Intel Processor 300 vs Qualcomm Snapdragon X2E-94-100 Comparison

Intel
INTEL

Intel Processor 300

CORE STATE Raptor Lake-S
CORE SPECS 2 Cores / 4 Threads
CLOCK SPEED 3.9 Base
CACHE 6 MB (shared)
MAX TDP 46W
ARCHITECTURE Raptor Lake
nm
PROCESS 10 nm
LAUNCH DATE 2024
VS
Unknown
CPU

Snapdragon X2E-94-100

CORE STATE Glymur
CORE SPECS 18 Cores / 18 Threads
CLOCK SPEED 4.45 Base / 4.7 GHz Turbo
CACHE 9 MB (shared)
MAX TDP
ARCHITECTURE Glymur
nm
PROCESS 3 nm
LAUNCH DATE 2026

Analysis: Intel Processor 300 vs Qualcomm Snapdragon X2E-94-100

Head-to-Head Benchmarks

The database contains no recorded head-to-head benchmark results for the Intel Processor 300 and the Qualcomm Snapdragon X2E-94-100. Both processors have zero entries in the head-to-head benchmark table, and neither shows a win count in direct comparisons. The absence of measured data means no exact performance deltas can be cited between these two parts from the recorded measurements.

The Intel Processor 300 holds a 50th percentile ranking among all CPUs in the database, with an average benchmark score of zero. The Qualcomm Snapdragon X2E-94-100 also holds a 50th percentile ranking with an average benchmark score of zero. These identical percentile positions reflect the lack of recorded scores rather than any meaningful performance parity, as zero benchmark data exists for either processor.

Where Each One Wins

Without benchmark scores, wins must be inferred from the architectural and specification differences recorded in the database. The Intel Processor 300 is a desktop part with 2 cores and 4 threads, base clock of 3.90 GHz, and no boost clock listed. It uses the Intel Socket 1700 platform and targets the desktop market segment. The Qualcomm Snapdragon X2E-94-100 is a mobile processor with 18 cores and 18 threads, a base clock of 4.45 GHz, and a boost clock of 4.70 GHz. It uses the Qualcomm BGA 2343 socket and targets the mobile market segment.

The Qualcomm part wins decisively on core count and thread count, offering 18 cores versus 2, and 18 threads versus 4. It also has a higher base clock, 4.45 GHz versus 3.90 GHz, and a boost clock of 4.70 GHz that the Intel part lacks entirely. The Snapdragon X2E-94-100 supports LPDDR5X memory with a triple-channel memory bus and a recorded memory bandwidth of 228.6 GB/s. The Intel Processor 300 supports DDR4 and DDR5 memory with a dual-channel memory bus, but no memory bandwidth figure is recorded in the database.

The Intel Processor 300 offers 16 PCIe Gen 5 lanes from the CPU, while the Qualcomm part offers 12 PCIe Gen 5 lanes. The Intel part integrates UHD Graphics 710, while the Qualcomm part integrates Adreno X2-90 graphics. The Intel Processor 300 has a recorded TDP of 46, while the Qualcomm Snapdragon X2E-94-100 has no TDP field recorded. The Intel part has a launch MSRP of $82; the Qualcomm part has no launch MSRP recorded.

Architecture Differences

The Intel Processor 300 is built on the Raptor Lake architecture, specifically the Raptor Lake-S codename, and belongs to the Intel Processor (Raptor Lake) generation. It uses a 10 nm process node fabricated by Intel. The die size is recorded as 163 mm². The Qualcomm Snapdragon X2E-94-100 uses the Glymur codename and belongs to the Snapdragon X2 (Elite) generation. It is built on a 3 nm process node fabricated by TSMC, with a die size of 220 mm². The architecture field for the Qualcomm part is null, meaning no specific architecture name is recorded beyond the codename and generation.

Cache structures differ substantially. The Intel Processor 300 has 80 KB of L1 cache per core, 1.25 MB of L2 cache per core, and 6 MB of shared L3 cache. The Qualcomm Snapdragon X2E-94-100 has 288 KB of L1 cache per core, 16 MB of L2 cache per module, and 9 MB of shared L3 cache. The Qualcomm part's L2 cache is organized per module rather than per core, reflecting its larger core cluster design. Neither part records a total L3 cache figure or a v-cache option.

