INTEL

Intel Core i3-3217UE

Intel processor specifications and benchmark scores

2
Cores
4
Threads
GHz Boost
17W
TDP
Integrated GPU

At a Glance

Intel
Cores / Threads 2C / 4T
Base Clock 1600 GHz
L3 Cache 3 MB (shared)
TDP 17W
Architecture Ivy Bridge
Socket Intel BGA 1023
nm
Process 22 nm
Released Aug 2012

Intel Core i3-3217UE Specifications

Core i3-3217UE Core Configuration

Processing cores and threading

The Intel Core i3-3217UE features 2 physical cores and 4 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
2
Threads
4
SMP CPUs
1

i3-3217UE Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Core i3-3217UE benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Core i3-3217UE by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
1600 GHz
Boost Clock
N/A
Multiplier
16x

Intel's Core i3-3217UE Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the i3-3217UE processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Core i3-3217UE's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
64 KB (per core)
L2 Cache
256 KB (per core)
L3 Cache
3 MB (shared)

Ivy Bridge Architecture & Process

Manufacturing and design details

The Intel Core i3-3217UE is built on Intel's 22 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in i3-3217UE incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Ivy Bridge
Codename
Ivy Bridge
Process Node
22 nm
Foundry
Intel
Die Size
118 mm²
Generation
Core i3 (Ivy Bridge)

Ivy Bridge Instruction Set Features

Supported CPU instructions and extensions

The Core i3-3217UE by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4.1
SSE4.2
AVX
AES-NI
F16C
Intel 64
VT-x
VT-d

i3-3217UE Power & Thermal

TDP and power specifications

The Intel Core i3-3217UE has a TDP (Thermal Design Power) of 17W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
17W

Intel BGA 1023 Platform & Socket

Compatibility information

The Core i3-3217UE uses the Intel BGA 1023 socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel BGA 1023
Package
FC-BGA12F
DDR5

Intel BGA 1023 Memory Support

RAM compatibility and speeds

Memory support specifications for the i3-3217UE define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Core i3-3217UE determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Bus
Dual-channel

Intel's Core i3-3217UE Integrated Graphics

Built-in GPU specifications

The Intel Core i3-3217UE includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the i3-3217UE provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
Intel HD 4000
Graphics Model
Intel HD 4000

Core i3-3217UE Product Information

Release and pricing details

The Intel Core i3-3217UE is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Core i3-3217UE by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Aug 2012
Market
Mobile
Part Number
SR0WN

Core i3-3217UE Benchmark Scores

cinebench_cinebench_r15_multicoreSource

Cinebench R15 multi-core renders a complex 3D scene using all CPU threads simultaneously. This test reveals how Intel Core i3-3217UE performs in parallel rendering workloads.

cinebench_cinebench_r15_multicore #1828 of 1945
116
1%
Max: 14,978

cinebench_cinebench_r20_multicoreSource

Cinebench R20 multi-core uses a scene requiring 4x more computational power than R15. This test better reflects modern CPU capabilities for professional rendering on Intel Core i3-3217UE. The more demanding workload provides better differentiation between current-generation processors. Content creators and 3D artists use this benchmark to estimate real-world render performance.

cinebench_cinebench_r20_multicore #1828 of 1945
485
1%
Max: 62,412

cinebench_cinebench_r20_singlecoreSource

Cinebench R20 single-core tests one thread against a more demanding scene than R15. This reveals the true single-thread rendering capability of Intel Core i3-3217UE. The increased complexity provides more accurate performance differentiation between modern CPUs. Single-thread performance remains critical for gaming and applications with serial bottlenecks.

cinebench_cinebench_r20_singlecore #1828 of 1935
68
1%
Max: 8,811

cinebench_cinebench_r23_multicoreSource

Cinebench R23 multi-core is the current standard for CPU rendering benchmarks with a 10-minute minimum runtime. This extended test reveals sustained performance of Intel Core i3-3217UE after thermal limits kick in. The longer duration exposes cooling limitations that shorter benchmarks miss. Professional users rely on R23 scores to predict real-world rendering performance under sustained workloads.

