AMD Ryzen 7 8745HX vs Qualcomm Snapdragon X2E-78-100 Comparison

The Verdict

The recorded data presents an unusual comparison between two mobile processors at very different stages of market validation. The AMD Ryzen 7 8745HX, built on the Zen 4 architecture, has a substantial body of benchmark measurements including an average benchmark score of 60104 and a percentile rank of 92 among all CPUs. The Qualcomm Snapdragon X2E-78-100, by contrast, has no recorded benchmark scores in the database, an average benchmark score of zero, and sits at the 50th percentile. This means the AMD processor is directly comparable to several high-end rivals, while the Qualcomm chip currently has no measured performance data to analyze.

Benchmark results indicate the Ryzen 7 8745HX sits within a tight competitive cluster. The database shows it trailing the AMD Ryzen 9 7945HX by a negligible margin with the average scores at 60104 versus 60099, a difference of zero percent. The Intel Core i9-14900F scores 60008, which places the Ryzen 7 8745HX approximately 0.2 percent ahead. The AMD Ryzen 9 7945HX3D averages 59641, leaving the 8745HX about 0.8 percent ahead. The Intel Xeon Gold 6338T posts 60572, putting the Ryzen 7 about 0.8 percent behind. These deltas are all within a narrow band, confirming that the 8745HX delivers performance comparable to established desktop and mobile flagship processors from both AMD and Intel.

For the Snapdragon X2E-78-100, the absence of benchmark data means any performance assessment must rely entirely on architectural specifications rather than measured outcomes. The chip carries 12 cores and 12 threads, a 3 nanometer process node, and a base clock of 4.00 GHz. These specifications suggest a capable processor, but the database contains no scores to confirm real-world behavior. Buyers considering this chip would be working without the verification that benchmark measurements provide.

The Ryzen 7 8745HX is the only processor in this pairing with verified performance data. Its percentile ranking places it in the top tier of all CPUs tested, and its rival comparisons show it trading blows with some of the fastest processors available. The Snapdragon part remains an unquantified entry, with its 50th percentile ranking reflecting the lack of measurements rather than any demonstrated weakness.

Architecture Differences

The two processors diverge fundamentally in their design approaches. The AMD Ryzen 7 8745HX uses the Zen 4 architecture with the Dragon Range codename, manufactured on a 5 nanometer process at TSMC. It integrates 6,570 million transistors on a die size of 71 square millimeters. The cache hierarchy includes 64 KB of L1 per core, 1 MB of L2 per core, and 32 MB of shared L3 cache. This processor belongs to the 8000 series and the Ryzen 7 generation, specifically Zen 4 with Dragon Range.

The Qualcomm Snapdragon X2E-78-100 uses the Glymur codename, belongs to the Snapdragon X2 Elite generation, and is built on a 3 nanometer process also at TSMC. Its die size measures 220 square millimeters, substantially larger than the AMD chip. The cache configuration differs markedly: 288 KB of L1 per core and 16 MB of shared L2, with no L3 cache listed. The architecture field is recorded as null in the database, so the underlying microarchitecture remains unspecified.

The core counts present a clear contrast. The AMD part offers 8 cores with 16 threads, enabling simultaneous multithreading. The Qualcomm part provides 12 cores but only 12 threads, indicating no multithreading capability per core. The base clock favors Qualcomm at 4.00 GHz versus 3.60 GHz for AMD, while the boost clock is listed only for AMD at 5.10 GHz; the Qualcomm boost clock is absent from the database.

Memory support separates the two as well. The Ryzen 7 8745HX uses DDR5 memory with dual-channel configuration and a memory bandwidth of 83.2 GB/s. The Snapdragon X2E-78-100 uses LPDDR5X memory, also dual-channel, but with a significantly higher memory bandwidth of 152.4 GB/s. Neither processor supports ECC memory.

PCI Express capabilities differ in lane count. The AMD chip provides Gen 5 with 28 lanes from the CPU, while the Qualcomm chip provides Gen 5 with 12 lanes. Integrated graphics also differ: the Ryzen 7 8745HX includes Radeon 610M graphics, while the Snapdragon X2E-78-100 includes Adreno X2-85 graphics.