Memory architecture diverges clearly. The Intel Processor 300 uses dual-channel memory with DDR4 and DDR5 support. The Qualcomm Snapdragon X2E-94-100 uses triple-channel memory with LPDDR5X support and a recorded memory bandwidth of 228.6 GB/s. Both parts have ECC memory support marked as false. The Intel part uses a Gen 5 PCIe implementation with 16 CPU lanes; the Qualcomm part uses Gen 5 PCIe with 12 CPU lanes.

The integrated graphics differ: Intel uses UHD Graphics 710, while Qualcomm uses Adreno X2-90. The Intel Processor 300 is a desktop part with a 46 TDP and a launch MSRP of $82. The Qualcomm part is a mobile part with no TDP and no launch MSRP recorded. The Intel part has a part number of SRN3J; the Qualcomm part has a part number of X2E94100.

FAQ

Q: Which processor has more cores?

A: The Qualcomm Snapdragon X2E-94-100 has 18 cores, while the Intel Processor 300 has 2 cores.

Q: What is the base clock difference between the two?

A: The Intel Processor 300 has a base clock of 3.90 GHz, while the Qualcomm Snapdragon X2E-94-100 has a base clock of 4.45 GHz. The Qualcomm part also has a boost clock of 4.70 GHz, while the Intel part has no boost clock recorded.

Q: How do the cache sizes compare?

A: The Intel Processor 300 has 80 KB L1 per core, 1.25 MB L2 per core, and 6 MB shared L3. The Qualcomm Snapdragon X2E-94-100 has 288 KB L1 per core, 16 MB L2 per module, and 9 MB shared L3.

Q: Which processor supports more memory channels?

A: The Qualcomm Snapdragon X2E-94-100 supports triple-channel memory, while the Intel Processor 300 supports dual-channel memory.

Q: What is the memory bandwidth of the Qualcomm part?

A: The Qualcomm Snapdragon X2E-94-100 has a recorded memory bandwidth of 228.6 GB/s. No memory bandwidth is recorded for the Intel Processor 300.

Q: Are both processors unlocked for overclocking?

A: No. Both the Intel Processor 300 and the Qualcomm Snapdragon X2E-94-100 have multiplierUnlocked set to false.

Q: Which processor has a smaller process node?

A: The Qualcomm Snapdragon X2E-94-100 uses a 3 nm process node fabricated by TSMC, while the Intel Processor 300 uses a 10 nm process node fabricated by Intel.

Q: What is the release date for each?

A: The Intel Processor 300 was released on 2024-01-07. The Qualcomm Snapdragon X2E-94-100 was released on 2026-04-05.

The Verdict

The recorded data shows two processors designed for entirely different market segments with no overlapping benchmark measurements. The Intel Processor 300 is a 2-core desktop part with a 46 TDP, a 10 nm Intel process, dual-channel DDR4/DDR5 support, and a launch MSRP of $82. The Qualcomm Snapdragon X2E-94-100 is an 18-core mobile part with a 3 nm TSMC process, triple-channel LPDDR5X support, 228.6 GB/s memory bandwidth, and no launch MSRP recorded.

For workloads that scale with core count, the Qualcomm Snapdragon X2E-94-100 holds a clear structural advantage: 18 cores versus 2, 18 threads versus 4, a higher base clock, and a boost clock that the Intel part lacks. The Qualcomm part also has substantially larger L2 and L3 caches, plus a higher memory bandwidth. The Intel Processor 300 offers more PCIe lanes from the CPU (16 versus 12), a desktop socket, and a recorded TDP of 46, which indicates a power envelope suited for desktop use.

The data does not support a performance verdict for either part in direct comparison, because no benchmark scores are recorded. The Intel Processor 300 is the appropriate choice for a desktop build that needs a simple, low-core-count processor on Socket 1700. The Qualcomm Snapdragon X2E-94-100 is the appropriate choice for a mobile platform that requires many cores, high memory bandwidth, and a smaller process node. Users selecting between these two should base the decision on platform and core-count requirements, as no measured performance data exists to differentiate them further.

