INTEL

Intel Core 2 Duo E8235

Intel processor specifications and benchmark scores

2
Cores
2
Threads
GHz Boost
44W
TDP
Integrated GPU

At a Glance

Intel
Cores / Threads 2C / 2T
Base Clock 2.8 GHz
TDP 44W
Architecture Core 2
Socket Intel Socket P
nm
Process 45 nm
Released Mar 2009

Intel Core 2 Duo E8235 Specifications

Core 2 Duo E8235 Core Configuration

Processing cores and threading

The Intel Core 2 Duo E8235 features 2 physical cores and 2 threads, which directly impacts multi-threaded performance in CPU benchmarks. More cores allow the processor to handle parallel workloads efficiently, improving performance in video editing, 3D rendering, and multitasking scenarios. Thread count determines how many simultaneous tasks the CPU can process, with higher thread counts benefiting productivity applications and content creation workflows.

Cores
2
Threads
2
SMP CPUs
1

2 Duo E8235 Clock Speeds

Base and boost frequencies

Clock speed is a critical factor in Core 2 Duo E8235 benchmark performance, measured in GHz. The base clock represents the guaranteed operating frequency, while the boost clock indicates maximum single-core performance under optimal conditions. Higher clock speeds translate to faster single-threaded performance, which is essential for gaming and applications that don't fully utilize multiple cores. The Core 2 Duo E8235 by Intel can dynamically adjust its frequency based on workload and thermal headroom.

Base Clock
2.8 GHz
Boost Clock
N/A
Multiplier
10.5x

Intel's Core 2 Duo E8235 Cache Hierarchy

L1, L2, L3 cache sizes

Cache memory is ultra-fast storage built directly into the 2 Duo E8235 processor die. L1 cache provides the fastest access for frequently used data, while L2 and L3 caches offer progressively larger storage with slightly higher latency. Larger cache sizes significantly improve CPU benchmark scores by reducing memory access times. The Core 2 Duo E8235's cache configuration is optimized for both gaming performance and productivity workloads, minimizing data fetch delays during intensive computations.

L1 Cache
64 KB (per core)
L2 Cache
6 MB (shared)

Core 2 Architecture & Process

Manufacturing and design details

The Intel Core 2 Duo E8235 is built on Intel's 45 nm manufacturing process, which determines power efficiency and thermal characteristics. Smaller process nodes allow for more transistors in the same space, enabling higher performance per watt. The architecture defines how the processor handles instructions and manages data flow, directly impacting benchmark results across different workload types. Modern CPU architectures like the one in 2 Duo E8235 incorporate advanced branch prediction and out-of-order execution for optimal performance.

Architecture
Core 2
Codename
Penryn
Process Node
45 nm
Foundry
Intel
Transistors
410 million
Die Size
107 mm²
Generation
Core 2 Duo (Penryn)

Core 2 Instruction Set Features

Supported CPU instructions and extensions

The Core 2 Duo E8235 by Intel supports various instruction set extensions that enable optimized performance for specific workloads. SIMD instructions like SSE and AVX accelerate multimedia, scientific computing, and AI workloads by processing multiple data points simultaneously. Features like AES-NI provide hardware-accelerated encryption, while AVX-512 (if supported) enables advanced vector processing for data centers and high-performance computing. These instruction sets are critical for software compatibility and performance in modern applications.

MMX
SSE
SSE2
SSE3
SSSE3
SSE4.1
Intel 64
VT-x

2 Duo E8235 Power & Thermal

TDP and power specifications

The Intel Core 2 Duo E8235 has a TDP (Thermal Design Power) of 44W, indicating the cooling solution required for sustained operation. TDP affects both system power consumption and the type of cooler needed. Lower TDP processors are ideal for compact builds and laptops, while higher TDP chips typically offer better sustained performance in demanding CPU benchmarks. Understanding power requirements helps ensure your system can deliver consistent performance without thermal throttling.

