AMD Ryzen 7 8840HX vs Qualcomm Snapdragon X2E-94-100 Comparison

AMD
AMD

AMD Ryzen 7 8840HX

CORE STATE Dragon Range
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 2.9 Base / 5.1 GHz Turbo
CACHE 64 MB (shared)
MAX TDP 55W
ARCHITECTURE Zen 4
nm
PROCESS 5 nm
LAUNCH DATE 2025
VS
Unknown
CPU

Snapdragon X2E-94-100

CORE STATE Glymur
CORE SPECS 18 Cores / 18 Threads
CLOCK SPEED 4.45 Base / 4.7 GHz Turbo
CACHE 9 MB (shared)
MAX TDP —
ARCHITECTURE Glymur
nm
PROCESS 3 nm
LAUNCH DATE 2026

PERFORMANCE BENCHMARKS

cinebench_cinebench_r23_multicore
25,265
N/A
cinebench_cinebench_r23_singlecore
1,857
N/A
passmark_data_compression
496,427
N/A
passmark_data_encryption
29,919
N/A
passmark_extended_instructions
36,527
N/A
passmark_find_prime_numbers
304
N/A
passmark_floating_point_math
86,747
N/A
passmark_integer_math
146,506
N/A
passmark_multithread
41,732
N/A
passmark_physics
2,185
N/A
passmark_random_string_sorting
57,971
N/A
passmark_single_thread
3,958
N/A
passmark_singlethread
3,958
N/A

Analysis: AMD Ryzen 7 8840HX vs Qualcomm Snapdragon X2E-94-100

AMD Ryzen 7 8840HX and Qualcomm Snapdragon X2E-94-100 are two mobile processors aimed at different segments of the laptop market. The Ryzen 7 8840HX is a high-core-count x86 part from AMD’s 8000 series, built on the Zen 4 architecture under the Dragon Range codename. The Snapdragon X2E-94-100 is an 18-core Arm-based processor from Qualcomm’s Snapdragon X2 family, codenamed Glymur. The database currently contains a full benchmark suite for the AMD processor, while the Qualcomm chip has no recorded benchmark scores, no average score, and no nearest rivals. This makes a direct numerical comparison impossible, but the specification sheets reveal distinct design philosophies and use-case positioning.

Where Each One Wins

The AMD Ryzen 7 8840HX delivers all recorded performance data in the database. It achieves 25,265 points in Cinebench R23 multi-core and 1,857 points in Cinebench R23 single-core. In PassMark tests, it scores 146,506 in integer math, 86,747 in floating point math, 41,732 in multi-thread, and 3,958 in single-thread. Additional PassMark results include 496,427 in data compression, 29,919 in data encryption, 36,527 in extended instructions, 304 in find prime numbers, 2,185 in physics, and 57,971 in random string sorting. Its average benchmark score is 71,797, placing it in the 94th percentile of all CPUs tracked in the database. That percentile rank indicates the Ryzen 7 8840HX sits near the top of the performance distribution, with nearest rivals including the Intel Core Ultra 7 265KF at an average score of 71,910 (0.2% ahead), the Intel Xeon Platinum 8270 at 71,370 (0.6% behind), the Intel Xeon 6517P at 72,350 (0.8% behind), and the Intel Xeon 6724P at 72,396 (0.8% behind). These deltas are small, meaning the AMD chip trades places with those server and desktop parts within a narrow band.

The Qualcomm Snapdragon X2E-94-100 has no benchmark entries in the database. Its percentile rank is 50, and its average benchmark score is 0. With no recorded measurements, the data cannot confirm any performance win for the Snapdragon part. The only basis for comparison is the specification sheet, which lists an 18-core, 18-thread configuration, a base clock of 4.45 GHz, and a boost clock of 4.70 GHz. The Ryzen 7 8840HX, with 12 cores and 24 threads, relies on simultaneous multithreading to reach double the thread count. In heavily threaded workloads where the Ryzen chip’s 24 threads can engage, the recorded scores show strong scaling; the Snapdragon’s 18 physical threads lack SMT, so its thread-level parallelism is capped at 18. The data cannot show how that translates to real-world performance, but the architectural choice is clear.

Architecture Differences

The Ryzen 7 8840HX uses the Zen 4 architecture on a 5 nm TSMC process. It is manufactured with 13,140 million transistors across a die size of 2x 71 mm². The cache hierarchy includes 64 KB of L1 per core, 1 MB of L2 per core, and 64 MB of shared L3. The processor supports DDR5 memory over a dual-channel interface with a memory bandwidth of 83.2 GB/s. It uses the AMD Socket FL1 and has a TDP of 55 watts. The part includes a Radeon 610M integrated GPU, supports PCIe Gen 5 with 28 CPU lanes, and has an unlocked multiplier. Its release date is April 22, 2025, and its production status is active.

