AMD Ryzen 7 PRO 8840HS vs Qualcomm Snapdragon X1P-66-100 Comparison
AMD Ryzen 7 PRO 8840HS
Snapdragon X1P-66-100
PERFORMANCE BENCHMARKS
Analysis: AMD Ryzen 7 PRO 8840HS vs Qualcomm Snapdragon X1P-66-100
The Verdict
The database comparison between the AMD Ryzen 7 PRO 8840HS and the Qualcomm Snapdragon X1P-66-100 is one-sided in terms of available measurements. The AMD processor holds an 87th percentile ranking among all CPUs tracked in the database, while the Qualcomm part sits at the 50th percentile. The AMD chip also carries an average benchmark score of 39,603, whereas the Qualcomm processor has no recorded benchmark entries, resulting in an average score of zero.
The Ryzen 7 PRO 8840HS is the only one of the two with any recorded performance data. Its 8 cores and 16 threads allow it to handle parallel workloads, and its 5.10 GHz boost clock is substantially higher than the Qualcomm part's 4.00 GHz ceiling. The Snapdragon X1P-66-100 offers 10 cores and 10 threads, but without any benchmark results in the database, its real-world performance cannot be quantified. For any user relying on measured performance, the AMD processor is the only option with data to support a purchasing decision.
FAQ
Q: Which processor has a higher average benchmark score?
A: The AMD Ryzen 7 PRO 8840HS has an average benchmark score of 39,603. The Qualcomm Snapdragon X1P-66-100 has no recorded benchmark scores, giving it an average of zero.
Q: What are the core and thread counts for each processor?
A: The AMD Ryzen 7 PRO 8840HS has 8 cores and 16 threads. The Qualcomm Snapdragon X1P-66-100 has 10 cores and 10 threads.
Q: Which processor has a higher boost clock?
A: The AMD Ryzen 7 PRO 8840HS boosts to 5.10 GHz, while the Qualcomm Snapdragon X1P-66-100 boosts to 4.00 GHz.
Q: What is the TDP of each processor?
A: The AMD Ryzen 7 PRO 8840HS has a TDP of 28 watts. The Qualcomm Snapdragon X1P-66-100 has a TDP of 35 watts.
Q: What process node does each processor use?
A: Both processors are built on a 4 nm process node at TSMC.
Q: Does either processor support ECC memory?
A: The AMD Ryzen 7 PRO 8840HS supports ECC memory. The Qualcomm Snapdragon X1P-66-100 does not.
Architecture Differences
The AMD Ryzen 7 PRO 8840HS belongs to the 8000 series and uses the Zen 4 architecture under the Hawk Point codename. It is part of the Ryzen 7 generation, specifically Zen 4 (Hawk Point). The processor is manufactured by AMD on a 4 nm process at TSMC, with 25,000 million transistors on a 178 mm² die.
The Qualcomm Snapdragon X1P-66-100 uses the Oryon codename and belongs to the Snapdragon X (Plus) generation. Its manufacturer is listed as unknown, but it is also fabricated on a 4 nm process at TSMC. The database does not list transistor count or die size for this processor.
Cache layouts differ significantly. The AMD chip has 64 KB of L1 cache per core, 1 MB of L2 cache per core, and 16 MB of shared L3 cache. The Qualcomm part has 288 KB of L1 cache per core, 12 MB of L2 cache per module, and 6 MB of shared L3 cache. The larger per-core L1 and per-module L2 on the Qualcomm side suggest a different cache hierarchy design, but the AMD processor's larger shared L3 cache may benefit workloads that repeatedly access a common data set.
Both processors feature integrated graphics. The AMD Ryzen 7 PRO 8840HS carries the Radeon 780M, while the Qualcomm Snapdragon X1P-66-100 uses the Adreno X1-85.
Specification Differences
The two processors differ across several specification fields. The AMD Ryzen 7 PRO 8840HS has 8 cores and 16 threads, whereas the Qualcomm Snapdragon X1P-66-100 has 10 cores and 10 threads. Base clocks are close: 3.30 GHz for AMD versus 3.40 GHz for Qualcomm. Boost clocks diverge sharply: 5.10 GHz for AMD versus 4.00 GHz for Qualcomm.
TDP also differs. The AMD part draws 28 watts, the Qualcomm part draws 35 watts.
