Intel Processor N250 vs Qualcomm Snapdragon X2E-78-100 Comparison

Intel
INTEL

Intel Processor N250

CORE STATE Twin Lake
CORE SPECS 4 Cores / 4 Threads
CLOCK SPEED 0.1 Base / 3.8 GHz Turbo
CACHE 6 MB (shared)
MAX TDP 6W
ARCHITECTURE Twin Lake
nm
PROCESS 10 nm
LAUNCH DATE 2025
VS
Unknown
CPU

Snapdragon X2E-78-100

CORE STATE Glymur
CORE SPECS 12 Cores / 12 Threads
CLOCK SPEED 4 Base
CACHE
MAX TDP
ARCHITECTURE Glymur
nm
PROCESS 3 nm
LAUNCH DATE 2026

Analysis: Intel Processor N250 vs Qualcomm Snapdragon X2E-78-100

FAQ

Q: What are the core and thread counts for the Intel Processor N250 and the Qualcomm Snapdragon X2E-78-100?

A: The Intel Processor N250 has 4 cores and 4 threads, while the Qualcomm Snapdragon X2E-78-100 has 12 cores and 12 threads.

Q: Which processor has a higher base clock speed?

A: The Qualcomm Snapdragon X2E-78-100 has a base clock of 4.00 GHz, while the Intel Processor N250 has a base clock of 0.10 GHz. The Intel part compensates with a boost clock of 3.80 GHz, whereas the Snapdragon's boost clock is not listed.

Q: What process nodes are used by each processor?

A: The Intel Processor N250 is manufactured on a 10 nm process at Intel, while the Qualcomm Snapdragon X2E-78-100 is built on a 3 nm process at TSMC.

Q: How much L3 cache does the Intel Processor N250 have compared to the Qualcomm Snapdragon X2E-78-100?

A: The Intel Processor N250 includes 6 MB of shared L3 cache. The Qualcomm Snapdragon X2E-78-100 does not have a listed L3 cache, but it does have a larger shared L2 cache of 16 MB versus the Intel part's 2 MB.

Q: What memory types and bandwidth do these processors support?

A: The Intel Processor N250 supports DDR4, DDR5, and LPDDR5 with a single-channel memory bus and 38.4 GB/s bandwidth. The Qualcomm Snapdragon X2E-78-100 supports LPDDR5X with a dual-channel memory bus and 152.4 GB/s bandwidth.

Q: When were these processors released?

A: The Intel Processor N250 was released on 2025-01-06, and the Qualcomm Snapdragon X2E-78-100 was released on 2026-04-05.

Architecture Differences

The two processors represent fundamentally different design philosophies. The Intel Processor N250 is a 4-core, 4-thread part based on the Twin Lake architecture, which belongs to the Alder Lake-N generation. It uses a 10 nm process fabricated by Intel. The Qualcomm Snapdragon X2E-78-100, codenamed Glymur, is a 12-core, 12-thread processor from the Snapdragon X2 Elite generation, built on a 3 nm process at TSMC. The process node difference alone indicates a significant generational gap in manufacturing technology.

Cache hierarchies diverge sharply. The Intel N250 allocates 96 KB of L1 cache per core, with 2 MB of shared L2 and 6 MB of shared L3. The Snapdragon X2E-78-100 provides 288 KB of L1 per core, a much larger 16 MB of shared L2, and no listed L3. The larger per-core L1 and shared L2 on the Qualcomm part suggest a design aimed at feeding 12 high-speed cores, whereas the Intel part relies on a smaller L3 to supplement its modest four-core configuration.

Memory architecture also separates the two. The Intel N250 supports DDR4, DDR5, and LPDDR5 across a single-channel bus, delivering 38.4 GB/s of memory bandwidth. The Snapdragon X2E-78-100 supports only LPDDR5X, but uses a dual-channel bus that quadruples bandwidth to 152.4 GB/s. This fourfold difference in memory bandwidth is a direct consequence of the core count and memory controller design.

PCIe connectivity differs as well. The Intel N250 offers PCIe Gen 3 with 9 lanes (CPU only), while the Snapdragon X2E-78-100 provides PCIe Gen 5 with 12 lanes (CPU only). The newer PCIe generation and additional lanes on the Qualcomm part enable faster peripheral and storage connectivity. Integrated graphics also differ: the Intel N250 uses UHD Graphics 730, while the Snapdragon X2E-78-100 uses Adreno X2-85.

The physical packaging reflects their respective platforms. The Intel N250 uses Intel BGA 1264, while the Snapdragon X2E-78-100 uses Qualcomm BGA 2343. The Snapdragon die is measured at 220 mm², a figure not recorded for the Intel part. Both processors are active in production, target the mobile market, and lack an unlocked multiplier. Neither supports ECC memory.