The Snapdragon X2E-94-100 uses a 3 nm TSMC process with a die size of 220 mm². Its cache layout is different: 288 KB of L1 per core, 16 MB of L2 per module, and 9 MB of shared L3. Memory support is LPDDR5X over a triple-channel interface, yielding a memory bandwidth of 228.6 GB/s, which is nearly three times the Ryzen part’s 83.2 GB/s. The Snapdragon uses Qualcomm BGA 2343 and has 12 PCIe Gen 5 lanes. Its integrated GPU is the Adreno X2-90. The multiplier is locked, and the processor is not listed with a TDP value in the database. The release date is April 5, 2026, and production status is active. The transistor count is not recorded for the Snapdragon, and its architecture field is null, though the codename Glymur and the Snapdragon X2 (Elite) generation label indicate a next-generation design.

The memory subsystem differences are substantial. The Snapdragon’s triple-channel LPDDR5X interface provides 228.6 GB/s of bandwidth, which is a major advantage for memory-intensive workloads such as large data transfers or certain AI inference tasks. The Ryzen’s dual-channel DDR5 interface at 83.2 GB/s is more conventional for an x86 mobile part. However, the Ryzen compensates with a much larger L3 cache: 64 MB shared versus 9 MB shared on the Snapdragon. The Ryzen also has 1 MB of L2 per core, while the Snapdragon has 16 MB per module, which suggests a different core-clustering strategy.

FAQ

Q: Which processor has more cores?

A: The Qualcomm Snapdragon X2E-94-100 has 18 cores, while the AMD Ryzen 7 8840HX has 12 cores. However, the Ryzen supports 24 threads via simultaneous multithreading, while the Snapdragon has 18 threads total.

Q: What is the memory bandwidth difference?

A: The Snapdragon X2E-94-100 supports triple-channel LPDDR5X with a memory bandwidth of 228.6 GB/s. The Ryzen 7 8840HX supports dual-channel DDR5 with a memory bandwidth of 83.2 GB/s. The Snapdragon’s bandwidth is approximately 2.75 times higher.

Q: How does the Ryzen 7 8840HX rank among all CPUs?

A: The Ryzen 7 8840HX has an average benchmark score of 71,797 and sits in the 94th percentile of all CPUs. Its nearest rival, the Intel Core Ultra 7 265KF, scores 71,910, which is 0.2% higher. The Intel Xeon 6517P and Xeon 6724P are 0.8% higher.

Q: Does the Snapdragon X2E-94-100 have any benchmark scores?

A: No. The database lists no benchmark entries for the Snapdragon X2E-94-100. Its average benchmark score is 0, and its percentile rank is 50, which reflects the absence of recorded data rather than measured performance.

Q: What process nodes do the two processors use?

A: The AMD Ryzen 7 8840HX uses a 5 nm TSMC process. The Qualcomm Snapdragon X2E-94-100 uses a 3 nm TSMC process.

Q: Are the integrated GPUs different?

A: Yes. The Ryzen 7 8840HX includes a Radeon 610M GPU, while the Snapdragon X2E-94-100 includes an Adreno X2-90 GPU.

Specification Differences

The two processors differ in nearly every major specification field. Core count: 12 for AMD, 18 for Qualcomm. Thread count: 24 for AMD, 18 for Qualcomm. Base clock: 2.90 GHz for AMD, 4.45 GHz for Qualcomm. Boost clock: 5.10 GHz for AMD, 4.70 GHz for Qualcomm. TDP: 55 watts for AMD, not listed for Qualcomm. Socket: AMD Socket FL1 versus Qualcomm BGA 2343. Architecture: Zen 4 for AMD, null for Qualcomm. Codename: Dragon Range for AMD, Glymur for Qualcomm. Process node: 5 nm for AMD, 3 nm for Qualcomm. Transistors: 13,140 million for AMD, not listed for Qualcomm. Die size: 2x 71 mm² for AMD, 220 mm² for Qualcomm. L1 cache: 64 KB per core for AMD, 288 KB per core for Qualcomm. L2 cache: 1 MB per core for AMD, 16 MB per module for Qualcomm. L3 cache: 64 MB shared for AMD, 9 MB shared for Qualcomm. Memory support: DDR5 for AMD, LPDDR5X for Qualcomm. Memory bus: dual-channel for AMD, triple-channel for Qualcomm. Memory bandwidth: 83.2 GB/s for AMD, 228.6 GB/s for Qualcomm. PCIe lanes: 28 for AMD, 12 for Qualcomm. Integrated graphics: Radeon 610M for AMD, Adreno X2-90 for Qualcomm. Multiplier: unlocked for AMD, locked for Qualcomm. Release date: April 22, 2025, for AMD, April 5, 2026, for Qualcomm. Part number: 100-000001850 for AMD, X2E94100 for Qualcomm.