cinebench_cinebench_r23_multicore #1828 of 1945
1,157
1%
Max: 148,601
Compare with other CPUs

cinebench_cinebench_r23_singlecoreSource

Cinebench R23 single-core measures sustained single-thread performance over 10 minutes. This reveals how Intel Core i3-3217UE maintains boost clocks under continuous load. The extended runtime shows whether thermal throttling affects single-core performance. This score is particularly important for understanding real-world responsiveness beyond initial boost behavior.

cinebench_cinebench_r23_singlecore #1815 of 1932
163
1%
Max: 20,979

About Intel Core i3-3217UE

The Intel Core i3-3217UE is a dual-core, four-thread mobile processor from the Ivy Bridge generation, built on Intel's 22 nm process. It sits at the 5th percentile of all CPUs in the benchmark database, indicating that its performance profile is firmly in the entry-level segment. Its average benchmark score of 398 places it in a tight cluster with several older mobile and desktop parts, making it a processor defined by its efficiency and basic computing competence rather than raw speed. This analysis focuses on what the data reveals about its workload suitability, power characteristics, and platform positioning.

Who Should Consider It

The benchmark results paint a clear picture of a processor designed for light, everyday computing tasks rather than demanding workloads. In Cinebench R23, the i3-3217UE scores 1157 in multi-core and 163 in single-core tests. The multi-core figure is roughly seven times the single-core score, which is typical of a dual-core part with hyper-threading, but the absolute numbers are low. This processor is best suited for users whose primary tasks involve web browsing, office productivity suites, email, and media playback. These workloads are largely single-threaded or lightly threaded, and the single-core score of 163 in Cinebench R23 suggests it can handle such tasks without significant lag, though it will not feel snappy by modern standards.

For content creation, the data indicates severe limitations. The Cinebench R20 multicore score of 485 and the R15 multicore score of 116 are very low, even for their respective test versions. Video editing, 3D rendering, or large-scale photo manipulation would result in extremely long processing times. The processor lacks the core count and clock speed (1600 MHz base, no boost) to accelerate these workflows. Creation workloads that are heavily parallel, such as video encoding, would see the processor fully saturated and struggling, with the R20 multi-core score being less than one-tenth of what high-end desktop chips achieve. Users with any serious creation ambitions should look elsewhere.

Gaming performance is similarly constrained. The integrated Intel HD 4000 graphics is the only GPU option, and no discrete graphics data is available in the benchmark pack. The low single-core performance will bottleneck most modern game engines, and the integrated graphics will only handle very old or extremely light titles at low resolutions and settings. The processor is more suited to casual games like 2D puzzle games, classic titles from the early 2010s, or simple browser-based games. The overall 5th percentile ranking across all CPUs reinforces that this is not a gaming processor by any measure.

Office and general productivity use is where this chip finds its niche. A dual-core, four-thread design with a 17 W TDP is characteristic of ultra-low-power mobile processors intended for thin-and-light laptops. The Cinebench R23 single-core score of 163, while low in absolute terms, is sufficient for word processing, spreadsheets, and presentation software. The multi-core score of 1157 in R23 shows that it can handle some light multitasking, such as having a browser with several tabs open alongside a word processor. The data suggests this is a processor for users who prioritize battery life and portability over performance, and who have modest computing needs.

Power and Thermals

The i3-3217UE has a TDP of 17 watts, which is a defining characteristic of this processor. This low thermal design power classifies it as an ultra-low-voltage part, typical of the mobile segment it targets. The 17 W figure places it in a category where passive cooling or very small, low-noise fans are viable options. A capable air cooler—even a small, low-profile one—would be more than sufficient to manage the thermal output of this chip. The 22 nm process node helps keep power draw and heat generation low, contributing to the feasibility of slim laptop chassis designs.

The lack of a boost clock means the processor operates at a constant 1600 MHz under load, which simplifies thermal management. There are no transient power spikes associated with turbo boost behavior. This predictability makes thermal design straightforward for system integrators. The integrated Intel HD 4000 GPU is also part of the same thermal envelope, meaning that running both CPU and GPU-intensive tasks will remain within the 17 W budget. For a user, this translates to a laptop that should stay cool to the touch during typical use and produce minimal fan noise. The data indicates that thermal throttling would be rare, as the processor's power draw is inherently limited.

