CPU Comparison

AMD
AMD

AMD Ryzen 9 3900

CORE STATE Matisse
CORE SPECS 12 Cores / 24 Threads
CLOCK SPEED 3.1 Base / 4.3 GHz Turbo
CACHE 64 MB
MAX TDP 65W
ARCHITECTURE Zen 2
nm
PROCESS 7 nm
LAUNCH DATE 2019
VS
Intel
INTEL

Xeon 654

CORE STATE Granite Rapids
CORE SPECS 18 Cores / 36 Threads
CLOCK SPEED 3.1 Base / 4.8 GHz Turbo
CACHE 72 MB (shared)
MAX TDP 200W
ARCHITECTURE Granite Rapids
nm
PROCESS 5 nm
LAUNCH DATE 2026

PERFORMANCE BENCHMARKS

cinebench_cinebench_r15_multicore
2,619
5,256
cinebench_cinebench_r15_singlecore
369
742
cinebench_cinebench_r20_multicore
10,914
21,903
cinebench_cinebench_r20_singlecore
1,540
3,092
cinebench_cinebench_r23_multicore
25,988
52,150
cinebench_cinebench_r23_singlecore
3,669
7,362
passmark_data_compression
413,887
818,902
passmark_data_encryption
26,657
40,675
passmark_extended_instructions
26,073
63,539
passmark_find_prime_numbers
203
390
passmark_floating_point_math
56,730
163,093
passmark_integer_math
97,698
207,745
passmark_multithread
30,586
61,353
passmark_physics
1,617
5,596
passmark_random_string_sorting
44,902
82,828
passmark_single_thread
2,604
3,778
passmark_singlethread
2,604
3,778

DETAILED SPECIFICATIONS

SPECIFICATION
9 3900
654
Core Specs
Cores
12
18 +50.0%
Threads
24
36 +50.0%
Base Clock (GHz)
3.1
3.1 0.0%
Boost Clock (GHz)
4.3
4.8 +11.6%
Frequency (GHz)
3.1
3.1 0.0%
Turbo Clock (GHz)
4.3
4.8 +11.6%
Multiplier
31
31 0.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
64 KB (per core)
112 KB (per core)
L2 Cache
512 KB (per core)
2 MB (per core)
L3 Cache
64 MB
72 MB (shared)
Power
TDP (W)
65
200 +207.7%
PPT
88 W
Architecture
Architecture
Zen 2
Granite Rapids
Codename
Matisse
Granite Rapids
Generation
Ryzen 9 (Zen 2 (Matisse))
Xeon 600 (Granite Rapids-WS)
Process Size
7 nm
5 nm
Transistors
7,600 million
Die Size
2x 74 mm²
2x 598 mm²
Foundry
TSMC
Intel
Memory
Memory Support
DDR4
DDR5
Memory Bus
Dual-channel
Eight-channel
Memory Bandwidth
51.2 GB/s
409.6 GB/s
ECC Memory
No
Yes
Platform
Socket
AMD Socket AM4
Intel Socket 4710
Chipsets
A300, X300, A320, B350, X370, B450, X470, A520, B550, X570
W890
PCIe
Gen 4, 24 Lanes(CPU only)
Gen 5, 128 Lanes(CPU only)
AMD Multi-Die
IO Process Size
12 nm
10 nm
Interconnect
CXL
Gen 2.0 (Shared with PCI-E)
Other
Market
Desktop
Server/Workstation
Production Status
Active
Active
Launch Price
$499
$1199
Part Number
100-000000070
SA2DP
Package
µOPGA-1331
FC-LGA18N
Tj Max
95°C
96°C
Bundled Cooler
None
View Ryzen 9 3900 Details View Xeon 654 Details