TDP
44W
Tj Max
105°C

Intel Socket P Platform & Socket

Compatibility information

The Core 2 Duo E8235 uses the Intel Socket P socket, which determines motherboard compatibility. Choosing the right platform is essential for building a system around this processor. The socket type also influences available features like PCIe lanes, memory support, and upgrade paths. When comparing CPU benchmarks, ensure you're looking at processors compatible with your existing or planned motherboard to make informed purchasing decisions.

Socket
Intel Socket P
Package
µFC-PGA8
DDR5

Intel Socket P Memory Support

RAM compatibility and speeds

Memory support specifications for the 2 Duo E8235 define which RAM types and speeds are compatible. Faster memory can significantly improve CPU benchmark performance, especially in memory-intensive applications and gaming. The memory controller integrated into the Core 2 Duo E8235 determines maximum supported speeds and channels. Dual-channel or quad-channel memory configurations can double or quadruple memory bandwidth, providing noticeable performance gains in content creation and scientific workloads.

Memory Type
DDR2, DDR3
Memory Bus
Dual-channel

Intel's Core 2 Duo E8235 Integrated Graphics

Built-in GPU specifications

The Intel Core 2 Duo E8235 includes integrated graphics, eliminating the need for a dedicated GPU in basic computing scenarios. Integrated graphics are ideal for office productivity, video playback, and light gaming. While not designed for demanding GPU benchmarks, the iGPU in the 2 Duo E8235 provides hardware video encoding and decoding capabilities. This makes the processor suitable for compact builds, HTPCs, and systems where power efficiency is prioritized over gaming performance.

iGPU
On certain motherboards (Chipset feature)
Graphics Model
On certain motherboards (Chipset feature)

Core 2 Duo E8235 Product Information

Release and pricing details

The Intel Core 2 Duo E8235 is manufactured by Intel and represents their commitment to delivering competitive CPU performance. Understanding the release date and pricing helps contextualize benchmark comparisons with other processors from the same generation. Launch pricing provides a baseline for evaluating value, though street prices often differ. Whether you're building a new system or upgrading, the Core 2 Duo E8235 by Intel offers a specific balance of performance, features, and cost within Intel's product lineup.

Manufacturer
Intel
Release Date
Mar 2009
Market
Mobile
Status
End-of-life
Part Number
Q4JJSLAQBSLGEC

Core 2 Duo E8235 Benchmark Scores

cinebench_cinebench_r15_multicoreSource

Cinebench R15 multi-core renders a complex 3D scene using all CPU threads simultaneously. This test reveals how Intel Core 2 Duo E8235 performs in parallel rendering workloads.

cinebench_cinebench_r15_multicore #1938 of 1945
87
1%
Max: 14,978

cinebench_cinebench_r20_multicoreSource

Cinebench R20 multi-core uses a scene requiring 4x more computational power than R15. This test better reflects modern CPU capabilities for professional rendering on Intel Core 2 Duo E8235. The more demanding workload provides better differentiation between current-generation processors. Content creators and 3D artists use this benchmark to estimate real-world render performance.

cinebench_cinebench_r20_multicore #1938 of 1945
364
1%
Max: 62,412

cinebench_cinebench_r20_singlecoreSource

Cinebench R20 single-core tests one thread against a more demanding scene than R15. This reveals the true single-thread rendering capability of Intel Core 2 Duo E8235. The increased complexity provides more accurate performance differentiation between modern CPUs. Single-thread performance remains critical for gaming and applications with serial bottlenecks.

cinebench_cinebench_r20_singlecore #1930 of 1935
51
1%
Max: 8,811

cinebench_cinebench_r23_multicoreSource

Cinebench R23 multi-core is the current standard for CPU rendering benchmarks with a 10-minute minimum runtime. This extended test reveals sustained performance of Intel Core 2 Duo E8235 after thermal limits kick in. The longer duration exposes cooling limitations that shorter benchmarks miss. Professional users rely on R23 scores to predict real-world rendering performance under sustained workloads.

