R20 and 344 in Cinebench R23, and the lack of integrated graphics means a discrete card is required. Older or less frame-rate-sensitive games may run, but the CPU will hold back newer titles.

Creation workloads are also constrained. Cinebench R23 multicore at 2440 and R20 multicore at 1024 show modest rendering throughput. Small, infrequent encodes or lightweight photo editing are acceptable, but sustained 3D rendering or heavy video work would be slow. Office workloads, by contrast, are within reach: web browsers, email, document editing, and spreadsheet work do not demand high core counts or strong single-thread speed. The X3450’s 4 cores and 8 threads can handle that kind of usage.

The best use case is a legacy server or workstation where the platform is already present and ECC memory support is useful. With ECC memory enabled, the X3450 is a reasonable fit for a small storage server, a modest virtual-machine host, or a test workstation. Its production status and DDR3 memory standard mean it should be considered only for existing Socket 1156 systems, not for a new build.

Single-Thread vs Multi-Thread Behavior

The X3450 presents a clear split. Single-core Cinebench scores are 144 in R20 and 344 in R23. Multi-core scores are 1024 in R20 and 2440 in R23. The multi-core numbers are much higher, which confirms that the 4-core/8-thread design extracts a large advantage from threaded workloads.

However, the single-core numbers are still low in absolute terms. Applications that rely on one primary thread, older games, some productivity tools, or interactive scripts, will feel that weakness. A workload that spreads across all eight threads will get closer to what the multi-core scores suggest, but the low single-core baseline limits responsiveness in lightly threaded tasks.

The consistency between the R20 and R23 result patterns suggests the relative behavior holds across both benchmark versions. Users should not expect high per-core speed from this chip. It is an old multi-threaded part, best suited to tasks that can use multiple threads rather than tasks that need a single very fast core.

Platform and Compatibility

The X3450 uses Intel Socket 1156. Memory support is DDR3 with a dual-channel memory bus and 21.3 GB/s of bandwidth; ECC memory is supported. On the CPU side, PCIe is Gen 2 with 16 lanes available from the CPU only. There is no integrated graphics, so a discrete GPU is mandatory for display output.

The multiplier is locked, and the part number is SLBLD. Released on 2009-09-07, the processor is classified as end-of-life, so the practical upgrade path is limited to what the existing Socket 1156 motherboard can accept. Anyone building around this chip today should be aware that the DDR3 memory, PCIe Gen 2 lanes, and older CPU socket all represent a closed platform. The data shows a hardware generation with no forward path; it is a compatibility match for vintage systems rather than a growth platform.

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