Specification Differences

| Specification | Intel Processor 300 | Qualcomm Snapdragon X2E-94-100 |

| --- | --- | --- |

| Cores | 2 | 18 |

| Threads | 4 | 18 |

| Base Clock | 3.90 GHz | 4.45 GHz |

| Boost Clock | null | 4.70 GHz |

| TDP | 46 | null |

| Socket | Intel Socket 1700 | Qualcomm BGA 2343 |

| Architecture | Raptor Lake | null |

| Codename | Raptor Lake-S | Glymur |

| Generation | Intel Processor (Raptor Lake) | Snapdragon X2 (Elite) |

| Process Node | 10 nm | 3 nm |

| Foundry | Intel | TSMC |

| Die Size | 163 mm² | 220 mm² |

| L1 Cache | 80 KB (per core) | 288 KB (per core) |

| L2 Cache | 1.25 MB (per core) | 16 MB (per module) |

| L3 Cache | 6 MB (shared) | 9 MB (shared) |

| Memory Support | DDR4, DDR5 | LPDDR5X |

| Memory Bus | Dual-channel | Triple-channel |

| Memory Bandwidth | null | 228.6 GB/s |

| ECC Memory | false | false |

| PCIe | Gen 5, 16 Lanes (CPU only) | Gen 5, 12 Lanes (CPU only) |

| Integrated Graphics | UHD Graphics 710 | Adreno X2-90 |

| Market Segment | Desktop | Mobile |

| Production Status | Active | Active |

| Release Date | 2024-01-07 | 2026-04-05 |

| Launch MSRP | $82 | null |

| Multiplier Unlocked | false | false |

| Part Number | SRN3J | X2E94100 |

DETAILED SPECIFICATIONS

SPECIFICATION
Processor 300
Snapdragon X2E-94-100
Core Specs
Cores
2
18 +800.0%
Threads
4
18 +350.0%
Base Clock (GHz)
3.9
4.45 +14.1%
Boost Clock (GHz)
4.7
Frequency (GHz)
3.9
4.45 +14.1%
Turbo Clock (GHz)
4.7
Multiplier
39
44.5 +14.1%
SMP CPUs
1
1 0.0%
Cache
L1 Cache
80 KB (per core)
288 KB (per core)
L2 Cache
1.25 MB (per core)
16 MB (per module)
L3 Cache
6 MB (shared)
9 MB (shared)
Power
TDP (W)
46
PL1
46 W
PL2
46 W
Architecture
Architecture
Raptor Lake
Codename
Raptor Lake-S
Glymur
Generation
Intel Processor (Raptor Lake)
Snapdragon X2 (Elite)
Process Size
10 nm
3 nm
Die Size
163 mm²
220 mm²
Foundry
Intel
TSMC
Memory
Memory Support
DDR4, DDR5
LPDDR5X
Memory Bus
Dual-channel
Triple-channel
Memory Bandwidth
228.6 GB/s
ECC Memory
No
No
DDR4 Speed
3200 MT/s
DDR5 Speed
4800 MT/s
Platform
Socket
Intel Socket 1700
Qualcomm BGA 2343
Chipsets
Intel 600 Series, Intel 700 Series
PCIe
Gen 5, 16 Lanes(CPU only)
Gen 5, 12 Lanes(CPU only)
Intel Hybrid
Hybrid Cores
12 + 6
E-Core Frequency
3.6 GHz
AI/NPU
NPU
Yes / 80 TOPS
Graphics
Integrated Graphics
UHD Graphics 710
Adreno X2-90
Other
Market
Desktop
Mobile
Production Status
Active
Active
Launch Price
$82
Part Number
SRN3J
X2E94100
Package
FC-LGA16A
FC-BGA
Tj Max
100°C
Bundled Cooler
Laminar RM1
View Processor 300 Details View Snapdragon X2E-94-100 Details