Platform and Compatibility

The processor uses the Intel BGA 1023 socket, which is a soldered, non-upgradeable socket. This means the CPU is permanently attached to the motherboard, and end users cannot swap it for a different processor. This is a critical compatibility constraint, as any system built around this chip has a fixed processing capability for its lifetime. The platform is based on the Ivy Bridge architecture, which was released in 2012. This is an older platform, and it supports only the memory and I/O standards available at that time.

Memory support is dual-channel, though the specific memory type is not listed in the fact pack. The dual-channel memory bus is a positive feature, as it provides adequate bandwidth for the integrated HD 4000 graphics, which shares system memory. ECC memory is not supported, which is standard for a consumer mobile processor. The fact pack does not list PCIe support or memory bandwidth figures. The integrated graphics is Intel HD 4000, which was a mid-range integrated solution for its generation, and its performance is consistent with the processor's low-end positioning.

The upgrade path is essentially non-existent due to the BGA socket. Users are limited to the performance of this specific chip. The platform's age means it lacks modern connectivity features like the latest PCIe standards or fast memory types. For anyone considering a system with this processor, the data suggests it is a closed, fixed platform. The only practical upgrade path for better performance would be to replace the entire laptop or motherboard, as the CPU itself cannot be removed.

FAQ

Q: What is the multi-core performance of the Intel Core i3-3217UE in Cinebench R23?

A: The processor scores 1157 in Cinebench R23's multi-core test. This is a low score, placing it in the bottom tier of all CPUs, and indicates it is not suitable for demanding parallel workloads.

Q: How does the i3-3217UE compare to the Intel Core i3-2328M?

A: The i3-3217UE has an average benchmark score of 398, which is 0.2% lower than the i3-2328M's average score of 399. The two processors are effectively identical in performance, with a negligible difference.

Q: Does this processor support ECC memory?

A: No, ECC memory is not supported. The i3-3217UE is a consumer mobile processor, and ECC support is not available.

Q: What is the thermal design power (TDP) of this chip?

A: The TDP is 17 watts. This is a very low power draw, making it suitable for thin-and-light laptops where passive or low-noise cooling is used.

Q: Can I upgrade the processor in a system that uses this chip?

A: No. The processor uses the Intel BGA 1023 socket, which is a soldered connection. This means the CPU cannot be removed or upgraded, and the platform is fixed.

Q: What is the single-core score in Cinebench R20?

A: The single-core score in Cinebench R20 is 68. This low score means basic single-threaded tasks like web browsing will work, but the processor will feel slow with more demanding applications.

How It Compares

Intel Core i3-2328M: The i3-3217UE is nearly identical to this rival. The average benchmark score of 398 for the 3217UE is 0.2% lower than the 2328M's score of 399. The data indicates that in real-world use, there is no discernible performance difference between the two. Both are entry-level mobile processors from the same era, and the 3217UE's lower TDP of 17 W comes at no performance cost compared to this rival.

Intel Core i3-4010Y: The 3217UE holds a slight edge over this rival, with an average score of 398 compared to 397, a delta of 0.3%. This is a marginal lead that falls within the noise of benchmark variation. The 4010Y is a newer architecture, but its ultra-low-power design apparently yields similar performance. The data shows both chips are at the same performance level, and neither offers a meaningful advantage over the other.

AMD Athlon II X2 280: The 3217UE is 0.6% faster than this AMD rival, with average scores of 398 versus 396. The Athlon II X2 280 is a desktop processor, yet the mobile i3-3217UE slightly outperforms it in the aggregate benchmark score. This comparison highlights how the Ivy Bridge architecture's efficiency allows a 17 W mobile chip to match an older, higher-power desktop part in overall benchmark results.

Intel Core i3-2332M: This is another near-identical rival. The 3217UE has a 0.6% higher average score (398) than the 2332M (396). The performance delta is minimal, showing that the 3217UE is essentially a refinement of the same dual-core mobile formula. The benchmark data confirms these two processors are interchangeable in terms of performance, with the 3217UE offering a negligible advantage in aggregate scoring.

The AMD Equivalent of Core i3-3217UE

Looking for a similar processor from AMD? The AMD Ryzen 3 PRO 1200 offers comparable performance and features in the AMD lineup.

AMD Ryzen 3 PRO 1200

AMD • 4 Cores

View Specs Compare

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