Memory support is distinct. The AMD processor supports DDR5 memory with dual-channel configuration and 89.6 GB/s of memory bandwidth. The Qualcomm processor supports LPDDR5X memory, also dual-channel, with 135.2 GB/s of memory bandwidth. ECC memory is supported on the AMD chip but not on the Qualcomm chip.
PCIe lanes differ as well. The AMD Ryzen 7 PRO 8840HS provides Gen 4 with 20 lanes (CPU only). The Qualcomm Snapdragon X1P-66-100 provides Gen 4 with 12 lanes (CPU only).
Sockets are different: the AMD part uses AMD Socket FP7, while the Qualcomm part uses Qualcomm BGA 2073.
Neither processor has a recorded launch MSRP in the database. Both are listed as active in production. The AMD release date is 2024-04-15, and the Qualcomm release date is 2024-04-23.
Head-to-Head Benchmarks
The database contains no head-to-head benchmark entries for this pairing, and the Qualcomm Snapdragon X1P-66-100 has no individual benchmark scores recorded. The AMD Ryzen 7 PRO 8840HS, however, has a full set of measured results across Cinebench and PassMark tests.
In Cinebench R23 multicore, the AMD processor scores 14,784. In Cinebench R23 single-core, it scores 1,724. Cinebench R15 results show 2,458 in multicore and 271.5 in single-core.
PassMark results for the AMD chip include: data compression at 311,199, data encryption at 18,838, extended instructions at 22,298, find prime numbers at 84, floating point math at 55,739, integer math at 93,342, multithread at 26,646, physics at 1,351, random string sorting at 37,922, and single thread at 3,692.
The nearest rivals for the AMD Ryzen 7 PRO 8840HS provide context for its average score of 39,603. The AMD Ryzen AI 7 450 scores 39,485, which is 0.3 percent lower. The AMD Ryzen 7 9800X3D scores 39,768, which is 0.4 percent higher. The AMD Ryzen 7 PRO 8845HS scores 39,325, which is 0.7 percent lower. The AMD EPYC 4245P scores 39,215, which is 1 percent lower. These deltas are small, indicating the 8840HS sits in a tight cluster of comparable AMD processors.
Since the Qualcomm part has no benchmark scores, no direct comparison of performance deltas is possible. The percentile fields tell the broader story: the AMD chip ranks at the 87th percentile of all CPUs, while the Qualcomm chip ranks at the 50th percentile.
Where Each One Wins
The AMD Ryzen 7 PRO 8840HS wins in every category where data exists. Its 16 threads provide simultaneous multithreading, which the Qualcomm part lacks with its 10 threads and 10 threads configuration. The AMD chip's 5.10 GHz boost clock exceeds the Qualcomm part's 4.00 GHz boost clock by 1.10 GHz, a substantial margin for single-threaded responsiveness.
The AMD processor also has a lower TDP at 28 watts versus 35 watts, which may matter for thermal management in thin laptops. Its 20 PCIe Gen 4 lanes double the Qualcomm part's 12 lanes, offering more bandwidth for expansion devices. ECC memory support on the AMD side is another differentiator for reliability-sensitive use cases.
The Qualcomm Snapdragon X1P-66-100 does have advantages in raw specifications. Its 10 cores outnumber the AMD chip's 8 cores. Its LPDDR5X memory support provides 135.2 GB/s of memory bandwidth, which is 45.6 GB/s higher than the AMD chip's 89.6 GB/s. The Qualcomm part also has a higher base clock at 3.40 GHz versus 3.30 GHz. Its larger per-core L1 cache at 288 KB and per-module L2 cache at 12 MB could benefit certain access patterns.
However, without any benchmark scores in the database, these specification advantages remain unverified in measured performance. The Qualcomm part's 50th percentile ranking and zero average benchmark score mean the database cannot confirm any workload where it outperforms the AMD chip. The AMD Ryzen 7 PRO 8840HS is the only processor in this comparison with validated results, and those results place it in the 87th percentile of all CPUs.
For workloads that depend on high single-thread speed, the AMD chip's 5.10 GHz boost clock and measured single-thread score of 3,692 in PassMark indicate strong performance. For heavily threaded applications, the AMD chip's 16 threads and Cinebench R23 multicore score of 14,784 show solid scaling. The Qualcomm part's strengths, if any, would need to come from its higher core count and memory bandwidth, but the database currently provides no measurements to support such a claim.