Head-to-Head Benchmarks

The recorded data contains no benchmark scores for either processor. The average benchmark score for both the Intel Processor N250 and the Qualcomm Snapdragon X2E-78-100 is zero, and the head-to-head benchmark list is empty. The wins count for each side is zero as well. The percentile versus all CPUs is identical for both at 50, placing them at the median of the database's CPU distribution, but this is a relative rank, not a measured performance result.

Given the absence of direct benchmark measurements, the comparison must rely on architectural specifications. The Snapdragon X2E-78-100 has three times the core count and three times the thread count of the Intel N250. Its base clock of 4.00 GHz is substantially higher than the Intel part's 0.10 GHz base, although the Intel N250's boost clock reaches 3.80 GHz. The Snapdragon's 16 MB of shared L2 is eight times larger than the Intel N250's 2 MB, and its L1 per core is three times larger. Memory bandwidth favors the Snapdragon by a factor of four, at 152.4 GB/s versus 38.4 GB/s.

The Intel N250 counters with a smaller process footprint in terms of transistor budget, but that advantage is not quantified in the data. It also has a listed L3 cache of 6 MB, a feature absent from the Snapdragon's recorded specifications. The Intel part's boost clock of 3.80 GHz is close to the Snapdragon's base clock of 4.00 GHz, suggesting that single-core frequency potential is comparable, though the Snapdragon maintains that frequency across all 12 cores at base.

These specification gaps indicate that the Snapdragon X2E-78-100 is positioned to dominate multi-threaded workloads, memory-intensive tasks, and PCIe Gen 5 device connectivity. The Intel N250, with its lower core count and older PCIe generation, is a more limited part in terms of raw throughput. Without benchmark scores, the database cannot assign a definitive win to either processor, but the architectural data points strongly in one direction.

The Verdict

The data shows a clear separation in capability. The Qualcomm Snapdragon X2E-78-100 holds the advantage in core count, thread count, base clock, process node, L1 and L2 cache, memory bandwidth, memory bus width, and PCIe generation. The Intel Processor N250 offers a boost clock, an L3 cache, and support for DDR4 and DDR5 memory, but these features do not close the gap in raw processing potential.

For workloads that scale with cores and threads, the Snapdragon X2E-78-100 is the obvious choice. Its 12 cores and 12 threads triple the parallelism of the Intel N250. For memory-intensive applications, the Snapdragon's 152.4 GB/s of bandwidth and dual-channel bus provide a fourfold advantage over the Intel part's 38.4 GB/s. The 3 nm process at TSMC versus Intel's 10 nm process also indicates a more advanced manufacturing foundation.

The Intel N250 is not without merit. Its 3.80 GHz boost clock approaches the Snapdragon's base clock, which may help in lightly threaded scenarios where frequency matters. Its 6 MB of L3 cache could benefit workloads with repeated data access patterns. The support for DDR4 and DDR5 gives system designers flexibility, although the single-channel bus limits the practical benefit.

The database records no benchmark scores, so the verdict rests on specifications. The Snapdragon X2E-78-100 is the stronger processor on nearly every measurable dimension. The Intel N250 is a lower-specification part suited to simpler tasks, but it cannot match the Snapdragon's multi-core and memory capabilities.

Specification Differences

The following fields differ between the Intel Processor N250 and the Qualcomm Snapdragon X2E-78-100:

  • Cores: 4 (Intel) vs 12 (Qualcomm)
  • Threads: 4 (Intel) vs 12 (Qualcomm)
  • Base clock: 0.10 GHz (Intel) vs 4.00 GHz (Qualcomm)
  • Boost clock: 3.80 GHz (Intel) vs not listed (Qualcomm)
  • Socket: Intel BGA 1264 (Intel) vs Qualcomm BGA 2343 (Qualcomm)
  • Codename: Twin Lake (Intel) vs Glymur (Qualcomm)
  • Generation: Intel Processor (Alder Lake-N) (Intel) vs Snapdragon X2 (Elite) (Qualcomm)
  • Process node: 10 nm (Intel) vs 3 nm (Qualcomm)
  • Foundry: Intel (Intel) vs TSMC (Qualcomm)
  • Die size: not listed (Intel) vs 220 mm² (Qualcomm)
  • L1 cache: 96 KB per core (Intel) vs 288 KB per core (Qualcomm)
  • L2 cache: 2 MB shared (Intel) vs 16 MB shared (Qualcomm)
  • L3 cache: 6 MB shared (Intel) vs not listed (Qualcomm)
  • Memory support: DDR4, DDR5, LPDDR5 (Intel) vs LPDDR5X (Qualcomm)
  • Memory bus: Single-channel (Intel) vs Dual-channel (Qualcomm)
  • Memory bandwidth: 38.4 GB/s (Intel) vs 152.4 GB/s (Qualcomm)
  • PCIe: Gen 3, 9 Lanes (Intel) vs Gen 5, 12 Lanes (Qualcomm)
  • Integrated graphics: UHD Graphics 730 (Intel) vs Adreno X2-85 (Qualcomm)
  • Release date: 2025-01-06 (Intel) vs 2026-04-05 (Qualcomm)
  • Part number: SRPNS (Intel) vs X2E78100 (Qualcomm)