Head-to-Head Benchmarks

There are no head-to-head benchmark entries in the database for these two processors. The wins counter shows 0 for both sides. The AMD Ryzen 7 8840HX has a full set of recorded scores, but the Qualcomm Snapdragon X2E-94-100 has none. Therefore, a direct comparison of measured performance is not possible from the data.

The AMD part’s scores can be interpreted in absolute terms. Its Cinebench R23 multi-core score of 25,265 indicates strong multi-threaded throughput, likely driven by its 24 threads and 64 MB of L3 cache. The single-core score of 1,857 reflects a boost clock of 5.10 GHz. PassMark integer math at 146,506 and floating point math at 86,747 show a balanced ALU and FPU design. Data compression at 496,427 is a particularly high mark, suggesting excellent memory-level parallelism or cache efficiency. Encryption at 29,919 and extended instructions at 36,527 indicate robust cryptographic and SIMD capabilities. The physics score of 2,185 and the find prime numbers score of 304 are lower relative to other PassMark metrics, which is typical for integer-heavy, latency-sensitive workloads.

The nearest rival data provides context for the AMD chip. The Intel Core Ultra 7 265KF scores 71,910, which is only 0.2% higher than the Ryzen’s 71,797. The Intel Xeon 6517P and Xeon 6724P score 72,350 and 72,396, respectively, both 0.8% higher. The Intel Xeon Platinum 8270 scores 71,370, which is 0.6% lower. These deltas are all within one percent, meaning the Ryzen 7 8840HX performs on par with a diverse set of Intel server and desktop processors in average benchmark scores. The 94th percentile rank reinforces this: the chip is above 94% of all CPUs in the database, but not at the very top.

For the Snapdragon, the lack of data means no head-to-head wins can be identified. The specification sheet suggests certain strengths: a higher base clock of 4.45 GHz, a smaller 3 nm process, and a much higher memory bandwidth of 228.6 GB/s. But without benchmark scores, these specifications cannot be translated into measured performance. The percentile rank of 50 and average score of 0 are placeholders, not performance claims.

The Verdict

The Ryzen 7 8840HX is the only processor in this comparison with recorded performance. Its 94th percentile rank, 71,797 average score, and near parity with Intel Xeon and Core Ultra rivals make it a proven quantity for multi-threaded and single-threaded workloads. The 24 threads, 64 MB of L3 cache, and unlocked multiplier position it as a high-end mobile processor for compute-heavy tasks.

The Snapdragon X2E-94-100 is an unmeasured part in the database. Its 18 cores, 4.45 GHz base clock, 3 nm process, and 228.6 GB/s memory bandwidth indicate a modern design with potential advantages in power efficiency and memory throughput. However, no benchmark data exists to validate that potential. The locked multiplier and 12 PCIe lanes suggest a more constrained platform.

From the available data, a user prioritizing measured performance would select the Ryzen 7 8840HX. A user evaluating the Snapdragon would be making a decision based on specifications alone, with no recorded evidence of how those specifications perform in practice. The database cannot confirm any superiority for the Snapdragon until its benchmark scores are populated.

DETAILED SPECIFICATIONS

SPECIFICATION
7 8840HX
Snapdragon X2E-94-100
Core Specs
Cores
12
18 +50.0%
Threads
24
18 -25.0%
Base Clock (GHz)
2.9
4.45 +53.4%
Boost Clock (GHz)
5.1
4.7 -7.8%
Frequency (GHz)
2.9
4.45 +53.4%
Turbo Clock (GHz)
5.1
4.7 -7.8%
Multiplier
29
44.5 +53.4%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
288 KB (per core)
L2 Cache
1 MB (per core)
16 MB (per module)
L3 Cache
64 MB (shared)
9 MB (shared)
Power
TDP (W)
55
—
Configurable TDP
45-75 W
—
Architecture
Architecture
Zen 4
—
Codename
Dragon Range
Glymur
Generation
Ryzen 7 (Zen 4 (Dragon Range))
Snapdragon X2 (Elite)
Process Size
5 nm
3 nm
Transistors
13,140 million
—
Die Size
2x 71 mm²
220 mm²
Foundry
TSMC
TSMC
Memory
Memory Support
DDR5
LPDDR5X
Memory Bus
Dual-channel
Triple-channel
Memory Bandwidth
83.2 GB/s
228.6 GB/s
ECC Memory
No
No
Platform
Socket
AMD Socket FL1
Qualcomm BGA 2343
PCIe
Gen 5, 28 Lanes(CPU only)
Gen 5, 12 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
—
12 + 6
E-Core Frequency
—
3.6 GHz
AMD Multi-Die
IO Process Size
6 nm
—
AI/NPU
NPU
—
Yes / 80 TOPS
Graphics
Integrated Graphics
Radeon 610M
Adreno X2-90
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
100-000001850
X2E94100
Package
µFC-BGAFL1
FC-BGA
Tj Max
100°C
—
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