The AMD processor carries an unlocked multiplier, making it suitable for overclocking, while the Qualcomm part has a locked multiplier. The AMD chip uses the AMD Socket FL1, and the Qualcomm uses Qualcomm BGA 2343. Release dates show the AMD processor launched in April 2025, while the Qualcomm processor carries an April 2026 release date. Both are listed as active production parts in the mobile market segment.

Head-to-Head Benchmarks

The database contains no head-to-head benchmark entries between these two processors, and the Qualcomm Snapdragon X2E-78-100 has no individual benchmark scores recorded. Consequently, direct comparisons must be inferred from the AMD processor's measured data and the architectural specifications of the Qualcomm chip.

For the Ryzen 7 8745HX, the benchmark suite provides a detailed performance profile. The PassMark multithread score reaches 31517, while the single-thread score measures 3879. Integer math completes at 100328, and floating point math posts 61972. Data compression scores 363759, and data encryption records 21840. Extended instructions achieve 27638, find prime numbers returns 159, physics scores 1681, and random string sorting reaches 44494. The average benchmark score across all tests is 60104, placing the chip in the 92nd percentile among all tested CPUs.

The nearest rival data for the Ryzen 7 8745HX shows how tightly grouped the top performers are. The AMD Ryzen 9 7945HX averages 60099, a zero percent difference from the 8745HX. The Intel Core i9-14900F averages 60008, which is 0.2 percent lower. The AMD Ryzen 9 7945HX3D averages 59641, 0.8 percent lower. The Intel Xeon Gold 6338T averages 60572, which puts the 8745HX 0.8 percent behind. These margins are small enough that real-world application performance would likely vary by workload rather than show a consistent winner.

Since the Qualcomm chip has no scores, its performance cannot be positioned relative to the AMD part or any other processor in the database. The 50th percentile ranking and zero average score indicate that no measurements have been recorded, not that the chip underperforms. Architectural advantages such as the 3 nanometer node, higher base clock, and larger memory bandwidth suggest potential, but the database cannot confirm any of that potential without actual benchmark results.

FAQ

Q: Which processor has better recorded benchmark performance?

A: The AMD Ryzen 7 8745HX has an average benchmark score of 60104 and ranks in the 92nd percentile among all CPUs. The Qualcomm Snapdragon X2E-78-100 has an average benchmark score of zero and no recorded individual benchmark scores, so no measured performance exists for comparison.

Q: How does the Ryzen 7 8745HX compare to its closest rivals?

A: The Ryzen 7 8745HX essentially matches the AMD Ryzen 9 7945HX with a zero percent delta, sits 0.2 percent ahead of the Intel Core i9-14900F, 0.8 percent ahead of the AMD Ryzen 9 7945HX3D, and 0.8 percent behind the Intel Xeon Gold 6338T based on average scores.

Q: What are the core and thread counts for each processor?

A: The AMD Ryzen 7 8745HX has 8 cores and 16 threads. The Qualcomm Snapdragon X2E-78-100 has 12 cores and 12 threads. The AMD chip supports simultaneous multithreading, while the Qualcomm chip does not.

Q: Which processor uses a more advanced manufacturing process?

A: The Qualcomm Snapdragon X2E-78-100 is manufactured on a 3 nanometer process at TSMC. The AMD Ryzen 7 8745HX uses a 5 nanometer process, also at TSMC. Both chips are fabricated by the same foundry, but at different process nodes.

Q: What memory types do the two processors support?

A: The AMD Ryzen 7 8745HX supports DDR5 memory with dual-channel configuration and 83.2 GB/s bandwidth. The Qualcomm Snapdragon X2E-78-100 supports LPDDR5X memory with dual-channel configuration and 152.4 GB/s bandwidth. Neither supports ECC memory.

Q: Are both processors unlocked for overclocking?

A: No. The AMD Ryzen 7 8745HX has an unlocked multiplier. The Qualcomm Snapdragon X2E-78-100 has a locked multiplier, meaning it does not support user-controlled overclocking through the multiplier.