cinebench_cinebench_r23_multicore #1938 of 1945
867
1%
Max: 148,601

cinebench_cinebench_r23_singlecoreSource

Cinebench R23 single-core measures sustained single-thread performance over 10 minutes. This reveals how Intel Core 2 Duo E8235 maintains boost clocks under continuous load. The extended runtime shows whether thermal throttling affects single-core performance. This score is particularly important for understanding real-world responsiveness beyond initial boost behavior.

cinebench_cinebench_r23_singlecore #1925 of 1932
122
1%
Max: 20,979

About Intel Core 2 Duo E8235

The Intel Core 2 Duo E8235 is a 45nm Penryn-based mobile processor that entered the market on 2009-03-02. It pairs two cores with two threads at a fixed 2.80 GHz base clock, backed by 6 MB of shared L2 cache and a 44W TDP. In the benchmark database, the part holds a 50th percentile ranking among all CPUs, though no nearest rivals are listed and no average benchmark score has been recorded.

How It Compares

The nearestRivals field for the E8235 is empty, meaning the database has no direct comparison points with deltas to report. As a result, the part's competitive position must be read from its overall percentile: it sits at the 50th percentile of all CPUs in the database. That places it exactly at the median of the tested population — neither a standout nor a laggard in the aggregate ranking. The average benchmark score is recorded as 0, which indicates that no performance samples have been aggregated for this processor. Without measured scores, any rival comparison would be speculative, so the analysis here relies on the architectural data in the fact pack.

Architecturally, the E8235 is a dual-core, dual-thread part from the Penryn generation. In a database populated largely by multi-core desktop and mobile processors, a two-thread design occupies a distinct niche. The 50th percentile suggests that, among all CPUs ever tested, half are faster and half are slower — a median position that aligns with a modest dual-core from the 2009 release date. The absence of rival entries in the database further underscores the part's unusual placement: it is neither a high-end performer nor a low-end budget chip, but rather a middle-of-the-road mobile processor whose closest comparators would have been other Socket P Penryn dual-cores of the same era. Because those comparators are not listed, the percentile is the only quantitative anchor available.

The 2.80 GHz base clock, with no boost clock, means the E8235 runs at a constant frequency. In a comparison context, this fixed clock is a double-edged sword: it provides predictable performance for single-threaded tasks, but it cannot dynamically raise frequency to improve responsiveness in short bursts the way later processors with boost capabilities do. The 6 MB shared L2 cache is generous for a dual-core and likely helps mitigate the lack of a boost clock by reducing memory accesses. Each core also carries 64 KB of L1 cache, which supports the execution units with low-latency data.

Power and Thermals

The E8235 carries a 44W TDP, a figure that places it in the lower-to-mid power envelope for mobile processors. For a 45nm dual-core running at 2.80 GHz, 44W is a restrained thermal budget, implying that a modest cooling solution — such as a small heat pipe assembly or a thin fan — would suffice in a laptop chassis. The processor is built on Intel's 45nm process node, with 410 million transistors packed into a 107 mm² die. The relatively small die and mature process contribute to the modest power draw.

The absence of a boost clock means the 2.80 GHz frequency is sustained under load, so thermal management must handle a constant power draw rather than short bursts. This is a meaningful distinction: processors with boost behavior can spike to higher power for brief periods and then drop back, while the E8235's steady-state operation allows a cooling solution to be sized for a fixed 44W load. For system integrators, this simplifies thermal design — a cooler that dissipates 44W continuously will keep the part within its operating envelope without requiring headroom for transient spikes.

The 45nm process, with its 410 million transistors, is a defining characteristic of the Penryn architecture. The 107 mm² die size is compact, which aids in heat spreading across the processor's surface. In a mobile chassis, the combination of a 44W TDP and a small die means that heat is concentrated in a small area, so the cooling solution must not only move 44W but also do so from a small thermal interface. This is a manageable engineering problem for the notebook designs of the era, and the end-of-life status indicates that those designs have long since been superseded.

Who Should Consider It

With two cores and two threads, the E8235 is best suited to workloads that do not scale beyond a single thread pair. Office productivity tasks — word processing, spreadsheets, email, and web browsing — fall comfortably within its capability, as these applications typically use one or two threads. The 2.80 GHz base clock provides responsive single-threaded performance for such daily tasks. The 6 MB shared L2 cache helps reduce memory latency, which is beneficial for applications that repeatedly access a working set of data that fits within the cache.