Fields that match include TDP (6 for Intel, not listed for Qualcomm), ECC memory support (false for both), market segment (Mobile for both), production status (Active for both), multiplier unlocked (false for both), and manufacturer for the Qualcomm part is listed as Unknown.

Where Each One Wins

The Qualcomm Snapdragon X2E-78-100 wins in multi-threaded processing. Its 12 cores and 12 threads provide three times the parallelism of the Intel N250. The 4.00 GHz base clock across all cores means sustained multi-core throughput is far higher than the Intel part's 0.10 GHz base, even if the Intel N250 can boost one core to 3.80 GHz.

The Snapdragon wins in memory-heavy workloads. The 152.4 GB/s bandwidth and dual-channel LPDDR5X support outclass the Intel N250's 38.4 GB/s single-channel configuration. Applications that stream large datasets, such as media processing or data analytics, will favor the Snapdragon.

The Snapdragon wins in cache-sensitive scenarios. Its 16 MB shared L2 and 288 KB per-core L1 dwarf the Intel N250's 2 MB L2 and 96 KB per-core L1. The larger caches reduce reliance on main memory, which further amplifies the bandwidth advantage.

The Snapdragon wins in connectivity. PCIe Gen 5 with 12 lanes supports faster NVMe storage and external devices than the Intel N250's PCIe Gen 3 with 9 lanes. The newer standard doubles the theoretical transfer rate per lane.

The Intel N250 wins in single-thread boost frequency. Its 3.80 GHz boost clock is close to the Snapdragon's 4.00 GHz base, and the Intel part may reach that boost on a single core for lightly threaded tasks. The Snapdragon's boost clock is not listed, so the Intel N250 has a recorded frequency advantage in this specific scenario.

The Intel N250 wins in L3 cache availability. Its 6 MB shared L3 is a listed feature, whereas the Snapdragon has no recorded L3. Workloads that rely on a third-level cache for shared data may see a benefit from the Intel part.

The Intel N250 wins in memory type flexibility. It supports DDR4, DDR5, and LPDDR5, offering system designers more choices. The Snapdragon is limited to LPDDR5X, which is a single memory standard.

The Intel N250 also has a lower TDP at 6 watts, although the Snapdragon's TDP is not listed. For power-sensitive mobile designs, the Intel part's recorded TDP provides a concrete figure, while the Snapdragon's absence of a TDP leaves that comparison open.

DETAILED SPECIFICATIONS

SPECIFICATION
Processor N250
Snapdragon X2E-78-100
Core Specs
Cores
4
12 +200.0%
Threads
4
12 +200.0%
Base Clock (GHz)
0.1
4 +3900.0%
Boost Clock (GHz)
3.8
Frequency (GHz)
0.1
4 +3900.0%
Turbo Clock (GHz)
3.8
Multiplier
1
40 +3900.0%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
96 KB (per core)
288 KB (per core)
L2 Cache
2 MB (shared)
16 MB (shared)
L3 Cache
6 MB (shared)
Power
TDP (W)
6
Architecture
Architecture
Twin Lake
Codename
Twin Lake
Glymur
Generation
Intel Processor (Alder Lake-N)
Snapdragon X2 (Elite)
Process Size
10 nm
3 nm
Die Size
220 mm²
Foundry
Intel
TSMC
Memory
Memory Support
DDR4, DDR5, LPDDR5
LPDDR5X
Memory Bus
Single-channel
Dual-channel
Memory Bandwidth
38.4 GB/s
152.4 GB/s
ECC Memory
No
No
DDR4 Speed
3200 MT/s
Platform
Socket
Intel BGA 1264
Qualcomm BGA 2343
PCIe
Gen 3, 9 Lanes(CPU only)
Gen 5, 12 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
6 + 6
E-Core Frequency
3.4 GHz
AI/NPU
NPU
Yes / 80 TOPS
Graphics
Integrated Graphics
UHD Graphics 730
Adreno X2-85
Other
Market
Mobile
Mobile
Production Status
Active
Active
Part Number
SRPNS
X2E78100
Package
FC-BGA16F
FC-BGA
Tj Max
105°C
View Processor N250 Details View Snapdragon X2E-78-100 Details