Where Each One Wins

The AMD Ryzen 7 8745HX wins in every category where measured data exists. Its benchmark suite covers multithread performance at 31517, single-thread performance at 3879, and specialized workloads including integer math, floating point math, data compression, data encryption, extended instructions, prime number finding, physics, and random string sorting. The 92nd percentile ranking confirms that this processor outperforms the vast majority of CPUs in the database. The unlocked multiplier provides flexibility for users who want to push clock speeds beyond the listed 5.10 GHz boost, though the database does not include overclocked measurements.

The Qualcomm Snapdragon X2E-78-100 wins on several architectural specifications that could translate into performance advantages in specific scenarios. The 12-core configuration exceeds the AMD chip's 8 cores, which may benefit heavily parallel workloads if software can use all cores without multithreading overhead. The 3 nanometer process node represents a more advanced manufacturing technology than the 5 nanometer node, potentially offering better power efficiency per transistor. The base clock of 4.00 GHz is higher than the AMD part's 3.60 GHz base, which could improve performance in lightly threaded tasks that stay near base frequencies. The memory bandwidth of 152.4 GB/s is nearly double the AMD chip's 83.2 GB/s, which could benefit memory-intensive applications such as large dataset processing or integrated graphics workloads.

The LPDDR5X memory support may also favor the Qualcomm chip in power-constrained mobile environments, though the database does not include power measurements or efficiency figures. The larger die size of 220 square millimeters compared to 71 square millimeters suggests a more complex design with potentially more specialized hardware, though the database does not specify what that hardware does.

The Ryzen 7 8745HX has the advantage of an established release date in April 2025 and a part number of 100-000001851, indicating a mature product with recorded performance. The Snapdragon X2E-78-100 carries a future release date of April 2026 and part number X2E78100, meaning it may still be in the early stages of its product lifecycle.

Specification Differences

The database records the following differences between the AMD Ryzen 7 8745HX and the Qualcomm Snapdragon X2E-78-100:

The AMD chip has 8 cores and 16 threads, while the Qualcomm chip has 12 cores and 12 threads. Base clocks differ at 3.60 GHz for AMD and 4.00 GHz for Qualcomm. The AMD boost clock is 5.10 GHz; no boost clock is recorded for Qualcomm. The AMD TDP is listed at 55, while the Qualcomm TDP field is empty.

The AMD processor uses AMD Socket FL1, while the Qualcomm uses Qualcomm BGA 2343. The AMD architecture is Zen 4 with the Dragon Range codename; the Qualcomm architecture field is null, with the Glymur codename listed. The AMD generation is Ryzen 7 with Zen 4 and Dragon Range, while the Qualcomm generation is Snapdragon X2 with Elite.

The process node is 5 nanometers for AMD and 3 nanometers for Qualcomm, both from TSMC. The AMD transistor count is 6,570 million, while no transistor count is recorded for Qualcomm. Die size measures 71 square millimeters for AMD and 220 square millimeters for Qualcomm.

Cache configurations diverge significantly. The AMD L1 cache is 64 KB per core, L2 is 1 MB per core, and L3 is 32 MB shared. The Qualcomm L1 is 288 KB per core, L2 is 16 MB shared, and no L3 cache is recorded.

Memory support differs with DDR5 for AMD and LPDDR5X for Qualcomm. Both use dual-channel memory buses, but bandwidth measures 83.2 GB/s for AMD and 152.4 GB/s for Qualcomm. PCIe support is Gen 5 with 28 lanes for AMD and Gen 5 with 12 lanes for Qualcomm. Integrated graphics are Radeon 610M for AMD and Adreno X2-85 for Qualcomm.

The AMD multiplier is unlocked, while the Qualcomm multiplier is locked. Release dates are April 2025 for AMD and April 2026 for Qualcomm. Part numbers are 100-000001851 for AMD and X2E78100 for Qualcomm. The AMD series is listed as 8000 series, while no series is recorded for Qualcomm. Both processors are active production parts in the mobile market segment, neither supports ECC memory, and neither has a recorded launch MSRP.