For gaming, the picture is more constrained. Older titles designed for dual-core processors may run acceptably, but contemporary games that expect more than two threads will likely bottleneck on the E8235's two threads. The fixed 2.80 GHz clock means that the processor cannot raise its frequency to improve frame pacing in demanding scenes. The 6 MB L2 cache is a positive factor for gaming, as game engines often exhibit locality in their memory access patterns, but it cannot compensate for a lack of thread-level parallelism. Users considering this processor for gaming should limit their expectations to legacy titles or less demanding indie games.

For content creation, the dual-thread design is a limiting factor. Video encoding, 3D rendering, and photo batch processing are workloads that benefit from many cores; the E8235's two threads will leave such tasks significantly slower than on multi-core alternatives. The lack of ECC memory support further positions this part away from professional workstation use, where data integrity is paramount. The mobile market segment, combined with the 44W TDP, suggests that the intended use case is mainstream notebook computing rather than heavy creation work.

The end-of-life production status means that the E8235 is no longer available in new systems. It may still be found in used or refurbished laptops, where its capabilities are best matched to secondary computing duties — a backup machine, a lightweight travel system, or a dedicated single-purpose device. The dual-channel memory support for both DDR2 and DDR3 gives such systems flexibility in sourcing compatible memory modules, though the lack of a boost clock and locked multiplier limit any performance tuning.

Platform and Compatibility

The E8235 uses Intel Socket P, a mobile socket that was common in notebooks of its generation. It supports both DDR2 and DDR3 memory in a dual-channel configuration, giving system builders flexibility in memory choice. ECC memory is not supported, which aligns with its mobile, consumer-oriented positioning. The dual-channel memory bus is a notable feature, as it provides greater memory bandwidth than a single-channel design, which is important for a processor with a 2.80 GHz clock and a 6 MB L2 cache that relies on fast memory access to feed its execution units.

The processor does not include integrated graphics. Instead, graphics output relies on the motherboard's chipset, with the fact pack noting that integrated graphics are available "on certain motherboards" as a chipset feature. This means a discrete GPU is required for display output unless the motherboard provides its own solution. For a mobile platform, this is a significant consideration: systems built around the E8235 would need either a chipset with integrated graphics or a separate mobile GPU, both of which add to the power budget and thermal load beyond the 44W TDP of the processor itself.

PCIe support is not specified in the fact pack, so no conclusions can be drawn about expansion lanes or graphics interface bandwidth. The multiplier is locked, preventing overclocking via frequency scaling. The part is end-of-life, with a release date of 2009-03-02, so it has no upgrade path within the Socket P platform — the Socket P platform is associated with the Core 2 architecture, and the end-of-life status indicates no ongoing production or platform updates. For compatibility, the dual-channel DDR2 and DDR3 support is a distinguishing feature, as it allows the same motherboard to accommodate either memory type, though not simultaneously.

FAQ

Q: What socket does the Intel Core 2 Duo E8235 use?

A: It uses Intel Socket P, a mobile socket.

Q: Does the E8235 support ECC memory?

A: No. The fact pack lists ECC memory support as false.

Q: What memory types are compatible with the E8235?

A: It supports DDR2 and DDR3 memory in a dual-channel configuration.

Q: Is the multiplier unlocked for overclocking?

A: No, the multiplier is locked (multiplierUnlocked is false).

Q: Does the processor have integrated graphics?

A: Not on the CPU itself. Integrated graphics are available on certain motherboards as a chipset feature.

Q: Is the E8235 still in production?

A: No, it is end-of-life, with a release date of 2009-03-02.

The AMD Equivalent of Core 2 Duo E8235

Looking for a similar processor from AMD? The AMD Ryzen 5 1400 offers comparable performance and features in the AMD lineup.

AMD Ryzen 5 1400

AMD • 4 Cores

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